| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
|---|
| 06/16/2010 | CN101742389A Integrated circuit structure and forming method thereo |
| 06/16/2010 | CN101738722A Method for manufacturing micro-opto-electro-mechanical system-based wave-adjustable harmonic filter |
| 06/16/2010 | CN101738355A Micro electro mechanical system (MEMS) technology-based viscosity transducer chip and preparation method thereof |
| 06/16/2010 | CN101738280A Mems pressure sensor and manufacturing method thereof |
| 06/16/2010 | CN101734611A Maskless method for preparing black silicon by deep reactive ion etching |
| 06/16/2010 | CN101734610A Multilayer film for low load working condition of micro electro mechanical system and preparation method thereof |
| 06/16/2010 | CN101734608A Micro-electromechanical structure and manufacturing method thereof |
| 06/16/2010 | CN101203939B Method for processing diamond and appliance utilizing diamond semiconductor |
| 06/10/2010 | WO2009149980A4 Method for producing a micromechanical membrane structure with access from the rear of the substrate |
| 06/10/2010 | DE102008061182A1 Manufacturing a microcomponent for mechanical clockwork of a wristwatch, comprises providing layer sequence consisting of carrier-, intermediate- and wearing layer, and cutting-off the microcomponent made of wearing layer by laser cutting |
| 06/10/2010 | DE102008054369A1 Resonator i.e. micromechanical rotation rate sensor, for use in e.g. electronic stability program-system of vehicle, has springs comprising two spring rigidity during movement of masses with minimum and maximum amplitudes, respectively |
| 06/10/2010 | DE102008044371A1 Sensor arrangement e.g. micromechanical sensor, has cavern provided perpendicular to main extension plane between movable element and substrate, where cavern is formed between intermediate layer and substrate |
| 06/10/2010 | DE102008044270A1 Micromechanical component i.e. micromirror, manufacturing method for use in e.g. mini-projector, involves aligning movable part at angle that is not equal to zero degree and one hundred and eighty degree with respect to base substrate |
| 06/09/2010 | EP2193542A2 Wafer level packaged mems device |
| 06/09/2010 | EP1062684B1 Trench isolation for micromechanical devices |
| 06/09/2010 | CN1866007B Ultra trace detection sensor with integrated piezoresistance SiO2 cantilever, making method and application thereof |
| 06/09/2010 | CN101726629A Micro-electro-mechanical element, out-plane sensor and manufacturing method of micro-electro-mechanical element |
| 06/09/2010 | CN101726526A Solid electrolyte SO2 gas sensor and manufacturing method thereof |
| 06/09/2010 | CN101723309A Preparation method of hot micro-actuator based on working in air and liquid |
| 06/09/2010 | CN101723308A MEMS wafer level vacuum packaging process |
| 06/09/2010 | CN101723307A Method for preparing semicylindrical minute groove by utilizing secondary film deposition and wet etching |
| 06/09/2010 | CN101723306A Method for monolithic integration of MEMS hot-film sensor and IC |
| 06/09/2010 | CN101723305A Manufacturing method of micro-electro-mechanical element |
| 06/09/2010 | CN101216358B Grid pressure sensing chip and preparation method, pressure distributed sensor |
| 06/03/2010 | WO2010061378A2 Magnetic patterning method and system |
| 06/03/2010 | WO2010061060A1 Sound source based on the thermoacoustic effect |
| 06/03/2010 | WO2010060684A2 Method for the production of a micromechanical component, component produced using said method, and use thereof |
| 06/03/2010 | US20100133952 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices |
| 06/02/2010 | EP2192081A1 Method of producing a retention array containing a functional fluid |
| 06/02/2010 | EP2191503A1 Method for producing a multiplicity of chips and correspondingly produced chip |
| 06/02/2010 | EP2190778A2 Carbon nanotube assembly |
| 06/02/2010 | DE19817310B4 Verfahren zur Herstellung von mikromechanischen Bauelementen A process for preparing micromechanical components |
| 06/02/2010 | DE102008044177A1 Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mit dem Verfahren hergestelltes Bauelement bzw. dessen Verwendung A process for producing a micromechanical component, and produced with the method component or use thereof |
