Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
02/2007
02/22/2007US20070040488 Electric part
02/22/2007US20070039920 Method of fabricating nanochannels and nanochannels thus fabricated
02/22/2007DE112005000625T5 System und Verfahren zum Direktverbinden von Substraten System and method for direct bonding of substrates
02/22/2007DE10338967B4 Verfahren zum Kleben von Mikrobauteilen auf ein Substrat Method for bonding of micro components on a substrate
02/22/2007DE102005038754A1 Component e.g. micromechanical sensor, has structured layer made of non-organic material, applied on substrate or on covering layer above substrate whereby structured layer has surface texture with micro-scaled or nano-scaled roughness
02/22/2007DE10154601B4 Ein Mikrobauelement mit einem integrierten hervorstehenden Elektrospray-Emitter und ein Verfahren zum Herstellen des Mikrobauelements A micro device having an integrated protruding electrospray emitter and a method for manufacturing the micro device
02/21/2007CN1918448A Method and system to measure characteristics of a film disposed on a substrate
02/21/2007CN1915797A Single chip integration method of CMOS circuit and MEMS tiny electrodei
02/21/2007CN1915796A Light reading out, not refrigerant infrared imaging array device, and fabricating metod
02/20/2007US7180647 Optical scanner and method of fabricating the same
02/20/2007US7180163 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
02/20/2007US7180144 Corner compensation method for fabricating MEMS and structure thereof
02/20/2007US7179396 Positive tone bi-layer imprint lithography method
02/20/2007US7178378 Resonant sensor and sensing system
02/15/2007WO2007018875A1 Improved chamber for a microelectromechanical device
02/15/2007WO2007018575A2 Ion generation by the temporal control of gaseous dielectric breakdown
02/15/2007WO2007018571A2 Chemical sensor
02/15/2007WO2007017819A1 Method for manufacturing a microelectronic package comprising a silicon mems microphone
02/15/2007DE112005000355T5 Struktur und Herstellungsverfahren für dieselbe Structure and manufacturing method for the same
02/15/2007DE102006018675A1 Dünnschichtstruktur und Herstellungsverfahren derselben Thin film structure and production method thereof
02/15/2007DE102005055293A1 Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip A process for producing semiconductor chips and the thin film semiconductor chip
02/14/2007EP1752415A2 Manufacturing method of a suspended MEMS structure
02/14/2007CN1914115A Integrated getter area for wafer level encapsulated microelectromechanical systems
02/14/2007CN1911781A Manufacturing method used for improving performance of non-refrigerating infrared focal plane array device
02/14/2007CN1911780A Method of protecting chip front face pattern and method of implementing two-side technology
02/14/2007CN1911779A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/13/2007US7176111 Method for depositing polycrystalline SiGe suitable for micromachining and devices obtained thereof
02/13/2007US7176106 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
02/13/2007US7175772 Small scale actuators and methods for their formation and use
02/08/2007WO2007015050A1 A method of processing substrates
02/08/2007US20070031989 Separating semiconductor wafers having exposed micromechanical structures into individual chips
02/08/2007US20070031761 Polymers, methods of use thereof, and methods of decomposition thereof
02/08/2007US20070029686 Photoresists; photomasks
02/08/2007US20070029643 Methods for nanoscale structures from optical lithography and subsequent lateral growth
02/08/2007DE102006018214A1 Verringerung von Oxiden in einem fluidbasierten Schalter Reduction of oxides in a fluid-based switch
02/07/2007EP1749794A2 Electronic parts packaging structure and method of manufacturing the same
02/06/2007US7173748 Micro-mirror and a method for fabricating the same
02/06/2007US7172919 Method for fabricating a tuning fork gyroscope
02/06/2007US7172795 having characteristics similar to those using photolithographic technologies, with a considerable reduction in costs and complexity; a photopolymer to which are added nanoparticles orientable in space by means of magnetic and/or electrical fields
02/06/2007US7172707 Sputtered spring films with low stress anisotropy
02/06/2007US7171975 Fabrication of ultra-shallow channels for microfluidic devices and systems
02/01/2007WO2006128953A3 Thinning op a si wafer for mems-sensors applications
02/01/2007DE102005035058A1 Micromechanical device for e.g. air mass sensor, has reinforcement layer arranged in membrane to provide reinforcement in area of membrane edge, where membrane is made from dielectric layer, and layer is made from metal e.g. aluminum
01/2007
01/31/2007CN1903701A Multi oxometallate and amination calixarene self assembled organic-inorganic composite film
01/31/2007CN1297690C Appts. for silicon anisotropic corrosion
01/31/2007CN1297470C Structure formed utilizing micro-structure gap-controlling technology and forming method thereof
01/30/2007US7170216 Bimorph switch, bimorph switch manufacturing method, electronic circuitry and electronic circuitry manufacturing method
01/30/2007US7170141 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry
01/30/2007US7169989 Applying an enzyme for the selective removal of sub-unit parts of the polymer to at least one predetermined area of said polymeric substrate via a pipette with a nano-sized orifice
