Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
08/2008
08/07/2008DE19911916B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit Schutzlage A process for producing a semiconductor device with protective layer
08/07/2008DE102008005350A1 Mikrofluidische Vorrichtungen mit Nanokanälen Microfluidic devices with nanochannels
08/07/2008DE102006023724B4 Messzellenanordnung für einen Drucksensor mit Kraftmesselement aus Glas Measuring cell arrangement for a pressure sensor with force-measuring element made of glass
08/06/2008EP1953817A1 Sensor device and method for manufacturing same
08/06/2008EP1953815A1 Wafer level package structure and sensor device obtained from such package structure
08/06/2008EP1953814A1 Wafer level package structure and method for manufacturing same
08/06/2008EP1953583A2 Micro mirror arrays and microstructures with solderable connection sites
08/06/2008EP1952405A1 A micro-electromechanical system memory device and method of making the same
08/06/2008EP1951611A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
08/06/2008EP1951610A1 Method of forming supports bearing features, such as lithography masks
08/06/2008EP1951609A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
08/06/2008EP1562742A4 Microstructures and methods of fabrication thereof
08/06/2008EP1377338B1 Method of manufacturing microneedle structures using soft lithography and photolithography
08/06/2008CN101238060A Method for manufacturing a microelectronic package comprising a silicon MEMS microphone
08/06/2008CN101234744A Method for preparing GaAs micro/nono optical element
08/06/2008CN100408336C Thermoelastic expanding element
08/05/2008US7408283 Micromachined ultrasonic transducer cells having compliant support structure
08/05/2008US7407614 Method for forming at least one protective cap
07/2008
07/31/2008WO2008091741A2 Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly
07/31/2008WO2008090428A1 Surface roughening process
07/31/2008WO2008090426A1 Process for forming and controlling rough interfaces
07/31/2008WO2008089862A1 Method for the production of a component and sensor element
07/31/2008WO2008057911A3 Microelectronic flow sensor packaging method and system
07/31/2008WO2008051781A3 Vertically integrated mems
07/31/2008WO2008014305A3 A multi-die apparatus including moveable portions
07/31/2008US20080182386 Controlled cleaving process
07/31/2008US20080182273 allowed to mix by diffusion without convective flow across the interface; protein crystallization system; gradual and non-directional mixing, avoiding asymmetries and steep concentration gradients associated with convective flow between the fluids
07/31/2008US20080179555 Electrostatic Actuation For Management of Flow in Micro-Total Analysis Systems (u-Tas) and Related Method Thereof
07/31/2008US20080179279 Method for Electrochemical Fabrication
07/31/2008DE202008007122U1 Einrichtung zur Erzeugung von mikrostrukturierten Funktionsoberflächen auf Substraten mit wenigstens einem Laser Means for generating microstructured functional surfaces on substrates with at least one laser
07/31/2008DE19738607B4 Mikrospiegel und Verfahren zur Herstellung eines Mikrospiegels Micro-mirrors and method for the production of a micromirror
07/31/2008DE102007012689B3 Component e.g. micro-actuator, manufacturing method, involves connecting layers of flat material in stack by forming micro-structured component by joining process, and forming micro-impression at laminated side of flat material
07/31/2008DE102007004344A1 Method for producing half taper micro needles in silicon semiconductor substrate for application of substances into skin, involves applying and structuring masking layer on external surface of front side of silicon semiconductor substrate
07/31/2008DE102007003544A1 Verfahren zur Herstellung eines Bauteils und Sensorelement A process for the production of a component and the sensor element
07/31/2008DE102006032925B4 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Electronic assembly and method for encapsulating electronic devices and integrated circuits
07/30/2008EP1950175A1 Process for manufacturing a package for a component on a substrate
07/30/2008EP1949147A1 Method of producing a diffraction grating element
07/30/2008EP1948852A1 Master electrode and method of forming the master electrode
07/30/2008EP1948716A2 Hyperbranched polymer for micro devices
07/30/2008CN101233072A A method of processing substrates
07/30/2008CN101231473A Replication and transfer of microstructures and nanostructures
07/29/2008US7405135 Substrate for stressed systems and method of making same
07/24/2008WO2008088067A1 Process for producing fluorocarbon microstructure, fluorocarbon microstructure, and microsystem
07/24/2008WO2008086907A1 Method for producing a component and sensor element
07/24/2008WO2008024528A3 Method of forming a micromachined device using an assisted release
07/24/2008US20080174204 Electromechanical element, electric circuit device and production method of those
07/24/2008US20080173365 Microfabricated elastomeric valve and pump systems
07/24/2008US20080173354 Micro-machined temperature dependent one-shot valve and process for production thereof
07/24/2008DE102007002832A1 Method for manufacturing device with arrangement of micro-needles, involves preparing silicon semiconductor substrate, whose surface is applied and structured with masking layer
