| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 03/18/2010 | WO2010029656A2 Mems device and method for manufacturing the same |
| 03/18/2010 | WO2009102902A3 Rotary nanotube bearing structure and methods for manufacturing and using the same |
| 03/18/2010 | US20100068107 Methods of making microfluidic devices and devices resulting |
| 03/18/2010 | US20100068105 Microfluidic structures and how to make them |
| 03/18/2010 | DE102008042106A1 Verkapselung, MEMS sowie Verfahren zum Verkapseln Encapsulation, MEMS and method for encapsulating |
| 03/17/2010 | EP1527011B1 Layer system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof |
| 03/17/2010 | CN201423579Y Silicon chip clamping device |
| 03/17/2010 | CN101673753A Piezoelectric transistor and method of manufacturing same |
| 03/17/2010 | CN100594177C Method for preparing carbon nano-tubes by gas induce and products produced thereby |
| 03/16/2010 | US7678454 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part |
| 03/16/2010 | US7678289 Metrology structure and methods |
| 03/11/2010 | WO2010025515A1 Method for fabricating microstructured cell culture devices |
| 03/11/2010 | WO2009151836A3 Fabrication of microscale tooling |
| 03/11/2010 | WO2009149197A3 High aspect ratio microelectrode arrays enabled to have customizable lengths and methods of making the same |
| 03/11/2010 | DE112008000478T5 Verfahren zum Herstellen selbsttragender Membranen A method for producing a self-supporting membranes |
| 03/11/2010 | DE102009034231A1 Passive Temperaturkompensation von Silizium-Mems-Bauelementen Passive temperature compensation of silicon Mems devices |
| 03/11/2010 | DE102008041942A1 Sensoranordnung, Verfahren zum Betrieb einer Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement, method of operating a sensor arrangement and method of manufacturing a sensor arrangement |
| 03/09/2010 | US7673375 Method of fabricating a polymer-based capacitive ultrasonic transducer |
| 03/04/2010 | US20100053578 Apparatus for imprint lithography using an electric field |
| 03/04/2010 | DE112005000355B4 Verfahren zur Herstellung eines Formteils oder einer Beschichtung A process for producing a molding or a coating |
| 03/04/2010 | DE102009038706A1 Sensorbauelement Sensor device |
| 03/04/2010 | DE102008045540A1 Producing microstructured film, by applying formulation capable to radiation-induced reaction on substrate surface, radiating part of formulation in laterally resolved manner to develop structure carrier with microstructured surface areas |
| 03/04/2010 | DE102008041757A1 Herstellungsverfahren für eine Rotationssensorvorrichtung und Rotationssensorvorrichtung Manufacturing method of a rotation sensor device and the rotation sensor device |
| 03/04/2010 | DE102008041721A1 Micromechanical component i.e. acceleration sensor, manufacturing method, involves fastening lower side of element on upper side of another element, and removing silicon substrate of latter element after fastening process |
| 03/04/2010 | DE102008041674A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof |
| 03/04/2010 | DE102008041656A1 Method for manufacturing component, involves preparing two wafers, where contact opening extending perpendicular to main extension plane of former wafer is made in former wafer |
| 03/04/2010 | DE102008041587A1 Microstructured temperature sensor element for spatially resolved detection of infrared radiation, has infrared radiation absorbing layer arranged on passivation layer, where absorbing layer is isolated from gas phase |
| 03/03/2010 | EP2159558A1 A method for manufacturing an integrated pressure sensor |
| 03/03/2010 | EP2159191A2 Silicon processing method and silicon substrate with etching mask |
| 03/03/2010 | EP2159190A2 Process for packaging a MEMS component |
| 03/03/2010 | EP2158476A2 Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof |
| 03/03/2010 | CN101659391A Method for fabricating round and smooth curved surface microstructure |
