Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
02/2008
02/20/2008CN101126898A Method for shrinking pi phase migration lithographic feature size using metal layer
02/20/2008CN101126897A Continuous surface micro-structure forming method based on microlens array
02/20/2008CN101126896A Super resolution lithography method based on PDMS template and silver board material
02/20/2008CN101125482A Structure with through hole, production method thereof, and liquid discharge head
02/20/2008CN100370316C Optical attenuator element, and variable optical equalizer and optical amplifier
02/14/2008WO2007144677A3 Cmos integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining and sensor chip comprising such element
02/14/2008WO2007143072A3 Wet etch suitable for creating square cuts in si and resulting structures
02/14/2008WO2007103224A3 Structure and method of making lidded chips
02/14/2008US20080038921 Method of Manufacturing Semiconductor Device
02/14/2008US20080038861 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices
02/14/2008DE102007033132A1 Producing a micro-array useful for e.g. gene expression profiling, comprises mounting photo acid generator on substrate, placing pattern-forming imprint plate on the substrate and applying nucleotide phosphoramidite monomer on substrate
02/13/2008EP1886969A2 Methods of fabrication of wafer-level vacuum packaged devices
02/13/2008EP1885646A1 Microfluidic device with integrated micropump, in particular biochemical microreactor, and manufacturing method thereof
02/13/2008EP1569865B1 Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers
02/13/2008EP1468467B1 A component for electromagnetic waves and a method for manufacturing the same
02/13/2008EP1319239B1 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
02/13/2008CN101121500A Method for manufacturing three-dimensional nerve microelectrode array
02/13/2008CN101121499A Deeply etching method
02/13/2008CN101121498A Method for manufacturing micro-torsion shaft
02/13/2008CN101121497A Carbon nano-tube composite material and preparation method thereof
02/13/2008CN100368786C Method for producing heat shear stress sensor device based on new sacrifice layer process
02/12/2008US7329611 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part
02/12/2008CA2467174C Differential stress reduction in thin films
02/07/2008WO2008015434A1 Method of etching a sacrificial silicon oxide layer
02/07/2008US20080030130 Hermetic encapsulation of organic, electro-optical elements
02/07/2008US20080029878 Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers
02/07/2008DE202007016591U1 Vorrichtung zum Rakeln mit einer in sich geschlossenen Rakel Apparatus for doctoring with a self-blade
02/06/2008CN101120433A Methods and devices for fabricating and assembling printable semiconductor elements
02/06/2008CN101118826A Method for manufacturing carbon nano-tube field transmitting rotating electron source
02/06/2008CN101118819A MEMS switch and manufacturing method thereof
02/06/2008CN101118313A Low temperature fabrication of conductive micro structures
02/06/2008CN101117206A Method for generating tomography between micro-channel structure and substrate in production process of silicon micro-channel by electrochemical process
02/06/2008CN100367109C Nanosize making die using spacer technique
02/05/2008US7326446 Method for coating metal surfaces and substrate having a coated metal surface
02/05/2008US7326296 High throughput screening of crystallization of materials
02/05/2008CA2363414C Integrated monolithic microfabricated dispensing nozzle and liquid chromatography-electrospray system and method
01/2008
01/31/2008WO2007120887A3 Packaging a mems device using a frame
01/31/2008WO2007116345A3 Inter-layer connection for foil mems technology
01/31/2008US20080026328 Method for fabricating a structure for a microelectromechanical systems (mems) device
01/31/2008DE102007033717A1 Manufacturing method for microstructure by three-dimensional treatment of flat component, involves preparing substrate as flat component, where mask is formed on substrate and mask has two openings
01/31/2008DE102007007694A1 Anordnung mit Nanoteilchen und Verfahren zu deren Herstellung Arrangement with nanoparticles and processes for their preparation
01/30/2008CN201014889Y Carbon dioxide supercritical drying mechanism
01/30/2008CN101114591A Pressure capacitance type sensor substrate cavity-forming method
01/30/2008CN100365775C Etching process for micromachining crystalline materials and devices fabricated thereby
01/29/2008US7323354 Method of manufacturing MEMS device
01/29/2008US7322100 Method for producing a micromachined layered device
01/24/2008WO2008009803A2 Production of microfluidic polymeric devices by photo-assisted and/ or thermally assisted printing
01/24/2008WO2008009716A1 Arrangement comprising nanoparticles, and method for the production thereof
01/24/2008US20080020579 Method For Manufacturing A Membrane In A (111) Surface Of A (100) Silicon Wafer
01/24/2008US20080018975 MEMS Device with a Closed Cellular Core Sandwiched Structure
01/24/2008DE10330795B4 Kohlenstoff-Hartmaske mit einer Stickstoff-dotierten Kohlenstoffschicht als haftfähiger Schicht zur Haftung auf Metall oder metallhaltigen anorganischen Materialien und Verfahren zu deren Herstellung The carbon hard mask with a nitrogen-doped carbon layer as an adhesion layer capable of adhesion to metal or metal-containing inorganic materials and processes for their preparation
01/24/2008DE102006032925A1 Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Method for the encapsulation of electronic components and integrated circuits
01/24/2008DE102006032195A1 Verfahren zur Herstellung von MEMS-Strukturen A process for the production of MEMS structures
