| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 01/27/2010 | CN100585491C Large area periodic array three-dimensional microstructure preparation method |
| 01/26/2010 | US7651734 Forming two micromechanical devices on common substrate; overcoating by vapor deposition; separation |
| 01/26/2010 | CA2536431C Process for fabricating a micro-electro-mechanical system with movable components |
| 01/21/2010 | WO2010008985A2 Encapsulation methods for interfero-metric modulator and mems devices |
| 01/21/2010 | WO2010008781A1 Method for packaging semiconductors at a wafer level |
| 01/21/2010 | WO2010006849A2 Process for manufacturing a component, process for manufacturing a component arrangement, component and component arrangement |
| 01/21/2010 | WO2009129537A3 Magnetic microstructures for magnetic resonance imaging |
| 01/21/2010 | WO2009052805A3 Nozzle element, filter element and/or positioning element |
| 01/21/2010 | US20100015744 Micro-Electromechanical Device and Method of Making the Same |
| 01/21/2010 | US20100013044 Three-dimensional silicon on oxide device isolation |
| 01/21/2010 | DE102008040528A1 Herstellungsverfahren für ein mikromechanisches Bauteil und ein mikromechanisches Bauteil Manufacturing method for a micromechanical component and a micromechanical component |
| 01/21/2010 | DE102008040525A1 Mikromechanisches Sensorelement, Verfahren zur Herstellung eines mikromechanischen Sensorelements und Verfahren zum Betrieb eines mikromechanischen Sensorelements The micromechanical sensor element, method for producing a micromechanical sensor element and method of operating a micromechanical sensor element |
| 01/21/2010 | DE102008040522A1 Method for manufacturing micromechanical structure, involves applying sacrificial layer on substrate, applying sacrificial layer on function layer, and applying another sacrificial layer on function layer |
| 01/21/2010 | DE102008040521A1 Verfahren zur Herstellung eines Bauelements, Verfahren zur Herstellung einer Bauelementanordnung, Bauelement und Bauelementanordnung A method for manufacturing a device, method of manufacturing a component assembly, the component and component arrangement |
| 01/21/2010 | CA2730378A1 Method for packaging semiconductors at a wafer level |
| 01/20/2010 | EP2145856A1 Method of manufacturing a micromechanical part |
| 01/20/2010 | EP2145855A2 Substrate bonding method and MEMS component |
| 01/20/2010 | EP2144844A2 Microfluidic structures with integrated devices |
| 01/20/2010 | CN101631739A MEMS process and device |
| 01/20/2010 | CN100582933C Warm-up flash two-purpose nano impression device |
| 01/20/2010 | CN100581984C Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof |
| 01/19/2010 | US7648855 Device comprising an encapsulated microsystem and production method thereof |
| 01/19/2010 | US7648484 Microneedle structure and production method therefor |
| 01/18/2010 | CA2672597A1 Electromechanical device comprising electronic components and at least one nanotube-based interface, and manufacturing method |
| 01/14/2010 | WO2010005062A1 Functional device and manufacturing method therefor |
| 01/14/2010 | WO2010004695A1 Sequencer |
| 01/14/2010 | WO2010004064A1 Substrate having a layer of gold (iii) and procedure for preparation thereof |
| 01/14/2010 | WO2010003925A2 Method for manufacturing an mst component and mst component |
| 01/14/2010 | WO2010003600A1 Process and system for fabrication of patterns on a surface |
| 01/14/2010 | WO2010003228A1 Low temperature ceramic microelectromechanical structures |
| 01/14/2010 | WO2010003188A1 Method of fabricating microfluidic systems |
| 01/14/2010 | WO2009129066A3 Method and system for forming an electronic assembly having inertial sensors mounted thereto |
| 01/14/2010 | DE102009031499A1 Halbleitersensor mit Heizung auf dem Isolationsfilm und Herstellungsverfahren hierfür A semiconductor sensor with heating on the insulating film and manufacturing method thereof |