| 03/03/2010 | CN101659390A Silicon processing method and silicon substrate with etching mask |
| 03/03/2010 | CN101659389A Photo-etching method for image element chip of optically readable infrared image sensor |
| 03/02/2010 | US7671428 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 03/02/2010 | US7670747 Pattern transfer method |
| 03/02/2010 | US7670496 Process for producing structural body and etchant for silicon oxide film |
| 02/25/2010 | WO2009093176A3 Clean and hermetic sealing of a package cavity |
| 02/25/2010 | US20100044837 Replication and transfer of microstructures and nanostructures |
| 02/25/2010 | US20100044147 Microelectromechanical system diaphragm and fabricating method thereof |
| 02/25/2010 | DE102007054043B4 Modulare mikrofluidische Funktionsplattform und deren Verwendung Modular microfluidic platform function and their use |
| 02/24/2010 | EP2157605A1 Electronic part apparatus and process for manufacturing the same |
| 02/24/2010 | EP2157468A1 Piezoelectric mirror device, optical device using the piezoelectric mirror device and method for manufacturing piezoelectric mirror device |
| 02/24/2010 | EP2157047A2 Method of manufacturing MEMS devices providing a control of their cavity depth |
| 02/24/2010 | EP2157046A2 Method of manufacturing MEMS devices providing a control of their cavity depth |
| 02/24/2010 | CN101654219A Method for graphing carbon nanotube film or array |
| 02/24/2010 | CN101654218A Method for preparing BiFeO3 film pattern on surface of self-assembly single layer film |
| 02/24/2010 | CN101654217A Methods for manufacturing microelement |
| 02/18/2010 | WO2010019684A2 Induced-charge electro-osmotic microfluidic devices |
| 02/18/2010 | WO2010018051A1 Gearing system for a timepiece |
| 02/18/2010 | WO2010018029A2 Method for producing a micromechanical component, and micromechanical component |
| 02/18/2010 | WO2010017934A2 Method for transferring nanostructures into a substrate |
| 02/18/2010 | WO2010017578A1 Switches for microfluidic systems |
| 02/18/2010 | WO2009105382A3 Method of sealing a cavity |
| 02/18/2010 | US20100040847 Methods utilizing scanning probe microscope tips and products therefor or produced thereby |
| 02/18/2010 | US20100038731 Non-volatile memory device |
| 02/18/2010 | DE102008041178A1 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil Manufacturing method for a micromechanical component and micromechanical component |
| 02/18/2010 | DE102008038910A1 Verfahren und Vorrichtung zur Herstellung eines strukturierten Gegenstands sowie strukturierter Gegenstand Method and apparatus for producing a patterned article, and structured object |
| 02/18/2010 | DE102008036923A1 Carrier, which is coated with ceramic, useful in and/or as water distribution system, heating/cooling device, tube, pipeline and/or reactor material in pharmaceutical, medical or food processing industry and in hospitals or nursing homes |
| 02/18/2010 | DE102005015454B4 Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben Of the same semiconductor sensor device with housing cavity and the sensor chip and methods for preparing |
| 02/17/2010 | EP2154582A1 Gear method for a clock piece |
| 02/17/2010 | EP2153863A1 Method of coating microneedle |
| 02/17/2010 | EP1180693B1 Sensor device and method of manufacture thereof |
| 02/17/2010 | CN101652317A Eliminate release etch attack by interface modification in sacrificial layers |
| 02/17/2010 | CN100590062C Method for making three-dimension electric casting micro structure |
| 02/16/2010 | CA2379179C Microelectromechanical optical switch and method of manufacture thereof |
| 02/11/2010 | WO2010016330A1 Silicon substrate etching method |
| 02/11/2010 | DE102008047959A1 Flexible flächige Struktur, Verfahren zur Herstellung einer flexiblen flächigen Struktur und Verwendung Flexible flat structure, methods of making a flexible sheet-like structure and use |
