Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
10/2008
10/30/2008WO2008130847A1 Extensions of self-assembled structures to increased dimensions via a 'bootstrap' self-templating method
10/30/2008DE10317889B4 Mikromechanisches Bauteil und Verfahren zu seiner Herstellung Micromechanical element and process for its preparation
10/30/2008DE102007019647A1 Verfahren zur Herstellung eines mikromechanischen Bauelements mit Auffüllschicht und Maskenschicht A process for producing a micromechanical component having filler layer and mask layer
10/30/2008DE102007019639A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
10/30/2008DE102007019638A1 Verfahren zur Herstellung eines mikromechanischen Bauelements mit Trenchstruktur zur Rückseitenkontaktierung A process for producing a micromechanical component having the back-side trench structure
10/30/2008DE102007019031A1 Optoelectronic device, has optoelectronic module fastened to module carrier e.g. molded interconnect device, and under-filling inserted into region between optoelectronic module and carrier, and forming lens
10/29/2008EP1984462A1 Electrografting method for forming and regulating a strong adherent nanostructured polymer coating
10/28/2008US7443017 Package having bond-sealed underbump
10/28/2008US7442556 For providing a fluid sample directly from the microfluidic device to an analytical device such as mass spectrometer; deliver nanoliter scale samples with a uniform low sample flow rate for direct analysis
10/28/2008US7442336 Capillary imprinting technique
10/28/2008US7442316 Microcontact printing method using imprinted nanostructure and nanostructure thereof
10/23/2008WO2008125094A2 Method for forming a nanostructure and/or microstructure on a surface, and apparatus for carrying out said method
10/23/2008WO2008056190A3 Ordered array of nanostructures and method of fabrication
10/23/2008US20080257861 Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array
10/23/2008US20080257497 Device for manufacturing a silicon structure, and manufacturing method thereof
10/23/2008DE102007019033A1 Optoelectronic assembly, has carrier i.e. molded interconnect device, with opening i.e. linear hopper, in wall region to ensure coupling between component and fiber, where opening is designed such that size of opening changes between sides
10/23/2008DE102007017855A1 Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement A process for producing an optoelectronic component and optoelectronic component
10/23/2008DE102004031424B4 Mikrochemischer Chip und Verfahren zu dessen Herstellung Microchemical chip and process for its preparation
10/22/2008EP1981805A1 Method for low-temperature sealing of a cavity under vacuum or under controlled atmosphere
10/22/2008EP1711961A4 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
10/22/2008CN101290395A Minisize multifunctional optical devices and method for making same
10/22/2008CN101290255A 0-50pa single slice silicon based SOI ultra-low micro pressure sensor and its processing method
10/22/2008CN101289182A Method for preparing carbon nano-tubes by gas induce and products produced thereby
10/22/2008CN101289160A 0-100Pa monolithic silicon based SOI high-temperature low drift micropressure sensor and processing method thereof
10/16/2008WO2008124595A2 Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications
10/16/2008WO2008124372A2 Eliminate release etch attack by interface modification in sacrificial layers
10/16/2008WO2008124219A2 Registered structure formation via the apllication of directed thermal energy to diblock copolymer films
10/16/2008WO2008123525A1 Fabry-perot type wavelength-variable filter and its manufacturing method
10/16/2008DE102008012826A1 Verfahren zur Erzeugung einer mikro-mechanischen Struktur aus zweidimensionalen Elementen und mikromechanisches Bauelement Method for producing a micromechanical structure from two-dimensional elements and micromechanical component
10/16/2008DE10013067B4 Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung A process for producing a semiconductor device by dicing the wafer and release device
10/15/2008EP1979268A2 Packaging a mems device using a frame
10/15/2008EP1495153B1 Method for coating metal surfaces
10/15/2008EP1341655B1 Method of making a product with a micro or nano sized structure
10/15/2008CN101286003A Drum die structure and method of manufacture
10/15/2008CN101284643A Method for fabricating a structure for a microelectromechanical systems (MEMS) device
10/15/2008CN100426479C Bonding method and apparatus
10/15/2008CN100425524C Electromagnet excitated high order mode silicon micromechanical cantilever driving structure, its production method and uses
10/15/2008CN100425420C Method of producing resin molded product
10/14/2008US7435614 Method for treating a structure to obtain an internal space and structure having an internal space
10/09/2008WO2008121828A2 Methods of macromolecular analysis using nanochannel arrays
10/09/2008WO2008121390A1 Extruded body devices and methods for fluid processing
10/09/2008DE102008013116A1 Verfahren zur Erzeugung einer mikromechanischen Struktur Method for producing a micromechanical structure
10/09/2008DE102008013098A1 Mikromechanisches Bauelement mit Temperaturstabilisierung und Verfahren zur Einstellung einer definierten Temperatur oder eines definierten Temperaturverlaufes an einem mikromechanischen Bauelement Micromechanical component with temperature stabilization and method for setting a defined temperature or a defined temperature profile on a micromechanical device
10/09/2008DE102007016135A1 Method for structuring substrate material, involves arranging mask structure on main surface of substrate material in two substrate areas, and mask structure is removed above substrate area during short time interval