01/30/2007US7169314 Microfabricated elastomeric valve and pump systems
01/25/2007US20070019406 Optical device having micro lens array
01/25/2007US20070018262 Micromachine and production method thereof
01/25/2007DE10230675B4 Verfahren zur Herstellung von Phasenschiebermasken A process for producing phase shift masks
01/25/2007DE102005032635A1 Mikromechanische Vorrichtung mit zwei Sensorstrukturen, Verfahren zur Herstellung einer mikromechanischen Vorrichtung Micromechanical device with two sensor structures, method for making a micromechanical device
01/25/2007DE102005032454A1 Detaching transfer film from semiconductor substrate and for its transfer by dry chemical etching, preferably by gas phase etching using specified doping
01/25/2007DE102005032452A1 Communicating hollow spaces e.g. pumping chambers, manufacturing method for e.g. micromechanical pump, involves covering one of hollow spaces by applying glass wafer on semiconductor wafer
01/24/2007EP1746622A1 Method for forming carbonaceous material protrusion and carbonaceous material protrusion
01/24/2007EP1594800B1 Method of manufacturing an electronic device and electronic device
01/24/2007EP1099244B1 Method for anisotropic etching
01/24/2007CN1900669A Method for producing heat shear stress sensor device based on new sacrifice layer process
01/24/2007CN1900668A Method for producing heat shear stress sensor device based on vacuum adhesive process
01/24/2007CN1899952A Method for producing pressure sensor silicon resonant film
01/24/2007CN1899950A Sensing contact probe
01/24/2007CN1296271C Manufacturing method of micro-electromechanical optical display unit
01/24/2007CN1296270C Etching method
01/23/2007US7166488 Metal MEMS devices and methods of making same
01/23/2007US7165957 Device for transferring a pattern to an object
01/23/2007US7165566 Method of forming a microstructure using maskless lithography
01/18/2007WO2007009037A1 Structures formed in diamond
01/18/2007US20070015335 Production method for antenna and production device for antenna
01/18/2007US20070013266 Method of fabricating a polymer-based capacitive ultrasonic transducer
01/18/2007US20070012108 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
01/18/2007DE112005000276T5 Waferhäusungs- und Singulierungsverfahren Waferhäusungs- and Singulierungsverfahren
01/18/2007DE102006031047A1 Halbleitersensor und Herstellungsverfahren dafür A semiconductor sensor and production method thereof
01/18/2007DE102005033005A1 Optoelektronischer Chip The optoelectronic chip
01/18/2007DE102004009027B4 Wärmeempfindliches Flussratendetektorelement und Verfahren zu dessen Herstellung A heat-sensitive flow rate detection element and process for its preparation
01/17/2007CN1898150A Method for containing a device and a corresponding device
01/17/2007CN1896784A Integrated assembly and substrate structure and its production for polymer ultraviolet/visible-light collimator
01/17/2007CN1295138C Thin film mini-bridge structure and its mfg. method
01/16/2007US7163873 Substrate for stressed systems and method of making same
01/16/2007US7163826 Method of fabricating multi layer devices on buried oxide layer substrates
01/16/2007CA2274071C Affinity based self-assembly systems and devices for photonic and electronic applications
01/11/2007WO2006076354A3 Diamond medical devices
01/11/2007DE4315012B4 Verfahren zur Herstellung von Sensoren und Sensor A process for the production of sensors and sensor
01/11/2007DE19537285B4 Verfahren zur Herstellung eines Halbleiterelements mit einer flexiblen Anordnung, Halbleiterelement, Feldeffektsensor mit beweglichem Gate, Verfahren zur Verwendung eines Transistors mit beweglichem Gate als Sensor, sowie kapazitiver Sensor A process for producing a semiconductor element with a flexible arrangement, the semiconductor element, field effect sensor with a movable gate, method of using a transistor as a sensor with a movable gate, and a capacitive sensor
01/11/2007DE102005027676A1 Verfahren zur Herstellung von anisotropen Wellenleiterstrukturen zur Übertragung von Lichtwellen A process for preparing anisotropic waveguide structures for the transmission of light waves
01/11/2007DE102004006156B4 Verfahren zum Herstellen eines mikrokapazitiven Ultraschall-Wandlers A method for producing a mikrokapazitiven ultrasonic transducer
01/10/2007EP1741670A1 Device incorporating a field of dots used in biotechnology applications
01/10/2007EP1741669A2 Hidden hinge mems device
01/10/2007EP1740256A1 Microneedles and microneedle fabrication
01/10/2007EP1658344B1 Microsystem component and method for gluing microcomponents to a substrate
01/10/2007EP1418977B1 Microneedles for minimally invasive drug delivery
01/10/2007EP1301432B1 Method of fabricating devices incorporating microelectromechanical systems using uv curable tapes
01/10/2007CN1894802A Structuring method, and field effect transistors
01/10/2007CN1893142A Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof
01/10/2007CN1893137A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/10/2007CN1891617A Method for protecting etched structure in induction coupling plasma etching
01/10/2007CN1294296C Method and electrode for defining and replicating structures in conducting materials
01/10/2007CN1294074C Producing method and mechanical property testing method for metal film microbridge
01/09/2007US7161233 Integrated micro electromechanical system encapsulation component and fabrication process of the component
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