Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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01/14/2009 | CN100452350C Manufacturing method for non-refrigeration infrared focal plane array based on silicon substrate without sacrifice layer |
01/13/2009 | US7476951 Selective isotropic etch for titanium-based materials |
01/13/2009 | US7476948 Microminiature moving device and method of making the same |
01/13/2009 | US7476561 Method of making microminiature moving device |
01/13/2009 | US7476327 Method of manufacture for microelectromechanical devices |
01/08/2009 | WO2009006340A2 Electromechanical device treatment with water vapor |
01/08/2009 | WO2009006120A1 Microelectromechanical device with optical function separated from mechanical and electrical function |
01/08/2009 | WO2009006119A1 Microelectromechanical device with optical function separated from mechanical and electrical function |
01/08/2009 | WO2009003856A1 Method for the production of a microfluidic system on a polymer surface |
01/08/2009 | WO2008132028A3 Method for producing a micromechanical component having a trench structure for backside contact |
01/08/2009 | US20090011556 Method for producing a microelectronic structure |
01/08/2009 | US20090011493 Device containing cytophilic islands that adhere cells separated by cytophobic regions |
01/08/2009 | DE10102993B4 Herstellungsverfahren für ein mikromechanisches Bauelement Manufacturing method for a micromechanical component |
01/07/2009 | EP2012166A2 Microelectromechanical device with optical function separated from mechanical and electrical function |
01/07/2009 | EP2012165A2 Microelectromechanical device with optical function separated from mechanical and electrical function |
01/07/2009 | EP2011763A1 Method of producing micromechanical parts with crystalline material |
01/07/2009 | EP2011629A1 Method for manufacturing a microfluid system on a polymer surface |
01/07/2009 | EP2010452A2 A method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate |
01/07/2009 | EP2010451A2 Microstructured tool and method of making same using laser ablation |
01/07/2009 | EP2010449A1 Micromechanical component with wafer through-plating and corresponding production method |
01/07/2009 | EP1356511B1 Use of protective caps as masks at a wafer scale |
01/07/2009 | CN101341575A Improved singulation system and method |
01/07/2009 | CN101339202A Semiconductor device and manufacturing method of the same |
01/07/2009 | CN100449789C Method of manufacturing a micro-electrical-mechanical system |
01/07/2009 | CN100449684C Barrier layers for microelectromechanical systems |
01/07/2009 | CN100449336C Optical element and method of manufacturing optical element |
01/07/2009 | CN100448771C Method of predetermining micro structure mechanical property |
01/06/2009 | CA2400025C Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby |
01/06/2009 | CA2376128C Devices and methods for enhanced microneedle penetration of biological barriers |
01/02/2009 | DE10291877B4 Mikroschalter und Verfahren zum Herstellen eines Mikroschalters Micro-switch and method of manufacturing a micro-switch |
01/02/2009 | DE102007030121A1 Verfahren zur Herstellung eines Bauteils und Bauteil A method for producing a component and component |
01/02/2009 | DE102007029333A1 Einsatz von Thermosets beim Strukturieren von Substraten Use of thermosets in patterning of substrates |
01/01/2009 | US20090004765 Method of manufacturing micro-optic device |
01/01/2009 | US20090000365 AFM Tweezers, Method for Producing AFM Tweezers, and Scanning Probe Microscope |
12/31/2008 | WO2009002788A2 Indication of the end-point reaction between xef2 and molybdenum |
12/31/2008 | WO2008114852A3 Mold, mold production process, processing apparatus, and processing method |
12/31/2008 | WO2008094286A3 Method and system for fabricating a nano-structure |
12/31/2008 | WO2008072187A3 Method for improving the bonding properties of microstructured substrates, and devices prepared with this method |
12/31/2008 | WO2008067383A3 Composite substrate sealing methods and resulting devices |
12/31/2008 | WO2008009803A3 Production of microfluidic polymeric devices by photo-assisted and/ or thermally assisted printing |
12/31/2008 | WO2006056967A9 Mechanical microfluidic device, method for producing an intermediate stack and this microfluidic device, and a micropump |
12/31/2008 | WO2003036737A8 Stiffened surface micromachined structures and process for fabricating the same |
12/31/2008 | EP2009802A2 Variable circuit, communication apparatus, mobile communication apparatus and communication system |
12/31/2008 | EP2009472A1 Silicon Structure and Method of Manufacturing the Same |
12/31/2008 | EP2008967A2 Thick active layer for MEMS device using wafer dissolve process |
12/31/2008 | EP2007671A2 Inter-layer connection for foil mems technology |
12/31/2008 | EP1663852B1 Method for singulating devices |
12/31/2008 | EP1485758B1 A method for fabricating a structure for a microelectromechanical systems (mems) device |
12/31/2008 | EP1227534B1 Small-sized phase shifter and method of manufacture thereof |
12/31/2008 | EP1203096B1 Continuous flow micro device in which local temperature cycles act on a flowing sample |
12/31/2008 | CN101332972A Method for making microfluid system |
12/31/2008 | CN101332971A Passing type microwave power detector based on microelectronic mechanical cantilever beam and manufacturing method |
12/31/2008 | CN101332327A 一种微型空心硅针及其制备方法 A miniature silicon hollow needle and its preparation method |
12/31/2008 | CN100448046C Micromachined electromechanical device |
12/31/2008 | CN100447074C Micromachine and method of manufacturing the micromachine |
12/31/2008 | CN100447073C Stack structure and method of manufacturing the same |
12/30/2008 | US7470600 Method and device for controlled cleaving process |
12/25/2008 | US20080314723 Method of making contact posts for a microelectromechanical device |