| 01/14/2010 | DE102009016487A1 Sensormodul und Halbleiterchip Sensor module and semiconductor chip |
| 01/14/2010 | DE102008032319A1 Verfahren zur Herstellung eines MST Bauteils und MST Bauteil A method for producing a component and MST MST component |
| 01/13/2010 | EP2144274A1 Method of preparing an ultra sharp tip, apparatus for preparing an ultra sharp tip, and use of an apparatus |
| 01/13/2010 | EP2144117A1 Process and system for fabrication of patterns on a surface |
| 01/13/2010 | EP2143684A2 Method of manufacturing a MEMS/NEMS structure comprising a partially monocrystalline anchor |
| 01/13/2010 | CN101624169A Micro-electromechanical pretreatment manufacturing method for manufacturing procedure of integrable semiconductor and structure thereof |
| 01/13/2010 | CN100580886C Gravity liquid state etching method capable of controlling structure size |
| 01/13/2010 | CN100579893C Centrifugal separating sacrificial layer process |
| 01/13/2010 | CN100579892C Micro-electromechanical system device and manufacturing method thereof |
| 01/13/2010 | CN100579891C Method for forming microelectronic spring structures on substrate |
| 01/12/2010 | US7645704 vapor phase; microelectromechanical systems, semiconductors |
| 01/12/2010 | US7645615 Self-contained microelectrochemical bioassay platforms and methods |
| 01/07/2010 | WO2010002496A2 Groove on cover plate or substrate |
| 01/07/2010 | DE102006046820B4 Verfahren zum Packen im Chipmassstab für integrierte Schaltungen The method of packing in chip scale integrated circuit |
| 01/06/2010 | EP2141117A1 Method for encapsulating a microelectronic device with a getter material |
| 01/06/2010 | CN100578287C Thin film precursor stack for MEMS manufacturing |
| 01/05/2010 | US7643100 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part |
| 01/05/2010 | US7642545 Layer and system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof |
| 01/05/2010 | US7642110 Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
| 12/31/2009 | DE19843716B4 Halbleitersensor und Verfahren zu dessen Herstellung A semiconductor sensor and method for its production |
| 12/31/2009 | DE102008030189A1 Bauteil mit einer selbstheilenden Oberflächenschicht, selbstheilender Lack bzw. Beschichtungspulver mit selbstheilenden Eigenschaften Component with a self-healing surface layer, self-healing paint or powder coating with self-healing properties |
| 12/31/2009 | DE102008002675A1 Mikroventil und Abdichteinrichtung zur Verwendung in einem Mikrofluidiksystem sowie Verfahren zu deren Herstellung Micro valve and sealing means for use in a microfluidic system, as well as processes for their preparation |
| 12/31/2009 | DE102008002668A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof |
| 12/30/2009 | EP2138455A1 Process for making a MEMS structure with a moving element using a heterogeneous sacrificial layer |
| 12/30/2009 | EP2138454A1 Heterogeneous substrate comprising a sacrificial layer and method of manufacturing the same |
| 12/30/2009 | EP2138453A1 Method for manufacturing an electromechanical structure comprising at least one mechanical reinforcement post |
| 12/30/2009 | EP2138452A1 Method for manufacturing a microelectromechanical device comprising at least one active element. |
| 12/30/2009 | EP2138451A1 Method for manufacturing a MEMS/NEMS electromechanical component |
| 12/30/2009 | EP2138450A2 Structure of electrodes for a micromechanical device |
| 12/30/2009 | EP2138198A1 Fluidic capillary chip for regulating drug flow rates of infusion pumps |
| 12/30/2009 | EP2136922A2 Methods of macromolecular analysis using nanochannel arrays |
| 12/30/2009 | CN101616864A Encapsulation module, method for production and use thereof |
| 12/30/2009 | CN101613077A Bulk-silicon processing method for manufacturing microstructure on basis of multiple masking layers |
| 12/30/2009 | CN101613076A Method for preparing and duplicating three-dimensional micro-nano structure stamps in batches |
| 12/30/2009 | CN101613075A Method for constructing virtual channel for restricting liquid drop movement |
| 12/30/2009 | CN100576016C Flexible cantilever micro-mechanical-optical switch preparation method |
| 12/30/2009 | CN100575242C A method for making MEMS switch, and MEM device and its making method |
| 12/29/2009 | US7638429 Thin film encapsulation of MEMS devices |
| 12/24/2009 | DE102008002336A1 Quetschventil und Verfahren zu dessen Herstellung Pinch valve and method of producing the |
| 12/24/2009 | DE10065013B4 Verfahren zum Herstellen eines mikromechanischen Bauelements A method for producing a micromechanical component |
| 12/23/2009 | WO2009154173A1 Method for manufacturing multistep substrate |
| 12/23/2009 | WO2009154034A1 Method, apparatus and program for manufacturing silicon structure |
| 12/23/2009 | EP2136215A2 Accelerometer with folded beams |
| 12/23/2009 | EP2134462A1 Extruded body devices and methods for fluid processing |
| 12/23/2009 | CN101610972A Protection box for a microelectromechanical system including a wiring relay |
| 12/23/2009 | CN101608962A Micro Pirani gage |
| 12/23/2009 | CN101607690A Method for electric-discharge machining hole by nano-wire or nano-tube and system therefor |
| 12/17/2009 | WO2009151836A2 Fabrication of microscale tooling |
| 12/17/2009 | WO2009150610A1 Polymer micro-actuators sensitive to one or more inputs |
| 12/17/2009 | WO2009149980A2 Method for producing a micromechanical membrane structure with access from the rear of the substrate |
| 12/17/2009 | WO2009149979A2 Production method for a micromechanical component, corresponding composite component and corresponding micromechanical component |
| 12/17/2009 | WO2009086986A3 Method for producing porous microstructures, porous microstructures produced by this method and use thereof |
| 12/17/2009 | US20090309175 Electromechanical system having a controlled atmosphere, and method of fabricating same |
| 12/17/2009 | DE102009021440A1 Spektroskopiemodul und Verfahren zum Herstellen desselben Spectroscopy of the same module and process for producing |
| 12/17/2009 | DE102009021244A1 Mikroelektromechanische System-Bauelemente Microelectromechanical system components |
| 12/17/2009 | DE102008035055B3 Verfahren zur Ausrichtung einer elektronischen CMOS-Struktur bezogen auf eine vergrabene Struktur bei gebondeten und rückgedünnten Stapeln von Halbleiterscheiben A method of aligning an electronic CMOS structure based on a buried structure and bonded at rückgedünnten stacks of semiconductor wafers |
| 12/17/2009 | DE102008026886A1 Verfahren zur Strukturierung einer Nutzschicht eines Substrats Method for structuring a wear layer of a substrate |
| 12/17/2009 | DE102008002332A1 Verfahren zur Herstellung einer mikromechanischen Membranstruktur mit Zugang von der Substratrückseite Process for producing a micromechanical membrane structure with access from the substrate rear side |
| 12/17/2009 | DE102008002324A1 Method for manufacturing micromechanical or electronic component, involves attaching substrate material and covering material with each other and relatively positioning to each other by molding tool |
| 12/16/2009 | EP2133307A2 Manufacturing method of a three-dimensional microstructure |
| 12/16/2009 | EP2133306A1 Polymer micro-actuators sensitive to one or more inputs |
| 12/16/2009 | CN101603939A Electrochemical ultra-micro compound electrode and preparation method thereof |
| 12/16/2009 | CN101603861A Thermal isolation structure of infrared detector and preparation method thereof |
| 12/16/2009 | CN101602481A Preparation method of silicon platform with convex semispherical structure |
| 12/16/2009 | CN101602480A Method for etching silicon pulse sensor socle beam by laser |
| 12/16/2009 | CN101602479A Capacitive sensing device and manufacture method thereof |
| 12/16/2009 | CN100570428C Spatial light modulator using an integrated circuit actuator and method of making and using same |