B81C 1 - Manufacture or treatment of devices or systems in or on a substrate

Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
12/2004
12/15/2004	EP1485949A2 Novel planarization method for multi-layer lithography processing
12/15/2004	EP1485758A1 A method for fabricating a structure for a microelectromechanical systems (mems) device
12/15/2004	CN1554566A Silicon-aluminium-silicon structure micro machinery processing method of full dry method
12/15/2004	CN1180121C Locating and filming process to tip of micro pointed cone
12/14/2004	US6830990 Method and apparatus for dicing released MEMS wafers
12/14/2004	US6830950 Integrated method for release and passivation of MEMS structures
12/14/2004	US6829814 Process of making an all-silicon microphone
12/09/2004	US20040248421 Method for manufacturing metal microstructure
12/09/2004	US20040248420 Substrate with microstructure formed thereon and manufacturing method thereof
12/09/2004	US20040248417 Method for stripping sacrificial layer in MEMS assembly
12/09/2004	US20040248376 Method for forming a cavity structure on soi substrate and cavity structure formed on soi substrate
12/09/2004	US20040248349 Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method
12/09/2004	US20040245669 Method of producing resin molded product
12/09/2004	US20040245605 Composite semiconductor wafer and a method for forming the composite semiconductor wafer
12/09/2004	US20040245588 MEMS device and method of forming MEMS device
12/09/2004	US20040245587 Micromachine and production method thereof
12/09/2004	US20040245521 Microchannel plates and biochip arrays, and methods of making same
12/09/2004	US20040245217 Conductive etch stop for etching a sacrificial layer
12/09/2004	DE10323365A1 Vorrichtung zur Herstellung geprägter Substrate Device for producing embossed substrates
12/09/2004	DE10323235A1 Silicon substrate for production of silicon pieces, containing at least one depression on one surface with profile reducing for largest to smallest depth
12/08/2004	EP1484644A2 Mould, pattern of nano wires, multiplexer/demultiplexer and method of making same
12/08/2004	EP1484281A1 MEMS device and method of forming MEMS device
12/08/2004	EP0870319B1 A method for the manufacturing of micromachined structures
12/08/2004	CN1552615A Manufacturnig method for cantilever beam microelectromechanical system
12/07/2004	US6828888 Micro relay of which movable contact remains separated from ground contact in non-operating state
12/07/2004	US6828674 Microelectrical-mechanical systems devices; microstructure and cap wafers bonded with frit glass sealant, connected by wire bond, and protected by overmold
12/07/2004	US6828171 Systems and methods for thermal isolation of a silicon structure
12/07/2004	US6827869 Method of micromachining a multi-part cavity
12/02/2004	WO2004105084A2 Method of room temperature covalent bonding
12/02/2004	WO2004104704A2 Lithographic method for producing microcomponents
12/02/2004	WO2004104228A1 Microfluidic protein crystallography
12/02/2004	WO2004103920A1 Method of fabricating mold for glass press
12/02/2004	WO2004103892A1 Method for fabricating microstructure and microstructure
12/02/2004	WO2004018348A3 Layer system comprising a silicon layer and a passivation layer, method for producing a passivation layer on a silicon layer and the use of said system and method
12/02/2004	WO2004013038A3 Etch stop control for mems device formation
12/02/2004	US20040243063 Microneedle array module and method of fabricating the same
12/02/2004	US20040241902 Substrate for stressed systems and method of making same
12/02/2004	US20040240027 Structure of a structure release and a method for manufacturing the same
12/02/2004	US20040239456 Micro relay of which movable contact remains separated from ground contact in non-operating state
12/02/2004	US20040239006 Silicone compositions, methods of making, and uses thereof
12/02/2004	US20040238484 Method of manufacturing a microfluidic structure, in particular a biochip, and structure obtained by said method
12/02/2004	DE10320679A1 Process for treating a workpiece, especially a substrate for a mask for producing semiconductor elements, comprises using water in a super-critical state
12/02/2004	CA2526481A1 Method of room temperature covalent bonding
12/01/2004	CN1551853A Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
11/2004
11/30/2004	US6825967 Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same
11/30/2004	US6825539 Integrated circuit-integrated flexible shear-stress sensor skin and method of fabricating the same
11/30/2004	US6825127 Micro-fluidic devices
11/30/2004	US6824960 Method of manufacturing a fluid injection device
11/30/2004	US6824697 Method for fabricating mems and microfluidic devices using smile, latent masking, and delayed locos techniques