| 02/11/2010 | DE102008040970A1 Mikromechanische Vorrichtung mit Kavernen mit unterschiedlichem atmosphärischen Innendruck Micromechanical device with caverns with different internal atmospheric pressure |
| 02/11/2010 | DE102008034546A1 Product, has substrate including number of molecular chains with hydrophilic group, hydrophobic segment and photoreversible cross linking agent, where molecular chains are linked with substrate |
| 02/11/2010 | DE102007050976B4 Verfahren zur Umformung einer Folie A method for forming a film |
| 02/10/2010 | EP2150488A2 Method for producing a micromechanical component having a filler layer and a masking layer |
| 02/10/2010 | CN101643194A Method for manufacturing micro pattern with inverted trapezoidal cross section by using ice template |
| 02/04/2010 | WO2010014107A1 Method for producing aligned carbon nanotube sheets, ribbons and films from aligned arrays of carbon nanotube carpets/forests and direct transfer to host surfaces |
| 02/04/2010 | WO2010012966A2 Method and device for encapsulating microstructures |
| 02/04/2010 | WO2010012548A2 Encapsulation, mems and method of selective encapsulation |
| 02/04/2010 | WO2010012547A2 Method for capping a mems wafer and mems wafer |
| 02/04/2010 | WO2009006120A8 Microelectromechanical device with optical function separated from mechanical and electrical function |
| 02/04/2010 | DE102008040854A1 Mikromechanische Struktur sowie Verfahren zum Einstellen der Arbeitsspaltbreite einer mikromechanischen Struktur Micromechanical structure and method for adjusting the working gap width a micromechanical structure |
| 02/04/2010 | DE102008040852A1 Herstellungsverfahren für ein mikromechanisches Bauteil und Mikromechanisches Bauteil Manufacturing method for a micromechanical component and Micromechanical element |
| 02/04/2010 | DE102008040851A1 Verfahren zum Verkappen eines MEMS-Wafers sowie MEMS-Wafer A method for capping a MEMS wafer and MEMS wafer |
| 02/04/2010 | DE102008040775A1 Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln Encapsulation, MEMS and method for selectively encapsulate |
| 02/04/2010 | DE102008040758A1 Mikromechanische Strukturen und Verfahren zur Herstellung von mikromechanischen Strukturen Micromechanical structures and procedures for the preparation of micro-mechanical structures |
| 02/03/2010 | CN201395509Y Stepwise micro-impression system |
| 02/03/2010 | CN101641281A Mold, mold production process, processing apparatus, and processing method |
| 02/03/2010 | CN101638213A Micro structural manufacture method capable of integrating semiconductor processing |
| 02/02/2010 | US7655492 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 01/28/2010 | WO2010011733A2 Electro-mechanical switches and methods of use thereof |
| 01/28/2010 | WO2010011488A2 Spacer for mems device |
| 01/28/2010 | WO2010009543A1 A microfluidic device and method for fabricating the microfluidic device |
| 01/28/2010 | WO2009106022A3 Method of making electrostatically charged patterns |
| 01/28/2010 | US20100020843 Thermal Bend Actuator Material Selection |
| 01/28/2010 | DE10255889B4 Verfahren zur Aufbereitung eines elektrostatischen Haltekörpers A process for the preparation of an electrostatic holding body |
| 01/28/2010 | DE102009030281A1 Aktive Abschirmung von Leitern in MEMS-Vorrichtungen Active shielding conductors in MEMS devices |
| 01/28/2010 | DE102008040597A1 Mikromechanisches Bauelement mit Rückvolumen Micromechanical component with back volume |
| 01/28/2010 | DE102008040564A1 Micromechanical sensor component, particularly acceleration sensor component, has substrate and seismic mass having primary extension plane |
| 01/28/2010 | CA2731413A1 A microfluidic device and method for fabricating the microfluidic device |
| 01/27/2010 | EP2147894A2 Saw debris reduction in MEMS devices |
| 01/27/2010 | EP2146925A1 Extensions of self-assembled structures to increased dimensions via a "bootstrap" self-templating method |
| 01/27/2010 | CN101633490A Component and component module provided with micro-cap, and wafer-level packaging methods thereof |