| 06/02/2010 | DE102008044098A1 Sensor arrangement for differential pressure measurement, has micro-mechanical sensor element, where volume between separation membrane and measuring diaphragm is filled by incompressible transmission medium |
| 06/02/2010 | CN101718667A Density sensor chip based on micro electro mechanical system technology and preparation method thereof |
| 06/02/2010 | CN101717066A Method and nano balance for weighing viruses |
| 06/02/2010 | CN101219770B Laser modeling method for semiconductor material micro-nano multi-scale function surface |
| 06/01/2010 | US7728395 Micro-mechanical structure and method for manufacturing the same |
| 06/01/2010 | US7727453 Step and repeat imprint lithography processes |
| 05/27/2010 | WO2010059118A1 Functional capping |
| 05/27/2010 | WO2010057878A2 Method for forming a micro-surface structure and for producing a micro-electromechanical component, micro-surface structure and micro-electromechanical component having said micro-surface structure |
| 05/27/2010 | WO2010019684A3 Induced-charge electro-osmotic microfluidic devices |
| 05/27/2010 | WO2009138138A3 Method for producing chips |
| 05/27/2010 | WO2009132891A3 Micromechanical component comprising a tempered metal layer and method for producing the same |
| 05/27/2010 | DE102008060800A1 Coating composition, useful to produce layer with hierarchical micro- and nano-structured surface, comprises mixture of nanocrystalline metal oxide particles, titanium dioxide sol and compounds from glass-forming elements |
| 05/26/2010 | EP2188662A2 Periodic dimple array |
| 05/26/2010 | EP2188405A1 Method for producing a metal-oxide-coated workpiece surface with predeterminable hydrophobic behaviour |
| 05/26/2010 | CN1946629B Method of manufacturing semiconductor device |
| 05/26/2010 | CN1660691B Fluid actuating apparatus and method for manufacturing a fluid actuating apparatus, and electrostatically-actuated fluid discharge apparatus and process for producing an electrostatically-actuated flu |
| 05/26/2010 | CN101714590A Method for producing semiconductor particles |
| 05/26/2010 | CN101713688A MEMS non-refrigerated two-band infrared detector and preparation method thereof |
| 05/26/2010 | CN101712450A Method for preparing titanium dioxide nanocrystal films by liquid-phase pulse laser induction |
| 05/26/2010 | CN101054157B Electronic apparatus element and manufacturing method thereof, and resonator and manufacturing method thereof |
| 05/20/2010 | WO2010057031A1 Ultra thin alignment walls for di-block copolymer |
| 05/20/2010 | WO2010056435A2 Transducer with decoupled sensing in mutually orthogonal directions |
| 05/20/2010 | WO2010054875A1 Arrangement of at least two wafers with a bonding connection and method for producing such an arrangement |
| 05/20/2010 | WO2009133506A3 Mems device and manufacturing method |
| 05/20/2010 | DE102008060796A1 Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur A method of forming a micro-surface structure as well as for manufacturing a microelectromechanical device, micro-structure and surface micro-electromechanical device having such a structure |
| 05/20/2010 | DE102008043790A1 Micromechanical component i.e. acceleration sensor, for use in automotive industry, has insulating layer comprising hole structure with recesses in region, which is extended below electrode of conductive layer |
| 05/20/2010 | DE102008043788A1 Mikromechanisches Bauelement Micromechanical component |
| 05/20/2010 | DE102008043773A1 Electrical and/or micromechanical component, has base substrate whose main side is provided with portions, where portions exceeding over region of cap are decoupled from material of package |
| 05/20/2010 | DE102008027461A1 Vorrichtung und Verfahren zur mikrostrukturierten Plasmabehandlung Apparatus and method for microstructured plasma treatment |
| 05/20/2010 | DE10046622B4 Verfahren zur Herstellung einer Membransensoreinheit sowie Membransensoreinheit A method for producing a membrane sensor unit as well as membrane sensor unit |
| 05/19/2010 | EP2187436A1 Electronic component |
| 05/19/2010 | EP2186120A1 Formation of a slot in a silicon substrate |
| 05/19/2010 | CN201473309U Spraying processing device for producing semi-conductor |
