Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
01/2008
01/02/2008CN101096266A Method for forming charge pattern and deposited particle and application for charge storage device
01/02/2008CN101096009A Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system
01/02/2008CN100359653C Method for connecting substrates and composite element
01/01/2008US7314599 Heating substrate composed of glassy uncrystallized polyarylether ketone (PAEK) material to glass transition temperature of PAEK material and embossing heated substrate until temperature produces crystallization
01/01/2008US7313854 Method of manufacturing a tactile sensor
12/2007
12/27/2007WO2007147671A1 Method for producing porous micro-needles and use thereof
12/27/2007WO2007147643A2 Nano-microphone or pressure sensor
12/27/2007WO2007147241A2 Mems-based nanopositioners and mano manipulators
12/27/2007WO2007147239A1 Mems-based micro and nano grippers with two- axis force sensors
12/27/2007WO2007100457A3 Electrical conditioning of mems device and insulating layer thereof
12/27/2007WO2007087249A3 Wafer level packaging to lidded chips
12/27/2007WO2003057619A3 Apparatus and method for nanoscale and microscale mechanical machining and processing
12/27/2007DE102006028916A1 Production of silicon porous particles for the application of active substances, comprises doping an area of a silicon wafer, producing recesses in the silicon wafer, porosifying of the silicon wafer, and removing of the porous particles
12/27/2007DE102006028914A1 Micro needles production method, involves providing micro needles with height on silicon substrate with silicon oxide coating, where varnish layer is arranged on silicon substrate
12/27/2007DE102006028783A1 Porous silicon body with layered structure, useful for producing a drug delivery unit for treating e.g. pain, comprises a first outer layer, an intermediate layer and a second outer layer in that pore channels are perpendicularly arranged
12/27/2007DE102006028435A1 Sensor und Verfahren zu seiner Herstellung Sensor and method for its preparation
12/27/2007CA2655534A1 Mems-based nanopositioners and nanomanipulators
12/27/2007CA2655390A1 Mems-based micro and nano grippers with two-axis force sensors
12/26/2007EP1869705A1 Method for the production of enclosed electronic components, and enclosed electronic component
12/26/2007EP1869528A1 Process for forming microstructures
12/26/2007CN101094804A Packaging for micro electro-mechanical systems and methods of fabricating thereof
12/25/2007US7312677 Micro-switching element fabrication method and micro-switching element
12/25/2007US7312553 Micromechanical component and method for producing same
12/25/2007US7311503 Micromachined fluidic device and method for making same
12/23/2007CA2551194A1 Mems-based nanomanipulators/nanopositioners
12/23/2007CA2551191A1 Electrothermally-driven mems microgrippers with integrated dual-axis capacitive force sensors
12/21/2007WO2007144677A2 Cmos integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining and sensor chip comprising such element
12/21/2007WO2007126844A3 Non-planar surface structures and process for microelectromechanical systems
12/20/2007US20070291370 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part
12/20/2007US20070289940 Surfactant-enhanced protection of micromechanical components from galvanic degradation
12/20/2007DE102006026559A1 Mikromechanischer Filter für Mikropartikel, insbesondere für pathogene Bakterien und Viren, sowie Verfahren zu seiner Herstellung The micromechanical filter for microparticles, particularly for pathogenic bacteria and viruses, and methods for its preparation
12/20/2007DE102006017359B3 Semiconductor wafers packing method involves producing structured surface charge on surface of auxiliary substrate, where structured exposing and coating compounds are applied on surface of auxiliary substrate
12/20/2007DE102006004644B4 Werkzeug und Verfahren zum Erzeugen einer Schicht mit mikrostrukturierter Außenfläche auf einer Substratoberfläche Tool and method for forming a layer having a microstructured outer surface on a substrate surface
12/19/2007EP1868024A1 Micro-electro mechanical system device and method of forming comb electrodes of the same
12/19/2007EP1514122B1 Method of manufacturing of a monolithic silicon acceleration sensor
12/19/2007CN101088911A Micro-electro mechanical system device and method of forming comb electrodes of the same
12/19/2007CN100356604C Micro-ultrasonic device making technics facing facing orientation and distance-measuring application
12/19/2007CN100356566C Semiconductor device with micro electromechanical system
12/18/2007US7310175 MEMS device and method of forming MEMS device
12/18/2007US7309467 micro electro-mechanical system (MEMS) ; includes a polymer layer comprising a containment portion that in combination with the substrate encloses a fluidic channel, the containment portion includes a deep cross-linked polymer region
12/13/2007WO2007143072A2 Wet etch suitable for creating square cuts in si and resulting structures
12/13/2007WO2007140537A1 Production of microfluidic devices using laser-induced shockwaves
12/13/2007WO2007115028A3 Microstructured tool and method of making same using laser ablation
12/13/2007WO2007041262A3 Method of fabricating reflective spatial light modulator having high contrast ratio
12/13/2007DE10222959B4 Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen Micro-electro-mechanical device and method for the production of micro-electro-mechanical components
12/13/2007DE102006025553A1 Verfahren zum Herstellen einer elektronischen Baueinheit, zugehörige Baueinheit und Baugruppe mit mindestens einer solchen Baueinheit A method of manufacturing an electronic assembly, and related assembly module having at least one such assembly
12/13/2007DE102004058880B4 Integrierter Mikrosensor und Verfahren zur Herstellung Integrated micro sensor and process for producing
12/13/2007CA2654453A1 Production of microfluidic devices using laser-induced shockwaves
