Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
03/2011
03/10/2011WO2011028384A1 Integrated circuit switches, design structure and methods of fabricating the same
03/10/2011WO2011028359A2 Mems device with stress isolation and method of fabrication
03/10/2011WO2011026699A1 Production method for an encapsulated micromechanical component, corresponding micromechanical component and encapsulation for a micromechanical component
03/10/2011WO2010107618A3 Method of accurately spacing z-axis electrode
03/10/2011WO2010066494A3 Arrangement of two substrates having a slid bond and method for producing such an arrangement
03/10/2011DE102009029217A1 Inertialsensor mit einem Feldeffekttransistor Inertial sensor with a field effect transistor
03/10/2011DE102009029202A1 Mikromechanisches System Micromechanical System
03/10/2011DE102009029201A1 Method for manufacturing semiconductor component in pressure sensor, involves separating connection of encapsulating compound, micro or nano-structured element and resin-coated-copper-foil from carrier connection layer
03/10/2011DE102009029199A1 Component parts manufacturing method for e.g. pressure sensors, involves selecting temperature for heating microstructured or nanostructured components such that materials of components are not converted into gaseous component parts
03/10/2011DE102009029184A1 Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement Manufacturing method for a micromechanical component capped, micromechanical component and corresponding cap for a micromechanical component
03/09/2011EP2291323A2 Fabrication of microscale tooling
03/09/2011EP1340258B1 Thermally enhanced microcircuit package and method of forming same
03/09/2011EP1218289B1 Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
03/08/2011US7901586 Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array
03/03/2011WO2011026056A1 Methods for producing extruded body reactors
03/03/2011WO2011024673A1 High-hardness material for imprint
03/03/2011WO2011023470A1 Spectral purity filter, lithographic apparatus, and method for manufacturing a spectral purity filter
03/03/2011WO2010052684A3 Mems device packaging with sidewall leak protection
03/03/2011US20110048799 Microstructure and Process for its Assembly
03/03/2011DE102009029114A1 Mikromechanisches System Micromechanical System
03/03/2011DE102009029095A1 Mikromechanisches Bauelement Micromechanical component
03/03/2011DE102007025649B4 Verfahren zum Übertragen einer Epitaxie-Schicht von einer Spender- auf eine Systemscheibe der Mikrosystemtechnik A method for transmitting an epitaxial layer of a donor to a system disk microsystem technology
03/02/2011EP2289845A1 Layered sintered microfluidic devices with controlled compression during sintering and associated methods
03/02/2011EP2289844A2 Thermally enhanced microcircuit package and method of forming same
03/02/2011EP2289843A1 A microneedle device and method for the fabrication thereof
03/02/2011EP2288573A2 Production method for a micromechanical component, corresponding composite component and corresponding micromechanical component
03/02/2011CN101983412A Mems switch and method for manufacturing the same
03/02/2011CN101982764A Composite membrane modified biosensor and preparation method and application thereof
03/02/2011CN101982401A Carbon nanometer spiral micro heat conduction based motion sensor and preparing method thereof
03/02/2011CN101614522B Manufacturing method of resistance strain gage based on ion beam technology
03/02/2011CN101493578B Period-adjustable micro-mechanical grating and making technique thereof
03/02/2011CN101224866B Micro-switching device
02/2011
02/24/2011WO2011004124A3 Microsystem for generating a synthetic jet, corresponding manufacturing method and device for flow control
02/24/2011WO2010136986A3 Mems element
02/24/2011WO2010060684A3 Method for the production of a micromechanical component comprising a through-hole, component produced using said method, and use thereof
02/24/2011WO2010057878A3 Method for forming a micro-surface structure and for producing a micro-electromechanical component, micro-surface structure and micro-electromechanical component having said micro-surface structure
02/24/2011WO2010054244A3 Method of using a plurality of smaller mems devices to replace a larger mems device
02/24/2011US20110044480 Electret condenser
02/24/2011DE102004004539B4 Waferverbindung unter Verwendung von Reaktivfolien zum Häusen mikro-elektromechhanischer Systeme Wafer bonding using reactive foils for housing micro-elektromechhanischer systems
02/23/2011EP2285734A2 Mems devices and fabrication thereof
02/23/2011EP2285733A2 Method for producing chips
02/17/2011WO2011018572A1 Airtight assembly of two components and method for producing such an assembly
02/17/2011US20110039100 Method for Making a 3D Nanostructure Having a Nanosubstructure, and an Insulating Pyramid Having a Metallic Tip, a Pyramid Having Nano-Apertures and Horizontal and/or Vertical Nanowires Obtainable by this Method
02/17/2011DE102009036951A1 Multilayer circuit, particularly three-dimensional ceramic substrate system, is made of sintered ceramic material, where active electronic component is arranged in cavity
02/17/2011DE10153319B4 Mikrosensor Microsensor
02/16/2011EP2284121A1 Microcavity encapsulation structure for a microelectronic component
02/16/2011EP2282969A2 Method for the production of separate micromechanical parts arranged on a silicon substrate, and parts made therewith
02/16/2011CN101978469A Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
02/16/2011CN101977839A Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
02/16/2011CN101975803A Planar gas sensor and manufacturing method thereof
02/16/2011CN101973510A Method for preparing gas-sensitive sensor element based on carbon nano tube microarray/tungsten oxide nano composite structure
02/16/2011CN101973509A Silicon micro needle surface coating process method based on micro-electromechanical system (MEMS) technology
