| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
|---|
| 10/11/2005 | US6953753 Method for manufacturing semiconductor device |
| 10/11/2005 | US6953751 Micro device and process for producing it |
| 10/11/2005 | US6952965 Vertical MEMS gyroscope by horizontal driving |
| 10/06/2005 | WO2005093775A1 Method for forming carbonaceous material protrusion and carbonaceous material protrusion |
| 10/06/2005 | WO2005093009A1 Etched dielectric film in microfluidic devices |
| 10/06/2005 | WO2005092785A1 Slotted forming methods and fluid ejecting device |
| 10/06/2005 | WO2005092784A1 Synthesis of platinum and palladium quantum well size nano-particles |
| 10/06/2005 | WO2005017623A3 $m(c)method for producing inclined flank patterns by photolithography |
| 10/06/2005 | US20050221577 Method for modifying existing micro-and nano-structures using a near-field scanning optical microscope |
| 10/06/2005 | US20050221529 Complex microdevices and apparatus and methods for fabricating such devices |
| 10/06/2005 | US20050221528 Microelectronic mechanical system and methods |
| 10/06/2005 | US20050219017 Electrostatic actuator |
| 10/06/2005 | DE19961331B4 Federartiger Kupferfaserkörper und Verfahren zur Herstellung desselben Copper spring-like fiber body and method of manufacturing the same |
| 10/06/2005 | DE102004013816A1 Verfahren zum Herstellen eines Sensormoduls und Sensormodul A method of manufacturing a sensor module and sensor module |
| 10/06/2005 | DE102004011145A1 Microphone e.g. semiconductor-condenser microphone, for use in mobile phone, has membrane structure with boundary region, which is not movable due to pressure, on which carrier is attached, where region and opposing structure have recesses |
| 10/06/2005 | CA2557714A1 Lens array and method for making same |
| 10/05/2005 | EP1583104A2 Nanometric mechanical oscillator, method of fabricating the same, and measurement apparatus using the same |
| 10/05/2005 | EP1582500A2 Dissipation of a charge buildup on a wafer portion |
| 10/05/2005 | EP1582499A2 Encapsulation wafer process |
| 10/05/2005 | EP1581967A1 Creation of hermetically sealed, dielectrically isolating trenches |
| 10/05/2005 | EP1581748A1 Method for maskless fabrication of self-aligned structures comprising a metal oxide |
| 10/05/2005 | CN1679140A Conductive etch stop for etching a sacrificial layer |
| 10/05/2005 | CN1678398A Microfluidic apparatus with integrated porous-substrates/sensor for real-time biochemical molecule detection |
| 10/05/2005 | CN1677706A Method and means for isolating elements of a sensor array |
| 10/05/2005 | CN1677686A Micro-switching device and method of manufacturing micro-switching device |
| 10/05/2005 | CN1221832C Optical scanning head and its making process |
| 10/04/2005 | US6952042 Microelectromechanical device with integrated conductive shield |
| 10/04/2005 | US6951824 Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method |
| 10/04/2005 | US6951769 Method for stripping sacrificial layer in MEMS assembly |
| 10/04/2005 | US6951768 Single crystal, dual wafer, tunneling sensor or switch with substrate protrusion and a method of making same |
| 10/04/2005 | US6951380 methacrylic copolymer composite is formed by radical polymerization, thermally crosslinked; head is inexpensive, accurate, and highly reliable |
| 09/29/2005 | WO2005091380A1 Infra red sensing devices |
| 09/29/2005 | WO2005091359A1 Method for producing a sensor module and corresponding sensor module |
| 09/29/2005 | WO2005090227A1 Stack structure and method of manufacturing the same |
| 09/29/2005 | WO2005089348A2 Packaging for micro electro-mechanical systems and methods of fabricating thereof |
| 09/29/2005 | WO2005089184A2 Method of magnetic field assisted self-assembly |
| 09/29/2005 | US20050215025 Micro pipe manufacturing method |
| 09/29/2005 | US20050215020 Component for electromagnetic waves and a method for manufacturing the same |
| 09/29/2005 | US20050214976 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 09/29/2005 | US20050214970 Method and apparatus for lubricating microelectromechanical devices in packages |
| 09/29/2005 | US20050214462 Micromechanical device recoat methods |
| 09/29/2005 | US20050212178 Capacitive measurement method and system for nanoimprint process monitoring |
| 09/29/2005 | US20050212111 Stack structure and method of manufacturing the same |
| 09/29/2005 | US20050212077 Dissipation of a charge buildup on a wafer portion |
| 09/29/2005 | US20050210645 Method of manufacturing actuator device, and liquid jet device |
| 09/29/2005 | DE19933418B4 Verfahren zur Herstellung von mikromechanischen Bauelementen A process for preparing micromechanical components |
| 09/29/2005 | DE102004028888A1 Electronic component, especially regulator or micromechanical sensor element for automobiles, with gel layer of specific hardness for protecting circuitry against corrosion, temperature and vibration |
