Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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02/20/2008 | CN101126898A Method for shrinking pi phase migration lithographic feature size using metal layer |
02/20/2008 | CN101126897A Continuous surface micro-structure forming method based on microlens array |
02/20/2008 | CN101126896A Super resolution lithography method based on PDMS template and silver board material |
02/20/2008 | CN101125482A Structure with through hole, production method thereof, and liquid discharge head |
02/20/2008 | CN100370316C Optical attenuator element, and variable optical equalizer and optical amplifier |
02/14/2008 | WO2007144677A3 Cmos integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining and sensor chip comprising such element |
02/14/2008 | WO2007143072A3 Wet etch suitable for creating square cuts in si and resulting structures |
02/14/2008 | WO2007103224A3 Structure and method of making lidded chips |
02/14/2008 | US20080038921 Method of Manufacturing Semiconductor Device |
02/14/2008 | US20080038861 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices |
02/14/2008 | DE102007033132A1 Producing a micro-array useful for e.g. gene expression profiling, comprises mounting photo acid generator on substrate, placing pattern-forming imprint plate on the substrate and applying nucleotide phosphoramidite monomer on substrate |
02/13/2008 | EP1886969A2 Methods of fabrication of wafer-level vacuum packaged devices |
02/13/2008 | EP1885646A1 Microfluidic device with integrated micropump, in particular biochemical microreactor, and manufacturing method thereof |
02/13/2008 | EP1569865B1 Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers |
02/13/2008 | EP1468467B1 A component for electromagnetic waves and a method for manufacturing the same |
02/13/2008 | EP1319239B1 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto |
02/13/2008 | CN101121500A Method for manufacturing three-dimensional nerve microelectrode array |
02/13/2008 | CN101121499A Deeply etching method |
02/13/2008 | CN101121498A Method for manufacturing micro-torsion shaft |
02/13/2008 | CN101121497A Carbon nano-tube composite material and preparation method thereof |
02/13/2008 | CN100368786C Method for producing heat shear stress sensor device based on new sacrifice layer process |
02/12/2008 | US7329611 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part |
02/12/2008 | CA2467174C Differential stress reduction in thin films |
02/07/2008 | WO2008015434A1 Method of etching a sacrificial silicon oxide layer |
02/07/2008 | US20080030130 Hermetic encapsulation of organic, electro-optical elements |
02/07/2008 | US20080029878 Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers |
02/07/2008 | DE202007016591U1 Vorrichtung zum Rakeln mit einer in sich geschlossenen Rakel Apparatus for doctoring with a self-blade |
02/06/2008 | CN101120433A Methods and devices for fabricating and assembling printable semiconductor elements |
02/06/2008 | CN101118826A Method for manufacturing carbon nano-tube field transmitting rotating electron source |
02/06/2008 | CN101118819A MEMS switch and manufacturing method thereof |
02/06/2008 | CN101118313A Low temperature fabrication of conductive micro structures |
02/06/2008 | CN101117206A Method for generating tomography between micro-channel structure and substrate in production process of silicon micro-channel by electrochemical process |
02/06/2008 | CN100367109C Nanosize making die using spacer technique |
02/05/2008 | US7326446 Method for coating metal surfaces and substrate having a coated metal surface |
02/05/2008 | US7326296 High throughput screening of crystallization of materials |
02/05/2008 | CA2363414C Integrated monolithic microfabricated dispensing nozzle and liquid chromatography-electrospray system and method |
01/31/2008 | WO2007120887A3 Packaging a mems device using a frame |
01/31/2008 | WO2007116345A3 Inter-layer connection for foil mems technology |
01/31/2008 | US20080026328 Method for fabricating a structure for a microelectromechanical systems (mems) device |
01/31/2008 | DE102007033717A1 Manufacturing method for microstructure by three-dimensional treatment of flat component, involves preparing substrate as flat component, where mask is formed on substrate and mask has two openings |
01/31/2008 | DE102007007694A1 Anordnung mit Nanoteilchen und Verfahren zu deren Herstellung Arrangement with nanoparticles and processes for their preparation |
01/30/2008 | CN201014889Y Carbon dioxide supercritical drying mechanism |
01/30/2008 | CN101114591A Pressure capacitance type sensor substrate cavity-forming method |
01/30/2008 | CN100365775C Etching process for micromachining crystalline materials and devices fabricated thereby |
01/29/2008 | US7323354 Method of manufacturing MEMS device |
01/29/2008 | US7322100 Method for producing a micromachined layered device |
01/24/2008 | WO2008009803A2 Production of microfluidic polymeric devices by photo-assisted and/ or thermally assisted printing |
01/24/2008 | WO2008009716A1 Arrangement comprising nanoparticles, and method for the production thereof |
01/24/2008 | US20080020579 Method For Manufacturing A Membrane In A (111) Surface Of A (100) Silicon Wafer |
01/24/2008 | US20080018975 MEMS Device with a Closed Cellular Core Sandwiched Structure |
01/24/2008 | DE10330795B4 Kohlenstoff-Hartmaske mit einer Stickstoff-dotierten Kohlenstoffschicht als haftfähiger Schicht zur Haftung auf Metall oder metallhaltigen anorganischen Materialien und Verfahren zu deren Herstellung The carbon hard mask with a nitrogen-doped carbon layer as an adhesion layer capable of adhesion to metal or metal-containing inorganic materials and processes for their preparation |
01/24/2008 | DE102006032925A1 Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Method for the encapsulation of electronic components and integrated circuits |
