Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
05/2006
05/09/2006US7040338 Microfabricated elastomeric valve and pump systems
05/04/2006WO2006047326A1 Sacrificial substrate for etching
05/04/2006WO2006046164A1 Fluid container composed of two plates
05/03/2006EP1652577A1 Micro channel structure and method of manufacturing the same
05/03/2006EP1652009A2 $m(c)method for producing inclined flank patterns by photolithography
05/03/2006EP1651560A1 Stacked structure and production method thereof
05/03/2006EP1435110B1 A method for forming a layered semiconductor structure and corresponding structure
05/03/2006EP1347937B1 Micromechanical component and corresponding production method
05/03/2006CN1767097A Method for making hollow structure RF solenoid micro-inductor
05/03/2006CN1254432C Micro-machinery component and method of manufacture
05/02/2006US7038834 Optical deflector and method of producing same
05/02/2006US7038293 Dissipation of a charge buildup on a wafer portion
05/02/2006US7037777 Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching mask
05/02/2006US7037438 Method for production of a semiconductor component and a semiconductor component produced by said method
04/2006
04/27/2006WO2006044066A2 Apparatus and process for monitoring migratory cell proliferation
04/27/2006WO2006012614A3 Fabrication methods and multifunctional substrate materials for chemical and biological analysis in microfluidic systems
04/27/2006WO2005078508A3 Method and apparatus for scanning a beam of light
04/27/2006WO2005078506A3 High performance mems scanner
04/27/2006DE10344777B4 Stempelvorrichtung für Softlithografie und Verfahren zu deren Herstellung A stamp device for soft lithography and methods for their preparation
04/27/2006DE10309519B4 Verfahren und Vorrichtung zur Herstellung von Miniaturkörpern oder mikrostrukturierten Körpern Method and apparatus for producing miniature bodies or microstructured bodies
04/27/2006DE102004050051A1 Drilling of through holes in silicon wafer in semiconductor production involves forming first recess in one side of wafer and second recess in other side, so that the recesses together form a through hole between the two sides of wafer
04/27/2006DE102004050050A1 Procedure for manufacturing of micromechanical structures involves demarcation of division of first silicon layer with offering area by passivation material whereby ditches, made in silicon layer, are filled with passivation material
04/26/2006CN1765007A Production method for antenna and production device for antenna
04/26/2006CN1764596A Method for fabricating three-dimensional microstructure by fib-cvd and drawing system for three-dimensional microstructure
04/26/2006CN1763582A MEMS two-dimensional vibrating mirror based on SOI and making method thereof
04/26/2006CN1762788A Hermetically sealed microdevice with getter shield
04/25/2006US7034981 Optical modulator, display device and manufacturing method for same
04/25/2006US7033910 Method of fabricating multi layer MEMS and microfluidic devices
04/25/2006US7033515 Method for manufacturing microstructure
04/25/2006US7032307 Method for fabricating a probe pin for testing electrical characteristics of an apparatus
04/20/2006US20060081776 Probe with hollow waveguide and method for producing the same
04/20/2006DE10318995B4 Verfahren zur Herstellung von durchgängigen Membranen A process for producing continuous membranes
04/20/2006DE102004062874A1 Elektrokinetische Mikroleistungszelle, die einen Mikrofluidchip des Mehrfachkanaltyps verwendet Electrokinetic micro power cell, which uses a micro fluid chip of the multi-channel type
04/20/2006DE102004051662B3 Verfahren zur Herstellung von Submikronstrukturen A process for the production of submicron structures
04/20/2006DE102004050764A1 Micromechanical component, specifically for membrane sensor, comprising substrate and membrane with height modulation over cavity in the substrate to improve mechanical robustness
04/19/2006CN1760112A Super hydrophobic surface possessing dual microtexture and preparation method
04/19/2006CN1251961C Soft lithography and tearing technology for colloid crystal microprocessing of pattern
04/19/2006CN1251960C Method for mfg. microelectromechanical structure and its integrated circuit
04/18/2006US7030536 Micromachined ultrasonic transducer cells having compliant support structure
04/18/2006US7029829 Low temperature method for forming a microcavity on a substrate and article having same
04/18/2006US7029548 Method for cutting a block of material and forming a thin film
04/13/2006WO2006038476A1 Fused-salt bath, precipitate obtained by using the fused-salt bath, method for producing metal product and metal product
04/13/2006US20060079070 Substrate for stressed systems and method of making same
04/13/2006US20060076717 Step and repeat imprint lithography processes
04/13/2006US20060076649 Substrate for stressed systems and method of making same
04/13/2006DE4431478B4 Aufhängung für mikromechanische Struktur und mikromechanischer Beschleunigungssensor Suspension for micromechanical structure and micro-mechanical acceleration sensor
04/13/2006DE4339190B4 Halbleiter-Beschleunigungsmesser Semiconductor accelerometer
04/13/2006DE10305106B4 Streustrahlenraster oder Kollimator sowie Anordnung mit Strahlungsdetektor und Streustrahlenraster oder Kollimator Scatter grid or collimator and arrangement with radiation detector and anti-scatter grid or collimator