12/12/2007CN101086956A Method for fabricating semiconductor device
12/12/2007CN100355045C Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
12/12/2007CN100355016C Process for producing a movable structure and etchant for silicon oxide film
12/11/2007US7307775 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
12/11/2007US7307497 Method for producing a coplanar waveguide system on a substrate, and a component for the transmission of electromagnetic waves fabricated in accordance with such a method
12/11/2007US7306745 Method and apparatus for stabilizing a plasma
12/11/2007US7306672 Microfluidic free interface diffusion techniques
12/06/2007WO2007138227A1 Microfluidic device with variable volume material
12/06/2007WO2007137893A1 Micromechanic component and method for the production thereof
12/06/2007WO2007044035A3 Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers
12/06/2007US20070280848 Methods Of Forming Alpha And Beta Tantalum Films With Controlled And New Microstructures
12/06/2007US20070278650 Semiconductor Device
12/06/2007DE102006025121A1 Darstellung von Mikro- und Nanoporen-Massenanordnungen durch Selbstorganisation von Nanopartikeln und Sublimationstechnik Representation of micro- and nano-pores mass arrangements by self-assembly of nanoparticles and sublimation
12/06/2007DE102006008315B4 Miniaturisierte Transportsysteme aus einem Formgedächtnis-Polymer und Verfahren zur Herstellung Miniaturized delivery systems made of a shape memory polymer and method for producing
12/05/2007EP1861926A1 Method of manufacturing vibrating micromechanical structures
12/05/2007EP1861232A2 3-d interconnected multi-layer microstructure of thermoplastic materials
12/05/2007CN101082589A System and method of testing humidity in a sealed mems device
12/05/2007CN101081691A Isolation scheme for reducing film stress in a MEMS device
12/04/2007US7304800 Optical tunable filter and method of manufacturing the same
12/04/2007US7304358 MOS transistor with a deformable gate
12/04/2007US7303934 Method for manufacturing a micro-electromechanical device and micro-electromechanical device obtained therewith
11/2007
11/29/2007WO2007135214A1 Flexible micro/nanofluidic devices
11/29/2007WO2006127243A8 Method and apparatus for reducing surface defects in microstamps
11/29/2007US20070276193 Vivo Diagnostic and Therapy Micro-Device
11/29/2007US20070273013 Packaging for Micro Electro-Mechanical Systems and Methods of Fabricating Thereof
11/29/2007DE102006024668A1 Micromechanical component e.g. sensor, for e.g. hearing aid`s microphone, has counter unit with passage hole in rear volume formed by hollow space below unit, where hollow space contacts upper side of membrane below counter unit via opening
11/29/2007DE102006024287A1 Micromechanical manufacturing method for vertical porous structure in semiconductor substrate, involves structuring two recesses from surface of semiconductor substrate, with structure which vertically separates recesses
11/29/2007DE102006024286A1 Microfluidic dosing device for picoliter quantities, includes pipette or pipetting matrix with delivery end and active or passive heater at its closed end
11/29/2007DE10065965B4 Fertigungsverfahren für einen Stromsensor der Mikrosystemtechnik Manufacturing method for a current sensor microsystem technology
11/28/2007EP1860062A2 Micro-fludidic structure and method of making the same
11/28/2007EP1859482A1 Thin film getter protection
11/28/2007EP1859475A2 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
11/28/2007EP1150318B1 Micromachine switch and its production method
11/28/2007CN101080360A Sacrificial substrate for etching
11/28/2007CN101077767A Microelectron mechanical system obverse structure releasing protecting method
11/28/2007CN101077766A Electromechanical element and electronic circuit device, and method for manufacturing the same
11/27/2007US7301692 Micro mirror and method for fabricating the same
11/27/2007US7300854 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
11/27/2007US7299818 Integrated microvalve and method for manufacturing a microvalve
11/22/2007WO2007131836A1 Method for producing a micromechanical component, and micromechanical component
11/22/2007US20070269585 Actuating member and method for producing the same
11/22/2007DE102006023768A1 Mikrogreifer Microgripper
11/22/2007DE102006023701A1 Micromechanical unit, has substrate with front side and back side, cover substrate connected with front side of substrate, and contact surfaces electrically contacting part of micromechanical structure and provided on back side of substrate
11/22/2007DE102006022805A1 Micromechanical component, has contacting structures for electrically contacting part of micromechanical structure, where sealing layer and partly contacting structures comprise material of separation layer forming sealing layer
11/22/2007DE102006022379A1 Micromechanical pressure transducer for capacitive microelectromechanical system microphone, has substrate-sided cavity forming back volume for movable membrane, and resting at application-specific integrated circuit chip
11/22/2007DE102006022378A1 Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement A process for producing a micromechanical component and micromechanical component
11/21/2007EP1857406A2 Method of making dimple structure for prevention of mems device stiction
11/21/2007EP1855987A1 A method of fabricating tridimensional micro- and nano­structures as well as optical element assembly having a tridimensional convex structure obtained by the method
11/21/2007CN100350565C Surface treatment method, semiconductor device, method of fabricating semiconductor device, and treatment apparatus
11/20/2007US7298022 Semiconductor sensor
11/20/2007US7298015 Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
11/20/2007US7297568 Three-dimensional structural body composed of silicon fine wire, its manufacturing method, and device using same
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