01/24/2008 | DE102006032195A1 Verfahren zur Herstellung von MEMS-Strukturen A process for the production of MEMS structures |
01/24/2008 | DE102006031769A1 Sensor unit e.g. rotary rate sensor, for use in electronic stability system of vehicle, has casing for covering sensor structure i.e. micromechanical sensor structure, where casing is partially made of porous silicon |
01/24/2008 | DE102006023724A1 Measuring cell device for pressure sensor, has membrane and strength measuring element, impinged with pressure for measuring fluid, where measuring element is connected with side facing away from pressure of membrane |
01/24/2008 | DE102004002908B4 Verfahren zum Herstellen eines Halbleiterbauelements oder einer mikromechanischen Struktur A method of manufacturing a semiconductor device or a micromechanical structure |
01/24/2008 | CA2658403A1 Microfluidic device for crystallization and chrystallographic analysis of molecules |
01/23/2008 | EP1880977A2 Silicon on metal for MEMS devices |
01/23/2008 | EP1713533A4 Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles |
01/23/2008 | EP1461828B1 Method of fabricating micro-electromechanical switches on cmos compatible substrates |
01/23/2008 | CN101111993A Process for producing micromachine, and micromachine |
01/23/2008 | CN101110428A Multi-layer insulator silicon material used for MEMS and method thereof |
01/23/2008 | CN101110355A Method for minute graphic representation of metal with non-plane surface |
01/23/2008 | CN101108721A Method of manufacturing magnetic micro-structure |
01/23/2008 | CN101108720A Micro electro mechanical device and manufacturing method thereof |
01/22/2008 | US7320896 Infrared radiation detector |
01/22/2008 | US7320163 Method of manufacturing an actuator device |
01/22/2008 | CA2450412C Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
01/17/2008 | WO2008007844A1 Method of manufacturing microchannel structure and microfluidic device |
01/17/2008 | WO2008006641A1 Method for the production of mems structures |
01/17/2008 | US20080014530 Graft Pattern-Forming Method, Graft Pattern Material, Lithography Method, Conductive Pattern - Forming Method, Conductive Pattern, Color Filter Producing Method, Color Filter, and Mircrolens Producing Method |
01/17/2008 | DE102006031772A1 Verfahren zur Herstellung eines Sensorelements sowie Sensorelement A process for producing a sensor element and sensor element |
01/17/2008 | DE102006031506A1 Verfahren zur Herstellung von Mikronadeln in einem Si-Halbleitersubstrat A process for the production of micro-needles in a Si semiconductor substrate |
01/16/2008 | EP1878693A1 Encapsulated microcomponent equipped with at least one getter |
01/16/2008 | EP1878042A2 Silicon wafer having through-wafer vias |
01/16/2008 | EP1289876B1 Microstructure and method for the production thereof |
01/16/2008 | CN101104508A Method of forming a micromechanical structure and mould for making micromechanical structure |
01/15/2008 | US7318993 Doping selected regions of a semiconductor mask layer formed on a carrier with a hard mask layer with a selective ion implantation (direct lithographic writing); wet chemical removal of a doped region to form a semiconductor mask; patterning the carrier using the mask (anisotropic etch); high precision |
01/10/2008 | WO2008004597A1 Method for manufacturing microneedle |
01/10/2008 | WO2008003564A1 Method for creating micro needles in a si semiconductor substrate |
01/10/2008 | WO2007119206A3 A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate |
01/10/2008 | DE102007030034A1 Sensoreinrichtung und Verfahren zu deren Herstellung Sensor means and methods for their preparation |
01/10/2008 | DE102006031228A1 Mikromechanisches Bauelement, Verfahren und Verwendung Micromechanical component, process and |
01/09/2008 | CN101101441A Large area periodic array three-dimensional microstructure preparation method |
01/09/2008 | CN101100281A Method for manufacturing suspending structure |
01/09/2008 | CN101100280A Method for manufacturing suspending structure and cavity |
01/09/2008 | CN100360269C Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
01/08/2008 | US7317281 Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
01/03/2008 | WO2008001253A2 Integrated single-crystal mems device |
01/03/2008 | WO2008001252A2 Method for manufacturing mems devices with moveable structure |
01/03/2008 | WO2008000541A1 Method for producing a component, particularly a micromechanical and/or microfluidic and/or microelectronic component, and component |
01/03/2008 | WO2008000467A1 A method for the production of structured layers of titanium and nickel |
01/03/2008 | WO2007126919A3 Non-planar surface structures and process for microelectromechanical systems |
01/03/2008 | WO2007123820A3 Non-planar surface structures and process for microelectromechanical systems |
01/03/2008 | WO2007087247A3 Wafer level chip packaging |
01/03/2008 | US20080000872 Method for forming micro lenses and semiconductor device including the micro lenses |
01/03/2008 | DE102006030267A1 Microstructures producing method involves common stamping of contact opening and cut in ductile material layer, which is formed by substrate, where contact opening and cut correspond to structural components of metallizing structure |
01/03/2008 | DE102006029622A1 Verfahren zur Herstellung eines Bauelements, insbesondere ein mikromechanisches und/oder mikrofluidisches und/oder mikroelektronisches Bauelement und Bauelement A method for manufacturing a device, in particular a micromechanical and / or microfluidic and / or microelectronic device, and component |
01/03/2008 | DE102006028124B3 Mikrotechnologisches Bauteil mit funktionell befülltem Hohlraum und Verfahren zu dessen Herstellung Technological micro component with functional inflated cavity and process for its preparation |
01/02/2008 | CN101096267A Method for making suspension structure |