12/24/2008 | WO2008157480A1 Microfluidic device and method of manufacturing the microfluidic device |
12/24/2008 | EP2006249A2 High resolution plasma etch |
12/24/2008 | EP2004542A1 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof |
12/24/2008 | EP1540716A4 Replication and transfer of microstructures and nanostructures |
12/24/2008 | EP1258035A4 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor |
12/24/2008 | DE102007029445A1 Hierarchically structured films and membranes manufacturing method, involves applying and coating printed fluid structures on substrate with lining fluid, and hardening lining fluid and/or vaporized volatile components |
12/24/2008 | DE102007028288A1 MEMS Bauelement und Verfahren zur Herstellung MEMS device and methods for preparing |
12/24/2008 | CN101329509A Method for manufacturing drag reduction surface |
12/24/2008 | CN101329446A MEMS device with an angular vertical comb actuator |
12/24/2008 | CN101329361A Minitype silicon accelerometer having functions of measuring pressure intensity and temperature variation and its machining method |
12/24/2008 | CN101327905A Method for making mini optical fibre spectrometer narrow slit |
12/24/2008 | CN101327904A Micro structre and manufacture method thereof |
12/24/2008 | CN100446192C Replication and transfer of microstructures and nanostructures |
12/24/2008 | CN100445195C Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
12/18/2008 | WO2008152151A2 Structured layer deposition on processed wafers used in microsystem technology |
12/18/2008 | WO2008086537A3 Aluminum based bonding of semiconductor wafers |
12/18/2008 | WO2008054520A3 Electrode and interconnect materials for mems interferometric modulators |
12/18/2008 | US20080308920 System and method of fabricating micro cavities |
12/18/2008 | DE19957111B4 Halbleitervorrichtung mit flacher Schutzklebstofffolie und Herstellungsverfahren dafür A semiconductor device with a flat protection adhesive film and production method thereof |
12/18/2008 | DE102007027435A1 Verfahren und Vorrichtung zur strukturierten Schichtabscheidung auf prozessierten Mikrosystemtechnikwafern Method and device for patterned layer deposition on the processed wafers Microsystems Technology |
12/18/2008 | DE102007027434A1 Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske A process for producing calibration structures for a patterned layer deposition on a wafer by means of microsystem technology of a coating mask |
12/18/2008 | DE102007026879A1 Verfahren zum Herstellen einer Struktur auf oder in einem Substrat, Abbildungsschicht zum Erzeugen sublithographischer Strukturen, Verfahren zum Invertieren eines sublithographischen Musters, durch Herstellung einer Struktur erhältliche Einrichtung A method of producing a structure on or in a substrate, the imaging layer for generating sublithographic structures, procedures for inverting a sublithographic pattern, obtainable by manufacturing a structure means |
12/17/2008 | EP2003091A2 Substrate with microfine metallic lumps arranged on surface |
12/17/2008 | EP1155442B1 Method for fabricating a multilayer structure with controlled internal stresses |
12/17/2008 | CN101325382A Grasping-lifting drive type minitype motor capable of reducing drive voltage as well as manufacture method and usage thereof |
12/17/2008 | CN101324473A Piezoresistance sensor chip and machining process thereof |
12/17/2008 | CN101323428A Patterned contact sheet to protect critical surfaces in manufacturing processes |
12/17/2008 | CN101323427A Method for preparing silicon micro-suspension girder leadless piezoelectric thick film executor |
12/17/2008 | CN101323426A Minisize inertia device structure in overweight mass block surface and manufacturing method thereof |
12/17/2008 | CN100443397C Microcooling observing and controlling system and machining method thereof |
12/16/2008 | US7466065 Bimorph switch, bimorph switch manufacturing method, electronic circuitry and electronic circuitry manufacturing method |
12/16/2008 | US7465977 Method for producing a packaged integrated circuit |
12/16/2008 | US7465405 Method of fabricating printheads having multiple nozzle assemblies |
12/11/2008 | WO2008150016A1 Piezoelectric mirror device, optical device using the piezoelectric mirror device and method for manufacturing piezoelectric mirror device |
12/11/2008 | WO2008148736A2 Method for producing a mems package |
12/11/2008 | WO2008091741A3 Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly |
12/11/2008 | US20080305440 Apparatus for fabricating nanoscale patterns in light curable compositions using an electric field |
12/11/2008 | DE10392426B4 Halbleitervorrichtungs-Herstellungsverfahren A semiconductor device manufacturing method |
12/11/2008 | DE102008025691A1 Piezoelektrischer dünner Film, piezoelektrisches Material und Herstellungsverfahren für piezoelektrischen dünnen Film und piezoelektrisches Material, und piezoelektrischer Resonator, Schalterelement und physikalischer Fühler, die piezoelektrischen dünnen Film verwenden A piezoelectric thin film piezoelectric material and manufacturing method of piezoelectric thin film and piezoelectric material and piezoelectric resonator element and switch physical sensors that use piezoelectric thin film |
12/11/2008 | DE102007038396B3 Micromechanical device has micromechanical construction unit, which has substrate and cap, and cap has outside edge that has multiple staged range chamfer or curvature in area |
12/11/2008 | DE102007026510A1 Device for fixing ultra thin silicon chips or micro optics, has base made of polymer, metallic nano-actuator, and expansion, where nano-actuator has two ends facing base of device |
12/11/2008 | DE102007026450A1 Sensor e.g. pressure sensor, for pressure measurement, has substrate material and material staying in contact with one another in transition area, where substrate material exhibits nut, which is formed in area in substrate material |