11/25/2004	WO2004102634A2 Metal mems devices and methods of making same
11/25/2004	WO2004064244A3 Method for releasing and drying moveable elements of micro-electronic mechanical structures with organic thin film sacrificial layers
11/25/2004	US20040235266 Method of room temperature covalent bonding
11/25/2004	US20040234898 Magnetic flowcell systems and methods
11/25/2004	US20040234736 Control of stress in metal films by controlling the temperature during film deposition
11/25/2004	US20040233553 Form variable mirror element and method for producing form variable mirror element and form variable mirror unit and optical pick-up
11/25/2004	US20040233503 Transmissive spatial light modulator and method of manufacturing the same
11/25/2004	US20040232504 Stress control of semiconductor microstructures for thin film growth
11/25/2004	US20040232107 Method for manufacturing microstructure
11/25/2004	US20040232106 Method of manufacturing a mirror and a mirror device
11/25/2004	DE10318995A1 Etching permeable membranes made from semipermeable membranes by electrochemical etching of macro-pores on a plane side of a flat semiconductor
11/25/2004	DE10318568A1 Siliziumsubstrat mit positiven Ätzprofilen mit definiertem Böschungswinkel und Verfahren zur Herstellung Silicon substrate with positive etch profiles with a defined angle of approach and methods of making
11/25/2004	CA2522606A1 Metal mems devices and methods of making same
11/24/2004	EP1480263A1 Method of treating surface, semiconductor device, process for producing semiconductor device, and apparatus for treatment
11/24/2004	EP1480077A2 Device and process for manufacturing embossed substrates
11/24/2004	EP1479648A2 Etching process for micromachining crystalline materials and devices fabricated thereby
11/24/2004	EP1355848B1 Method for producing a mcirofluidic component
11/24/2004	EP1311310A4 Microneedle array module and method of fabricating the same
11/24/2004	EP0998597B1 Field emitter fabrication using open circuit electrochemical lift off
11/24/2004	CN1548360A Method of utilizing pre-etched glass base material to reduce post-release time
11/23/2004	US6822176 Liquid metal switch and method of manufacture therefor
11/23/2004	US6821901 Method of through-etching substrate
11/23/2004	US6821450 Substrate and method of forming substrate for fluid ejection device
11/23/2004	US6821342 Method for forming suspended microstructures
11/18/2004	WO2004100214A2 Metal sacrificial layer
11/18/2004	WO2004099067A1 Method for producing nanomaterial and nanomaterial
11/18/2004	WO2004099066A1 Wafer bonding compatible with bulk micro-machining
11/18/2004	US20040229386 Controlled fabrication of gaps in electrically conducting structures
11/18/2004	US20040228015 Micromirror unit with torsion connector having nonconstant width
11/18/2004	US20040226374 Capacitive acceleration sensor
11/18/2004	US20040226369 Vertical MEMS gyroscope by horizontal driving and fabrication method thereof
11/18/2004	DE10317889A1 Mikromechanisches Bauteil und Verfahren zu seiner Herstellung Micromechanical element and process for its preparation
11/17/2004	EP1476394A2 Thin film encapsulation of mems devices
11/17/2004	EP1208403B1 Method of manufacture of a micromechanical optical switch
11/17/2004	CN1547226A Deep etching plane magnet coil and making method
11/16/2004	US6818395 For automatic high speed/throughput analysis without size-separating dna fragments on polyacrylamide gel electrophoresis
11/16/2004	US6817725 Micro mirror unit and method of making the same
11/11/2004	WO2004097518A2 A method of forming stepped structures employing imprint lithography
11/11/2004	WO2004056698A3 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
11/11/2004	WO2003050852A3 Complex microdevices and appparatus and methods for fabricating such devices
11/11/2004	US20040224523 Method of fabricating anti-stiction micromachined structures
11/11/2004	US20040224480 Micromechanical strained semiconductor by wafer bonding
11/10/2004	EP1474723A2 DRYING RESIST WITH A SOLVENT BATH AND SUPERCRITICAL CO sb 2 /sb
11/10/2004	EP1294636A4 Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape
11/10/2004	CN1545732A Etching process for micromachining crystalline materials and devices fabricated thereby
11/10/2004	CN1545484A Process for producing microelectromechanical components
11/10/2004	CN1544308A Soft lithography and tearing technology for colloid crystal microprocessing of pattern
11/09/2004	US6816301 Micro-electromechanical devices and methods of manufacture
11/09/2004	US6815866 Cantilever having step-up structure and method for manufacturing the same
11/09/2004	US6815363 Method for nanomachining high aspect ratio structures
11/09/2004	US6815361 Method of fabricating anti-stiction micromachined structures

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