04/13/2006DE102004058877A1 Semiconductor chip comprises a front section with a semiconductor functional element, and a rear section
04/12/2006EP1204853A4 Inorganic permeation layer for micro-electric device
04/12/2006CN1758128A System and method for protecting micro-structure of display array using spacers in gap within display device
04/11/2006US7026698 Functional device, method of manufacturing therefor and driver circuit
04/11/2006US7026696 Thin film-structure and a method for producing the same
04/11/2006US7026224 Method for dicing semiconductor chips and corresponding semiconductor chip system
04/11/2006US7026189 Wafer packaging and singulation method
04/06/2006WO2006035762A1 Method for fabricating resonance vibration device
04/06/2006WO2006013137A3 Method for etching a layer on a substrate
04/06/2006WO2005070817A3 Methods and systems for providing mems devices with a top cap and upper sense plate
04/06/2006WO2005015596A3 Method for the localized growth of nanothreads or nanotubes
04/06/2006US20060073687 Method for maskless fabrication of self-aligned structures comprising a metal oxide
04/06/2006DE19964099B4 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme A process for producing three-dimensionally arranged leading and connecting structures for volume and energy flows
04/06/2006DE10249207B4 Verfahren zur Herstellung eines ringförmigen Mikrostrukturelementes A method for producing an annular microstructure element
04/05/2006EP1641710A2 Micromechanical apparatus and method of forming a micromechanical device layer
04/05/2006EP1641709A2 Method for separating a useful layer and component obtained by said method
04/05/2006CN1755495A Method of making prestructure for MEMS systems
04/05/2006CN1755487A System and method for display device with activated desiccant
04/05/2006CN1755479A Method and system for xenon fluoride etching with enhanced efficiency
04/05/2006CN1755474A System and method of illuminating interferometric modulators using backlighting
04/05/2006CN1249804C Microstructure production method and microstructure arrangement
04/05/2006CN1249499C Fine component, its mfg. method and product using same
04/04/2006US7022617 Small scale wires with microelectromechanical devices
04/04/2006US7022546 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
04/04/2006US7022249 Method for making an optical micromirror and micromirror or array of micromirrors obtained by said method
04/04/2006US7022245 Fabrication of a reflective spatial light modulator
04/04/2006US7022244 Supplying fine drops; machining; atomizing liquids; heating with carrier gas; drying; distillation; aqueous solution of hydrogen fluoride for etching silica
03/2006
03/30/2006WO2005089184A3 Method of magnetic field assisted self-assembly
03/30/2006US20060068570 Structure with through hole, production method thereof, and liquid discharge head
03/30/2006US20060068564 Micromachined electromechanical device
03/30/2006US20060068510 Layer system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof
03/30/2006DE19704359B4 Halbleitersensor für eine physikalische Größe und Verfahren zu seinem Betrieb Semiconductor sensor for a physical quantity and method for its operation
03/30/2006DE19619921B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit Funktionselement und Schutzkappe A method of manufacturing a semiconductor device having a functional element and cap
03/30/2006DE10202513B4 Selbstreinigende Oberflächen für bildgebende Sensoren Self-cleaning surfaces for imaging sensors
03/30/2006DE102005043645A1 Halbleitersensor für eine physikalische Grösse und Verfahren zur Herstellung eines solchen A semiconductor sensor for a physical quantity and methods for producing such
03/30/2006DE102005010926A1 Deckel für optoelektronische Wafermaßstabsgehäuse Cover for optoelectronic wafer-scale housing
03/30/2006DE102004046705A1 Mikromechanisch hergestellter Infrarotstrahler Micromechanically produced infrared heaters
03/30/2006DE102004044083A1 Verfahren zur Strukturierung eines Substrats und Vorrichtung hierzu A process for patterning a substrate and device for this purpose
03/29/2006EP1641027A2 Portable etch chamber
03/29/2006EP1641026A2 Method and system for xenon fluoride etching with enhanced efficiency
03/29/2006EP1640333A1 Hermetically sealed microdevice with getter shield
03/29/2006EP1640319A2 Method of making micromechanical interferometric apparatus element
03/29/2006CN1753718A Component separating device, method of producing the device, and method of separating component by using the device
03/29/2006CN1751983A Non close parked metal hollow ball shell ordered network structure material and its making method
03/29/2006CN1248312C Multi-layer integrated circuit for join of substrates with wide gaps
03/29/2006CN1247813C Film including several components and its forming process
03/29/2006CN1247443C Dry deeply etching silicone wafer manufacture method
03/28/2006US7019835 Method and system to measure characteristics of a film disposed on a substrate
03/28/2006US7018862 Micromachined electromechanical device
03/28/2006US7018550 Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
03/28/2006US7018020 Structure with through hole, production method thereof, and liquid discharge head
03/28/2006US7018015 Substrate and method of forming substrate for fluid ejection device