Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
11/2010
11/30/2010US7842514 Channeled fractionation apparatus for separating, capturing and detecting proteins
11/25/2010WO2010133422A2 Directed self-assembly of block copolymers using segmented prepatterns
11/25/2010WO2010002496A3 Groove on cover plate or substrate
11/25/2010DE19935558B4 Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich A process for the production of structures in a substrate in the nanometer range
11/25/2010DE10324421B4 Halbleiterbauelement mit Metallisierungsfläche und Verfahren zur Herstellung desselben Of the same semiconductor device with metallization and methods for preparing
11/24/2010EP2252545A2 Method for fabricating nano-scale patterned surfaces
11/24/2010EP1535315B1 Glass-type planar substrate, use thereof, and method for the production thereof
11/24/2010EP1129478B1 Method and apparatus for improving accuracy of plasma etching process
11/24/2010CN101896273A Apparatus and method for detection of an analyte in a sample
11/24/2010CN101894954A Normal temperature bonding technology-based microminiature fuel cell encapsulation method
11/24/2010CN101893483A Packaging technology and packaging device of non-refrigerated infrared focal plane array device
11/24/2010CN101891142A Method for preparing active, flow impact resistant and non-lotus-like super-hydrophobic surface
11/24/2010CN101891141A Two-dimensional and double-cycle ordered structure array and preparation method thereof
11/24/2010CN101476940B Production method of nano-size superconducting thermoelectron bolometer
11/23/2010CA2623793C Microfluidic apparatus and method for measuring thermo-physical properties of a reservoir fluid
11/18/2010WO2010061378A3 Magnetic patterning method and system
11/18/2010DE102009002986A1 Micro mechanical transducer element for ascertainment of physical size, particularly pressure variable or accelerating variable depending on deflection of beam, has beam that deflects itself while applying voltage to piezoresistors
11/17/2010EP2252077A1 Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
11/17/2010EP2250123A2 Pattern formation employing self-assembled material
11/17/2010EP2250122A1 Method for functionalising the wall of a pore
11/17/2010EP1157407B1 Methods utilizing scanning probe microscope tips
11/17/2010EP1015669B1 Electroplating method for forming a multilayer structure
11/17/2010CN201634415U Low-pulling stress film
11/17/2010CN201634414U Silicon material substrate
11/17/2010CN101886962A An electronic pressure-sensing device
11/17/2010CN101885467A Manufacturing method of micro fluxgate sensor with amorphous magnetic core
11/17/2010CN101885466A Method for manufacturing and packaging MEMS (Micro-electromechanical System) infrared detector by binary optical glass lens
11/17/2010CN101885463A Development method of flexible pressure-sensitive element based on carbon nano-tube filled high polymer composite material
11/17/2010CN101254893B Method for making micromachine moving piece and metal intraconnection thereof
11/17/2010CN101071200B Process control monitor of interferometric modulators
11/16/2010US7833430 Method for fabricating microstructure and microstructure
11/16/2010US7833405 doped areas are first selectively anodized (porous etching), which is carried out locally by means of a monocrystalline cover layer, e.g., an epitaxial layer, followed by a time-controlled switch to selective electropolishing of doped layer buried under the membrane to produce a cavity under cover layer
11/11/2010WO2010129405A2 Nickel-based bonding of semiconductor wafers
11/11/2010US20100282323 Controlled process and resulting device
11/11/2010DE202004021772U1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems
11/11/2010DE102009019393A1 Microstructures manufacturing method, involves obtaining microstructures between one of strips that serves as ground plate and cover plate or between strips and substrate that serves as opposite plate
11/11/2010DE102008000292B4 Röhrenförmiger Multifunktionssensor in Flüssigkeiten, Verfahren zu seiner Herstellung und Verwendung A tubular multi-function sensor in liquids, process for its preparation and use
11/11/2010DE102005013300B4 Verfahren zum Erzeugen einer Polymer-Struktur auf einer Substratoberfläche A method of producing a polymeric structure on a substrate surface
11/11/2010DE10005804B4 Verfahren zur Herstellung einer Halbleitervorrichtung, sowie durch dieses Verfahren hergestellter Halbleitersensor für eine physikalische Grösse A process for producing a semiconductor device, and produced by this process semiconductor sensor for a physical quantity
11/10/2010EP2248763A2 Capacitive electro-mechanical transducer and fabrication method of the same
11/10/2010EP2247527A1 Patch production
11/10/2010EP2247526A1 Device for fluid spreading and transport
11/10/2010CN101881881A Variable optical attenuator and preparation method thereof
11/10/2010CN101881880A Micro-mirror structure and manufacturing method thereof
11/10/2010CN101881785A Four-folding beam variable area differential capacitance structure micro-acceleration sensor and manufacture method thereof
11/10/2010CN101881676A Hexagonal silicon membrane piezoresistive pressure sensor for embedded monocrystal silicon cavity and method
11/10/2010CN101881667A Uncooled microbolometer and preparation method thereof