| 09/29/2005 | CA2497933A1 Dissipation of a charge buildup on a wafer portion |
| 09/28/2005 | EP1580596A2 Structure formed with template having nanoscale features |
| 09/28/2005 | EP1578685A2 Method of forming semiconductor devices through epitaxy |
| 09/28/2005 | EP1578579A2 Micro-mechanical thermo structure and method for manufacturing such micro-mechanical structure |
| 09/28/2005 | EP1461828A4 Method of fabricating micro-electromechanical switches on cmos compatible substrates |
| 09/28/2005 | EP1360552B1 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography |
| 09/28/2005 | CN1675749A Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material |
| 09/28/2005 | CN1675127A Etch stop control for MEMS device formation |
| 09/28/2005 | CN1675126A Low temperature plasma Si or SiGe for MEMS applications |
| 09/28/2005 | CN1675124A Microelectromechanical device with integrated conductive shield |
| 09/27/2005 | US6949996 Actuator |
| 09/27/2005 | US6949397 Fabrication of silicon micro mechanical structures |
| 09/27/2005 | US6949396 Corner compensation method for fabricating MEMS and structure thereof |
| 09/27/2005 | US6949385 Thermal microvalves |
| 09/27/2005 | US6949215 Method for processing a three-dimensional structure by laser |
| 09/27/2005 | US6949199 Heat-transfer-stamp process for thermal imprint lithography |
| 09/27/2005 | US6948245 Gear and method of making the same |
| 09/22/2005 | WO2005087652A1 Method of manufacturing semiconductor device |
| 09/22/2005 | US20050206999 Optical attenuator element, and variable optical equalizer and optical amplifier that use this optical attenuator element |
| 09/22/2005 | US20050205515 Process for producing structural body and etchant for silicon oxide film |
| 09/22/2005 | US20050204939 Three-dimentional components prepared by thick film technology and method of producing thereof |
| 09/22/2005 | US20050204821 Micromechanical component having a diaphragm, and method for manufacturing such a component |
| 09/22/2005 | DE102005005551A1 Micro-mechanical component for pressure sensor, has sacrificial layer in which cavern is formed, and comprising entry channel with openings in related top and bottom layers, where openings do not overlap, such that channel is misaligned |
| 09/22/2005 | DE102004010295A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof |
| 09/21/2005 | EP1576650A2 Method for microfabricating structures using silicon-on-insulator material |
| 09/21/2005 | EP1576207A2 Methods of and apparatus for molding structures |
| 09/21/2005 | EP1428255A4 Microelectronic mechanical system and methods |
| 09/21/2005 | CN1671617A Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device |
| 09/21/2005 | CN1670568A Optical attenuator element, and variable optical equalizer and optical amplifier |
| 09/21/2005 | CN1669907A Electroplating method for micro-electromechanical system |
| 09/21/2005 | CN1669906A Method for making minisize flow passage by lead frame technology |
| 09/20/2005 | US6946398 Method for fabricating a micro machine |
| 09/20/2005 | US6946366 Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| 09/20/2005 | US6946326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| 09/20/2005 | US6946315 Manufacturing methods of MEMS device |
| 09/20/2005 | US6946314 Method for microfabricating structures using silicon-on-insulator material |
| 09/20/2005 | US6946200 Methods for reducing the curvature in boron-doped silicon micromachined structures |
| 09/20/2005 | US6946197 Semiconductor and device nanotechnology and methods for their manufacture |
| 09/19/2005 | CA2497624A1 Optical attenuator element, and variable optical equalizer and optical amplifier that use this optical attenuator element |
| 09/15/2005 | WO2005086533A1 Electret capacitor microphone |
| 09/15/2005 | WO2005024100A3 Fibrillar apparatus and methods for making it |
| 09/15/2005 | US20050199973 Differential pressure sensor |
| 09/15/2005 | US20050199584 Decal transfer microfabrication |
| 09/14/2005 | EP1574475A2 Integrated driver electronics for MEMS device using high voltage thin film transistors |
| 09/14/2005 | EP1573802A1 Method of the production of cavities in a silicon sheet |
| 09/14/2005 | EP1572578A2 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component |
| 09/14/2005 | EP1572577A1 Method for treating a structure to obtain an internal space and structure having an internal space |
| 09/14/2005 | CN1668528A Fluorochemical treatment for silicon articles |
| 09/14/2005 | CN1668437A Imprint lithography processes and systems |
| 09/14/2005 | CN1666870A Method of manufacturing actuator device, and liquid jet device |
| 09/13/2005 | US6943928 Electromagnetic actuator, manufacturing method, and optical scanner using the electromagnetic actuator |
| 09/13/2005 | US6943448 Multi-metal layer MEMS structure and process for making the same |
| 09/13/2005 | US6942750 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication |