Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
02/2009
02/24/2009US7495302 Micromechanical component having a diaphragm
02/24/2009US7494555 Microfabricated elastomeric valve and pump systems
02/24/2009CA2224278C Flow-through sampling cell and use thereof
02/19/2009WO2008124372A3 Eliminate release etch attack by interface modification in sacrificial layers
02/19/2009DE102007035633A1 Micromechanical structure e.g. electrostatic drive, manufacturing method, involves using structures etched in silicon substrate as negative region, removing partial regions of substrate and opening galvanically produced metal structures
02/18/2009EP1349731B1 Microscale nozzle and method for manufacturing the same
02/18/2009CN101368826A Vibration isolation frame work decoupled silicon micro-gyroscope and preparation thereof
02/18/2009CN101368825A Angle vibration silicon micro-gyroscope and preparation thereof
02/18/2009CN101367504A Method for manufacturing micro-electronic mechanical system with micro-mirror
02/17/2009US7491422 Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate
02/17/2009US7491288 Method of cutting laminate with laser and laminate
02/12/2009WO2009020682A2 Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof
02/12/2009WO2009019316A2 Method for forming mems structures comprising narrow gaps
02/12/2009WO2009019266A2 Method of low-temperature transfer from a layer of self-assembled molecules
02/12/2009US20090038948 Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures
02/11/2009EP2023357A1 A method for fabricating a capacitor and a capacitor
02/11/2009EP2022753A1 Flexible micro/nanofluidic devices
02/11/2009EP2022633A2 Sensor device and printing machine with a sensor device
02/11/2009EP2021860A2 Patterning of mechanical layer in mems to reduce stresses at supports
02/11/2009EP2021273A2 Electrode and interconnect materials for mems devices
02/11/2009EP2021113A2 Microfluidic devices
02/11/2009CN101363731A Rock quartz micro mechanical gyroscope based on shear stress detection and method for making same
02/11/2009CN100461448C Wafer-level seal for non-silicon-based devices
02/11/2009CN100460028C Miniature needle array for medicine transmission and making process thereof
02/10/2009US7489837 Optical microelectromechantical structure
02/07/2009CA2638477A1 Integrated electrical cross-talk walls for electrostatic mems
02/05/2009WO2009016304A2 Method for coating two elements hybridized by means of a soldering material
02/05/2009WO2009015984A2 Wafer joining method, wafer assemblage, and chip
02/05/2009US20090035838 Microfabricated Crossflow Devices and Methods
02/05/2009DE102007037375A1 Verfahren zum Ausbilden einer Struktur auf einem Substrat und ein Bauelement A method of forming a structure on a substrate and a component
02/05/2009DE102007035858A1 Integrated circuit for use in e.g. semiconductor device, has memory cell array with spatially positioned cavities, where size of cavities are selected such that mechanical stress occurring inside array is compensated partially by cavities
02/05/2009DE102007035721A1 Mikroventil, Verfahren zum Herstellen eines Mikroventils sowie Mikropumpe Microvalve method of making a microvalve and micropump
02/05/2009DE102007035693A1 Monolithisches, poröses Bauteil aus im wesentlichen parallelen Nanoröhren, Verfahren zu dessen Herstellung und Verwendung desselben Of the same monolithic, porous member of substantially parallel nanotubes, a process for its preparation and use
02/05/2009DE102007034963A1 Zelle mit einer Kavität und einer die Kavität umgebenden Wandung, Verfahren zur Herstellung einer derartigen Zelle, deren Verwendung und Wandung mit einer darin ausbildbaren Ausnehmung Cell with a cavity and a wall surrounding the cavity, methods of making such a cell, the use of which and the wall with a recess embodied therein
02/04/2009EP2020021A1 Improved semiconductor seal ring
02/04/2009EP2019812A1 Method for producing a micromechanical component, and micromechanical component
02/04/2009CN101360851A Master electrode and method for manufacturing it
02/04/2009CN101360680A Method of forming a sealed channel of a microfluidic reactor and a microfluidic reactor comprising such channel
02/04/2009CN101360354A Electronic component, fabrication method for the same and electronic device having the same
02/04/2009CN101359605A Method of room temperature covalent bonding
02/04/2009CN101358941A Double-face nanometer band electrode array integration sensor capable of being cut and method for manufacturing same
02/04/2009CN101357747A Preparation method of no-refrigeration infrared focal plane micro-bridge structure
02/04/2009CN100459031C Silica micro-mechanical two-dimensional obliquity sensor silicon chip and production method
02/04/2009CN100457887C Biological identification system with integrated sensor chip
02/03/2009US7485485 Method and apparatus for making a MEMS scanner
01/2009
01/29/2009WO2009014118A1 Mems sensor, and mems sensor manufacturing method
01/29/2009WO2009013255A2 Method for transferring an epitaxial layer from a donor wafer to a system wafer appertaining to microsystems technology
01/29/2009WO2008148917A3 Production method for a micrometric fluid focusing device
01/29/2009WO2008124595A3 Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications
01/29/2009WO2008113325A3 Method for producing a micromechanical component comprising a partial protective layer
01/29/2009WO2008079887A3 Stacked mems device
01/29/2009US20090029500 Hermetic pacakging and method of manufacture and use therefore
01/29/2009DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed
01/29/2009DE102005063368B4 Chemische Reaktionspatrone Chemical reaction cartridge
01/28/2009EP2019081A2 Boron doped shell for MEMS device
01/28/2009EP2019080A2 Method of controlling film stress in MEMS devices
01/28/2009CN101355076A Integrated circuit having a semiconductor substrate with a barrier layer
01/28/2009CN101354404A Metal-silicon compound cantilever beam type microelectronic mechanical system probe card and manufacture method thereof
01/28/2009CN101353153A MEMS sensor and manufacturing method thereof
01/28/2009CN101353152A MEMS sensor and manufacturing method thereof
01/28/2009CN100456422C Pattern transfer method
01/28/2009CN100456418C Method of mfg. self-collating nanotube array and nano points
01/27/2009US7482730 High performance MEMS scanner
01/27/2009US7482196 Method of manufacturing a semiconductor device having MEMS
01/27/2009US7482190 Micromechanical strained semiconductor by wafer bonding
01/27/2009US7482052 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
01/22/2009WO2009010391A1 Method for etching a layer of a silicon semiconductor substrate
01/22/2009WO2008118635A3 Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphipilic monolayers
01/22/2009WO2008106928A3 Method for the production of membranes that can be electrically and/or magnetically activated, and magnetic actuator having such a membrane
01/22/2009WO2008100279A3 Selective etching of mems using gaseous halides and reactive co-etchants
01/22/2009US20090019847 Stepping Actuator and Method of Fabrication
01/22/2009DE10233462B4 Vorrichtung zum Prägen und zur Entformung von Strukturkörpern Apparatus for embossing and demolding of structural bodies
01/22/2009DE102007034888B3 Mikrosystem und Verfahren zum Herstellen eines Mikrosystems Micro system and method for producing a microsystem
01/22/2009DE102007034701A1 Halbleitersubstrat und Verfahren zum Herstellen eines Halbleiterbauelements Semiconductor substrate and method for fabricating a semiconductor device
01/22/2009DE102007025649A1 Verfahren zum Übertragen einer Epitaxie-Schicht von einer Spender- auf eine Systemscheibe der Mikrosystemtechnik A method for transmitting an epitaxial layer of a donor to a system disk microsystem technology
01/21/2009EP2017888A2 Electronic component package and method of manufacturing the same, and electronic component device
01/21/2009EP2017628A1 Physical sensor and method of manufacturing
01/21/2009EP2016997A1 Microfluidic device, method of mixing, process of manufacturing and use of the device
01/21/2009EP2016023A2 Superhydrophobic surfaces and fabrication process
01/21/2009EP1264336B1 Forming microscale structures from polycrystalline materials
01/21/2009CN101351401A Process of forming a microphone using support member
01/21/2009CN101351400A Method for manufacturing micromechanical components
01/21/2009CN101349560A Horizontal attitude sensitive chip and manufacturing method thereof, horizontal attitude sensor
01/21/2009CN100453444C Method for producing nano-stamped template by laminated sided-wall technology
01/20/2009US7479318 Fibrillar microstructure and processes for the production thereof
01/20/2009US7479234 Method for producing cavities having optically transparent wall
01/20/2009US7479232 Method for producing a semiconductor component and a semiconductor component produced according to the method
01/20/2009US7479186 Systems and methods for mixing reactants
01/15/2009WO2008132024A3 Method for producing a micromechanical component having a filler layer and a masking layer
01/15/2009US20090015903 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices
01/15/2009DE102006052192B4 Schichtenverbund mit nicht durchgängigen Öffnungen, Verfahren zur Herstellung und Bauelement damit Composite layers so with non-conducting apertures, methods of making and component
01/15/2009DE102005063369B4 Verfahren zum Betätigen einer chemischen Reaktionspatrone A method of operating a chemical reaction cartridge
01/14/2009EP2014612A2 Method of manufacturing micro electro mechanical systems device
01/14/2009EP2013137A1 Process for collective manufacturing of small volume high precision membranes and cavities
01/14/2009EP1544161B1 Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
01/14/2009EP1221176B1 Method of etching a layer using sacrificial elements
01/14/2009EP1186002A4 Ic-compatible parylene mems technology and its application in integrated sensors
01/14/2009CN101344413A Flat diaphragm type gas flow sensor and method of producing the same
01/14/2009CN101343033A Method for manufacturing miniature spring mechanical sensor for film performance test
01/14/2009CN101342404A Method for manufacturing different-plane metal hollow fine needle for transdermal drug administration
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