| 05/19/2010 | CN1987486B Integrated optic grating interference micro mechanical acceleration sensor and its producing method |
| 05/19/2010 | CN101710228A Imprint lithography processes and systems |
| 05/19/2010 | CN101200280B Method for making suspension structure |
| 05/19/2010 | CN101058402B Method of manufacturing single-sheet integrated micro-electron machinery system |
| 05/14/2010 | WO2010054244A2 Method of using a plurality of smaller mems devices to replace a larger mems device |
| 05/14/2010 | WO2010052684A2 Mems devices |
| 05/14/2010 | WO2010052682A2 Mems with poly-silicon cap layer |
| 05/14/2010 | WO2009130681A3 Semiconductor device and method of manufacturing a semiconductor device |
| 05/13/2010 | US20100116656 Fluid separation structure and a method of manufacturing a fluid separation structure |
| 05/12/2010 | EP2183185A2 Wafer joining method, wafer assemblage, and chip |
| 05/12/2010 | DE102009004902B3 Verfahren zur simultanen Mikrostrukturierung und Passivierung Method for the simultaneous microstructuring and passivation |
| 05/12/2010 | DE102008043598A1 Bauteil und Herstellungsverfahren für ein Bauteil Component and manufacturing method for a component |
| 05/12/2010 | DE102008043524A1 Beschleunigungssensor und Verfahren zu seiner Herstellung Acceleration sensor and method for its preparation |
| 05/12/2010 | DE102008026182B4 Verfahren zur Herstellung eines Mikrostrukturbauelements mit einem kompressiv verspannten Material mit kleinem ε und Halbleiterbauelement bzw. MOS-Transistor A process for producing a microstructure device having a compressively stressed material with small ε and semiconductor device or MOS transistor |
| 05/12/2010 | DE102008011972B4 Vorrichtung zur selbstjustierenden Montage und Halterung von Mikrokanalplatten in Mikrosystemen Device for self-aligning and mounting bracket of microchannel plates in microsystems |
| 05/12/2010 | DE102008011175B4 Mikromechanischer Aktuator und Verfahren zu seiner Herstellung Micromechanical actuator and method for its preparation |
| 05/12/2010 | DE102008002674B3 Mikroventil und Abdichteinrichtung zur Verwendung in einem Mikrofluidiksystem sowie Verfahren zu deren Herstellung Micro valve and sealing means for use in a microfluidic system, as well as processes for their preparation |
| 05/12/2010 | DE102005063370B4 Chemische Reaktionspatrone mit Betätigungsmechanismus Chemical reaction cartridge with operating mechanism |
| 05/12/2010 | CN1857990B Method for making complicate three dimension microstructure or micro device at low cost |
| 05/12/2010 | CN1614458B Diffractive thin-film piezoelectric micromirror and method of producing the same |
| 05/12/2010 | CN101704499A Manufacturing method of Mach-Zehnder interference microfluidic optical gyro chip |
| 05/12/2010 | CN101704498A Static actuator and preparation method and instantaneous perturbation resistance method thereof |
| 05/12/2010 | CN101704496A Silicon material substrate and construction method thereof |
| 05/11/2010 | US7713456 Drop generator die processing |
| 05/06/2010 | WO2010049813A1 Integrated encapsulation for mems devices |
| 05/06/2010 | WO2010003925A3 Method for encapsulating an mems component |
| 05/06/2010 | WO2009127273A3 Method for the production of a micromechanical component having electrode units on two planes, and micromechanical component |
| 05/06/2010 | US20100112809 Multilevel imprint lithography |
| 05/06/2010 | US20100112277 Microstructures and methods of fabrication thereof |
| 05/06/2010 | DE102009030224A1 Vorrichtung mit einem Emitter-Kontakt, einem Kollektor-Kontakt und einem Spalt und Verfahren zu ihrer Herstellung Device with an emitter contact, a collector contact and a gap, and processes for their preparation |
| 05/06/2010 | DE102008048298A1 Method for embossing microstructures in flat thermoplastic plastic semi-finished products, such as plates or films, involves melting plastic surface area by coupling of ultrasonic energy |
| 05/06/2010 | DE102008043382A1 Bauelement und Verfahren zu dessen Herstellung Device and process for its preparation |
| 05/05/2010 | CN1911780B Method of protecting chip front face pattern and method of implementing two-side technology |
| 05/05/2010 | CN101700869A Method for preparing flexible substrate biological microelectrode array based on substrate graph |