01/24/2008DE102006031769A1 Sensor unit e.g. rotary rate sensor, for use in electronic stability system of vehicle, has casing for covering sensor structure i.e. micromechanical sensor structure, where casing is partially made of porous silicon
01/24/2008DE102006023724A1 Measuring cell device for pressure sensor, has membrane and strength measuring element, impinged with pressure for measuring fluid, where measuring element is connected with side facing away from pressure of membrane
01/24/2008DE102004002908B4 Verfahren zum Herstellen eines Halbleiterbauelements oder einer mikromechanischen Struktur A method of manufacturing a semiconductor device or a micromechanical structure
01/24/2008CA2658403A1 Microfluidic device for crystallization and chrystallographic analysis of molecules
01/23/2008EP1880977A2 Silicon on metal for MEMS devices
01/23/2008EP1713533A4 Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles
01/23/2008EP1461828B1 Method of fabricating micro-electromechanical switches on cmos compatible substrates
01/23/2008CN101111993A Process for producing micromachine, and micromachine
01/23/2008CN101110428A Multi-layer insulator silicon material used for MEMS and method thereof
01/23/2008CN101110355A Method for minute graphic representation of metal with non-plane surface
01/23/2008CN101108721A Method of manufacturing magnetic micro-structure
01/23/2008CN101108720A Micro electro mechanical device and manufacturing method thereof
01/22/2008US7320896 Infrared radiation detector
01/22/2008US7320163 Method of manufacturing an actuator device
01/22/2008CA2450412C Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
01/17/2008WO2008007844A1 Method of manufacturing microchannel structure and microfluidic device
01/17/2008WO2008006641A1 Method for the production of mems structures
01/17/2008US20080014530 Graft Pattern-Forming Method, Graft Pattern Material, Lithography Method, Conductive Pattern - Forming Method, Conductive Pattern, Color Filter Producing Method, Color Filter, and Mircrolens Producing Method
01/17/2008DE102006031772A1 Verfahren zur Herstellung eines Sensorelements sowie Sensorelement A process for producing a sensor element and sensor element
01/17/2008DE102006031506A1 Verfahren zur Herstellung von Mikronadeln in einem Si-Halbleitersubstrat A process for the production of micro-needles in a Si semiconductor substrate
01/16/2008EP1878693A1 Encapsulated microcomponent equipped with at least one getter
01/16/2008EP1878042A2 Silicon wafer having through-wafer vias
01/16/2008EP1289876B1 Microstructure and method for the production thereof
01/16/2008CN101104508A Method of forming a micromechanical structure and mould for making micromechanical structure
01/15/2008US7318993 Doping selected regions of a semiconductor mask layer formed on a carrier with a hard mask layer with a selective ion implantation (direct lithographic writing); wet chemical removal of a doped region to form a semiconductor mask; patterning the carrier using the mask (anisotropic etch); high precision
01/10/2008WO2008004597A1 Method for manufacturing microneedle
01/10/2008WO2008003564A1 Method for creating micro needles in a si semiconductor substrate
01/10/2008WO2007119206A3 A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
01/10/2008DE102007030034A1 Sensoreinrichtung und Verfahren zu deren Herstellung Sensor means and methods for their preparation
01/10/2008DE102006031228A1 Mikromechanisches Bauelement, Verfahren und Verwendung Micromechanical component, process and
01/09/2008CN101101441A Large area periodic array three-dimensional microstructure preparation method
01/09/2008CN101100281A Method for manufacturing suspending structure
01/09/2008CN101100280A Method for manufacturing suspending structure and cavity
01/09/2008CN100360269C Method of connecting module layers suitable for the production of microstructure components and a microstructure component
01/08/2008US7317281 Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
01/03/2008WO2008001253A2 Integrated single-crystal mems device
01/03/2008WO2008001252A2 Method for manufacturing mems devices with moveable structure
01/03/2008WO2008000541A1 Method for producing a component, particularly a micromechanical and/or microfluidic and/or microelectronic component, and component
01/03/2008WO2008000467A1 A method for the production of structured layers of titanium and nickel
01/03/2008WO2007126919A3 Non-planar surface structures and process for microelectromechanical systems
01/03/2008WO2007123820A3 Non-planar surface structures and process for microelectromechanical systems
01/03/2008WO2007087247A3 Wafer level chip packaging
01/03/2008US20080000872 Method for forming micro lenses and semiconductor device including the micro lenses
01/03/2008DE102006030267A1 Microstructures producing method involves common stamping of contact opening and cut in ductile material layer, which is formed by substrate, where contact opening and cut correspond to structural components of metallizing structure
01/03/2008DE102006029622A1 Verfahren zur Herstellung eines Bauelements, insbesondere ein mikromechanisches und/oder mikrofluidisches und/oder mikroelektronisches Bauelement und Bauelement A method for manufacturing a device, in particular a micromechanical and / or microfluidic and / or microelectronic device, and component
01/03/2008DE102006028124B3 Mikrotechnologisches Bauteil mit funktionell befülltem Hohlraum und Verfahren zu dessen Herstellung Technological micro component with functional inflated cavity and process for its preparation
01/02/2008CN101096267A Method for making suspension structure
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