10/09/2008DE102007015726A1 Auslenkbare Struktur, mikromechanische Struktur mit derselben und Verfahren zur Einstellung einer mikromechanischen Struktur Deflectable structure, micromechanical structure with the same and method for adjusting a micromechanical structure
10/09/2008CA2682275A1 Methods of macromolecular analysis using nanochannel arrays
10/08/2008EP1978555A1 Microelectronic machine and method for manufacturing same
10/08/2008EP1977991A2 Micro-structured components with a substrate and a chip directly contacting the substrate, and method for its manufacture
10/08/2008EP1641710B1 Micromechanical apparatus and method of forming a micromechanical device layer
10/08/2008EP1296886B1 Method for producing a micromechanical component
10/08/2008EP1084076B1 Chlorotrifluorine gas generator system
10/08/2008CN101281795A Method for preparing silicon probe
10/08/2008CN101281133A Preparation of surface reinforced Raman active substrate of large area micro-nano dendritical structure array
10/08/2008CN101279713A Manufacturing method for floating type micro-silicon electrostatic gyro/accelerometer sensitive structure
10/08/2008CN101279712A Method for generating a micromechanical structure
10/08/2008CN101279711A Method of fabricating a micromechanical structure out of two-dimensional elements and micromechanical device
10/08/2008CN101279710A Method for judging wafer backside alignment overlay accuracy and wafer thereof
10/08/2008CN101279707A Deflectable structure, micromechanical structure comprising same, and method for adjusting a micromechanical structure
10/07/2008US7433811 Direct patterning of silicon by photoelectrochemical etching
10/07/2008US7432587 Integrated device including connections on a separate wafer
10/07/2008US7432572 Method for stripping sacrificial layer in MEMS assembly
10/07/2008US7431858 For microstructuring electronic components, which yields high resolutions ( <== 200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods; semiconductors
10/07/2008US7431766 Crystal-structure-processed devices, methods and systems for making
10/02/2008WO2008085451A3 Switches for shorting during mems etch release
10/02/2008WO2008079169A3 Nanonozzle device arrays: their preparation and use for macromolecular analysis
10/02/2008US20080237826 Method for protecting encapsulated sensor structures using stack packaging
10/02/2008US20080236669 Microfabricated elastomeric valve and pump systmes
10/01/2008EP1975120A2 Microchemical chip and method for fabricating the same
10/01/2008EP1975119A1 Method for obtaining microfluidic polymer structures
10/01/2008CN101277897A Non-volatile memory device
10/01/2008CN101276807A Semiconductor device and method of manufacturing the same
10/01/2008CN101276020A Method for preparing microelectron mechanical system optical multiplexer chip
10/01/2008CN101275805A Carbon dioxide supercritical drying device of semiconductor refrigeration
10/01/2008CN101274741A Micro movable device, wafer, and method of manufacturing wafer
10/01/2008CN101274740A Hot shearing stress sensor preparation based on silicon dioxide characteristic
10/01/2008CN101274739A Preparation for non-contact micro-electronic mechanical system infrared temperature alarm
10/01/2008CN101274738A Hot shearing stress sensor preparation based on polysilicon characteristic
10/01/2008CN101274737A Multicomponent 1-3 composite microstructure film and preparation thereof
10/01/2008CN101274736A Three-dimensional microstructures and methods of formation thereof
10/01/2008CN101274735A Three-dimensional microstructures and methods of formation thereof
10/01/2008CN101274734A Three-dimensional microstructures and methods of formation thereof
10/01/2008CN101274469A Construction method of micro point array in microchannel
10/01/2008CN100423311C Production of micromechanical infrared detector array based on double material effect
10/01/2008CN100423310C Micromechanical thermalelectric-stack infrared detector compatible with co-complementive metal oxide semiconductor technology and preparing method
10/01/2008CN100423209C Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material
10/01/2008CN100422071C Disc grade packing tech. for micro mechanical acceleration counter
10/01/2008CN100422070C Mobile microstructure cosupported by silicon and silicon dioxide, and its production method
09/2008
09/30/2008US7429495 System and method of fabricating micro cavities
09/25/2008WO2008114760A1 Piezo-diode cantilever mems
09/25/2008WO2008113325A2 Method for producing a micromechanical component comprising a partial protective layer
09/25/2008US20080231937 Spatial Light Modulator Using an Integrated Circuit Actuator and Method of Making and Using Same
09/25/2008US20080230392 Substrate, dielectric, electrolyte solution or melt; multilayer three-dimensional structure;passing electrical current is passed through substrate, dielectric into electrolyte
09/25/2008US20080230390 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating
09/25/2008DE102007014468A1 Drucksensor-Chip Pressure sensor chip
09/25/2008DE102007013329A1 Verfahren zur Herstellung eines mikromechanischen Bauelements mit einer partiellen Schutzschicht A process for producing a micromechanical component having a partial protective layer
09/24/2008EP1971548A2 Method of forming a sealed channel of a microfluidic reactor and a microfluidic reactor comprising such channel
09/24/2008CN101271842A Electrochemical processing method for micro-structure of P type silicon surface
09/24/2008CN101271124A L-beam piezoresistance type micro-accelerometer and production method thereof
09/24/2008CN101271028A Silicon pressure transducer chip and method based on silicon-silicon linking and silicon-on-insulating layer
09/24/2008CN101269790A Surface discharge element and method of making the same microcomputer electric component and method for manufacturing same
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