07/23/2008EP1945562A2 Wafer level packaging process
07/23/2008CN101226856A Micro-switching device and method of manufacturing the same
07/23/2008CN101226850A Silicon micro mechanical pressure switch, preparation method and uses thereof
07/23/2008CN101226081A Enhanced type infrared absorption plate for optical read-out heat type infrared image sensor and preparation method thereof
07/23/2008CN101224866A Micro-switching device
07/23/2008CN101224865A Micro-switching device and manufacturing method thereof
07/23/2008CN100405135C A device having a light-absorbing mask and a method for fabricating same
07/23/2008CN100404408C Non-refrigeration infrared detector heat insulation substrate preparation method
07/22/2008US7402877 Micromachine and method of manufacturing the micromachine
07/22/2008US7402449 Integrated micro electro-mechanical system and manufacturing method thereof
07/22/2008US7401549 Arrangement for transferring information/structures to wafers
07/17/2008WO2008085451A2 Switches for shorting during mems etch release
07/17/2008WO2008085429A2 Microfluidic structures with integrated devices
07/17/2008WO2008084365A2 Etching with improved control of critical feature dimensions at the bottom of thick layers
07/17/2008WO2008067431A3 Microphone system with silicon microphone secured to package lid
07/17/2008WO2008062350A3 A sealing structure and a method of manufacturing the same
07/17/2008WO2008052762A3 Semiconductor arrangement and method for fabricating a semiconductor arrangement
07/17/2008DE102007002273A1 Verfahren zur Herstellung eines Bauteils und Sensorelement A process for the production of a component and the sensor element
07/17/2008DE102007001518A1 Vorrichtung und Verfahren zum Häusen mikromechanischer Systeme Apparatus and method for housing micromechanical systems
07/17/2008DE102006003718B4 Mikro-elektro-mechanisches Bauelement und Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente Micro-electro-mechanical component and manufacturing process for integrated micro-electro-mechanical components
07/16/2008EP1943184A1 Non-volatile memory device
07/16/2008CN101223630A Diamond medical devices
07/16/2008CN101223101A Microfluidic device with integrated micropump, in particular biochemical microreactor, and manufacturing method thereof
07/16/2008CN101222792A Sound transducer structure and method for manufacturing a sound transducer structure
07/16/2008CN101221911A Packaging micro devices
07/16/2008CN101219770A Laser modeling method for semiconductor material micro-nano multi-scale function surface
07/16/2008CN100403033C Bonding technology for silicon micro acceleration transducer
07/16/2008CN100402850C Microfabricated elastomeric valve and pump systems
07/16/2008CN100402414C Spacer fabrication process for manufacturing reflective stealth mirrors and other mems devices
07/16/2008CN100402413C Prefabricated method for thin film microcrack and special apparatus for the same
07/16/2008CN100402411C Micromachine and method of producing the same
07/15/2008US7399652 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
07/15/2008US7399585 Detecting and measuring the concntration of preferential particles in solution; a substrate; obtain substrate, expose to electrodes, generate electric current, monitor actvity of particle in sample
07/15/2008US7399579 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure
07/15/2008US7398588 SOI component comprising margins for separation
07/10/2008US20080167601 Microneedles to be placed in the skin for the transdermal application of pharhmaceuticals
07/10/2008US20080165409 Micromirror unit with torsion connector having nonconstant width
07/10/2008DE10260860B4 Schicht aus Si1-xGex, Verfahren zu deren Herstellung und mikromechanisches Bauelement damit Layer of Si1-xGex, to processes for their preparation and micromechanical component thus
07/10/2008DE10222609B4 Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat A process for the production of structured layers on substrates and methods according coated substrate
07/10/2008DE102007001290A1 Module comprises semiconductor chip with mobile element, where substrate is made of glass or semiconductor material and covers main surface of semiconductor chip, and another substrate is made of glass or semiconductor material
07/10/2008DE10161243B4 Mikrostrukturierung mit ultraschallunterstütztem Schleifen Microstructuring with ultraschallunterstütztem loops
07/09/2008EP1940733A2 Microfabrication
07/09/2008EP1940731A1 Method for etching a sacrificial layer for a micro-machined structure
07/09/2008EP1568655B1 Micromachine and method of producing the same
07/09/2008CN101216358A Grid pressure sensing chip and preparation method, pressure distributed sensor
07/09/2008CN101214917A Fabricating micro devices using sacrificial materials
07/09/2008CN101214916A Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof
07/09/2008CN100401192C Method for fabricating a structure for a microelectromechanical system (MEMS) device
07/08/2008US7397097 Integrated released beam layer structure fabricated in trenches and manufacturing method thereof
07/08/2008US7396741 Method for connecting substrate and composite element
07/08/2008US7396698 Methods and systems for providing MEMS devices with a top cap and upper sense plate
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