11/10/2010CN101880879A Corrosion clamp for silicon cup
11/10/2010CN101880022A Anti-vibration device and preparation method thereof
11/10/2010CN101388364B Electric isolation region forming method adopting low temperature process, single chip integration method
11/10/2010CN101332972B Method for making microfluid system
11/10/2010CN101290395B Minisize multifunctional optical devices and method for making same
11/04/2010WO2010125795A1 Mold and manufacturing method therefor
11/04/2010WO2010088111A3 Bonded microelectromechanical assemblies
11/04/2010DE102007023286B4 Verfahren zur Herstellung einer Membran in einem Rahmen A method for producing a membrane in a frame
11/03/2010EP2244968A2 Clean and hermetic sealing of a package cavity
11/03/2010CN101878180A Method of forming structured sintered articles
11/03/2010CN101877362A Silicon substrate with period structure
11/03/2010CN101875481A Low temperature co-fired ceramic-based micro-electromechanical system (MEMS) packaging method
11/03/2010CN101875480A Front end micro cavity
11/02/2010US7825029 Method for the production of structured layers on substrates
11/02/2010CA2611436C Method and device for nano-imprinting
10/2010
10/28/2010WO2010123347A1 Atomising body, atomising device, inhaler, manufacturing method of manufacturing an atomising body and assembly method for assembling an atomising device
10/28/2010WO2010122953A1 Mems element and method for manufacturing same
10/28/2010WO2010122015A1 Method for making a cavity in the body of a substrate capable of forming a site for receiving a component
10/28/2010WO2010101858A3 Hermetic packaging of integrated circuit components
10/28/2010WO2009152012A3 Method for avoiding electrostatic capture in micromachined devices
10/28/2010WO2009134635A3 Graphoepitaxial self-assembly of arrays of half-cylinders formed on a substrate
10/28/2010US20100270596 Mems sensor, method of manufacturing mems sensor, and electronic apparatus
10/27/2010EP1356513B1 Molding of protective caps
10/27/2010CN1495293B Surfactant enhanced protection method for preventing micromechanical component from electrically ageing
10/27/2010CN101871825A Membrane stress testing structure and method as well as manufacturing method
10/27/2010CN101871817A Hybrid-type pyroelectric uncooled focal plane detector and manufacturing process thereof
10/27/2010CN101870451A Method of fabricating an integrated CMOS-MEMS device
10/27/2010CN101870450A Manufacturing process of chip through silicon via (TSV) packaging technology of micro electro mechanical system (MEMS)
10/27/2010CN101870449A Multilayer line manufacturing process of wafer-level micro electromechanical system chip encapsulation technology
10/27/2010CN101870448A Preparation process of chip through silicon via (TSV) packaging technology of micro electro mechanical system (MEMS)
10/27/2010CN101870447A Manufacturing process of chip through silicon via (TSV) packaging technology of micro electro mechanical system (MEMS)
10/27/2010CN101870446A Multichannel carbon nanotube sensor and preparation method thereof
10/21/2010WO2010118945A1 Multi-chip sensor module and method for the production thereof
10/21/2010WO2010118637A1 Microfluidic distribution device, production method and application thereof
10/21/2010US20100264037 Method for Electrochemical Fabrication
10/21/2010US20100263732 Microfluidic Free Interface Diffusion Techniques
10/21/2010DE102010011631A1 Kointegrierter MEMS-Sensor und Verfahren hierzu Kointegrierter MEMS sensor and method therefor
10/21/2010DE102009002485A1 Verfahren zur Herstellung von verkappten MEMS-Bauelementen Process for the preparation of capped MEMS devices
10/21/2010DE102009002376A1 Multichip-Sensormodul und Verfahren dessen Herstellung Multi-chip sensor module and method of manufacturing
10/21/2010DE102009002363A1 Verfahren zum Befestigen einer ersten Trägereinrichtung an einer zweiten Trägereinrichtung und mikromechanische Bauteile A method for attaching a first carrier device on a second carrier means and micromechanical components
10/21/2010DE102008002674B9 Mikroventil und Abdichteinrichtung zur Verwendung in einem Mikrofluidiksystem sowie Verfahren zu deren Herstellung Micro valve and sealing means for use in a microfluidic system, as well as processes for their preparation
10/21/2010CA2747168A1 Multifunctional composites based on coated nanostructures
10/20/2010EP2240401A1 Microfluidic microarray system and method for the multiplexed analysis of biomolecules
10/20/2010CN1826285B Stacked structure and production method thereof
10/20/2010CN101867080A Bulk silicon micro mechanic resonator and manufacturing method thereof
10/20/2010CN101863624A Microprocessing of synthetic quartz glass substrate
10/20/2010CN101863449A Encapsulation method of MEMS infrared sensor with infrared focusing function
10/20/2010CN101863448A Method for preparing nanometer or micron devices in controllable mode
10/20/2010CN101863447A Method for manufacturing sloped sidewall silicon dioxide structure by adopting photoetching and dry etching
10/19/2010CA2519233C Integrated capacitive microfluidic sensors method and apparatus
10/16/2010CA2700114A1 Microprocessing of synthetic quartz glass substrate
10/14/2010WO2010117615A2 Sensor device with reduced parasitic-induced error
10/14/2010WO2010117593A2 Bridge sensor with collocated electronics and two-wire interface
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