02/16/2011CN101973508A Flexible substrate MEMS technology-based electroencephalogram dry electrode array and preparation method thereof
02/16/2011CN101973507A Friction induction-based single crystal quartz surface selective etching method
02/16/2011CN101412494B Substrate support device
02/15/2011US7887753 Apparatus and methods for conducting assays and high throughput screening
02/15/2011US7887233 Thermal bend actuator material selection
02/10/2011WO2011017016A1 Selective deposition of nanoparticle on semiconductor substrate using electron beam lithography and galvanic reaction
02/10/2011WO2011016859A2 Micromachined inertial sensor devices
02/10/2011WO2011015650A2 Method of producing microneedles
02/10/2011WO2011015637A1 Process for manufacturing mems devices having buried cavities and mems device obtained thereby
02/10/2011DE102009028177A1 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zur Herstellung eines solchen Bauelements Component having a micromechanical microphone structure and method for producing such a component
02/09/2011EP2281299A1 Thermal anneal of a block copolymer films with top interface constrained to wet both blocks with equal preference
02/09/2011EP2280907A2 Micromechanical component and method for producing the same
02/09/2011EP2280737A2 Magnetic microstructures for magnetic resonance imaging
02/09/2011EP1423282B1 Method of manufacturing a liquid drop discharge head
02/09/2011CN101968495A Cantilever beam acceleration transducer manufactured by micro-machining on single side of single silicon chip and method
02/09/2011CN101966473A Micro fluid control screening chip based on ultrasonic standing wave and preparation method thereof
02/09/2011CN101713688B MEMS non-refrigerated two-band infrared detector and preparation method thereof
02/09/2011CN101483189B Semiconductor structures and fabricating method thereof
02/08/2011US7882741 Method for manufacturing micromechanical components
02/03/2011WO2011012420A1 Organic component and method for the production thereof
02/03/2011WO2011012036A1 Micro-scale grid made of single-crystal silicon and method of manufancturing the same
02/03/2011DE19847305B4 Herstellungsverfahren für eine mikromechanische Vorrichtung Manufacturing method for a micromechanical device
02/03/2011DE102009035291A1 Vorrichtung zur Erzeugung einer mikrofluidischen Kanalstruktur in einer Kammer, Verfahren zu ihrer Herstellung und ihre Verwendung An apparatus for producing a microfluidic channel structure in a chamber, process for their preparation and their use
02/03/2011DE102009032924A1 Method for forming and fixing elastomer, contoured sealing medium to substrate or carrier i.e. control plate for vehicle-electric-hydrauli cally actuatable automatic transmission, involves applying substrate or carrier with inserted medium
02/03/2011DE102009028037A1 Bauelement mit einer elektrischen Durchkontaktierung, Verfahren zur Herstellung eines Bauelementes und Bauelementsystem Device with an electrical through-contact, methods for producing a component and device system
02/03/2011DE102007059717B4 Vorrichtung und Verfahren zur Herstellung von Mikrobauteilen sowie Verwendung einer derartigen Vorrichtung Device and method for the production of micro-components and the use of such a device
02/02/2011EP2280412A2 Semiconductor substrate comprising at least a buried insulating cavity
02/02/2011EP2197780B1 Structure comprising a getter layer and an adjustment sublayer, and fabrication process
02/02/2011CN201729657U Silicon dioxide sacrifice layer release system
02/02/2011CN1821051B Microchannel structure and its manufacturing method, light source device, and projector
02/02/2011CN101963564A Chiral sensor and preparation method thereof
02/02/2011CN101962167A Method for preparing film for testing mechanical characteristics of silica thin film
02/02/2011CN101962166A Packaging structure and packaging method
02/02/2011CN101962165A Microbridge structure of micro-electromechanical system and manufacturing method thereof
01/2011
01/27/2011WO2011010739A1 Method for producing microstructure
01/27/2011WO2011009869A1 Method for manufacturing a micromechanical part made of reinforced silicon
01/27/2011WO2010039453A3 Inertial sensor with dual cavity package and method of fabrication
01/27/2011DE102010000448A1 Halbleiteranordnung mit einem leitfähigen Element A semiconductor device comprising a conductive element
01/27/2011DE102009027898A1 Herstellungsverfahren für ein mikromechanisches Bauelement mit einer Dünnschicht-Verkappung Manufacturing method for a micromechanical component having a thin-capping
01/27/2011DE102009027893A1 Chip e.g. actuator chip, for use in e.g. angular velocity sensor, has recess that is formed in outer side of substrate area, where side walls of recess are partially coated with metal
01/27/2011DE102009027873A1 Micromechanical system has substrate and two conductive elements which are electrically isolated from each other and are mechanically rigidly connected with each other
01/27/2011DE102007013329B4 Verfahren zur Herstellung eines mikromechanischen Bauelements mit einer partiellen Schutzschicht A process for producing a micromechanical component having a partial protective layer
01/27/2011DE102006055147B4 Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur Transducer structure and method of making a transducer structure
01/26/2011EP2278340A1 Wafer process flow for a high performance MEMS accelerometer
01/26/2011EP2277823A2 Method for forming MEMS devices having low contact resistance and devices obtained thereof
01/26/2011EP2277822A1 Method for manufacturing a micromechanical element from reinforced silicon
01/26/2011EP2277197A1 Interposers, electronic modules, and methods for forming the same
01/26/2011EP2276690A2 Graphoepitaxial self-assembly of arrays of half-cylinders formed on a substrate
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