Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
12/2010
12/23/2010WO2010120273A3 Multifunctional composites based on coated nanostructures
12/23/2010WO2010028884A3 Encapsulation, mems and encapsulation method
12/23/2010WO2010012548A3 Encapsulation, mems and method of selective encapsulation
12/22/2010EP2264468A2 Merged-mask micro-machining process
12/22/2010EP2263969A2 Improved release method for the suspended structure of a NEMS and/or MEMS component
12/22/2010EP2262721A2 One-dimensional arrays of block copolymer cylinders and applications thereof
12/22/2010EP1846321B1 Method of fabricating a silicon-on-insulator structure
12/22/2010CN101925983A Process for production of microelectromechanical systems
12/22/2010CN101924542A Capacitive mems switch and method of fabricating the same
12/22/2010CN101924058A Method for reducing chip warpage
12/22/2010CN101922984A Nano-silicon thin-membrane four-island-beam-membrane sensor chip and preparation method thereof
12/22/2010CN101922934A Microelectromechanical gyroscope with position control driving and method for controlling a microelectromechanical gyroscope
12/22/2010CN101922008A Method for monitoring corrosion depth of silicon in real time
12/22/2010CN101920931A Manufacturing method of nanotubes
12/22/2010CN101920929A Manufacturing method of semiconductor cantilever structure
12/22/2010CN101920928A Composite micromechanical part and method for manufacturing same
12/22/2010CN101368825B Angle vibration silicon micro-gyroscope and preparation thereof
12/16/2010WO2010142529A1 Method for manufacturing a metal microstructure and microstructure obtained according to said method
12/16/2010WO2010122222A3 Microneedle
12/16/2010WO2010030460A3 Apparatus and method of wafer bonding using compatible alloy
12/16/2010WO2010030459A3 Substrate bonding with bonding material having rare earth metal
12/16/2010DE102009023377A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalte, die auf der Grundlage eines Opfermaterials hergestellt sind Microstructure component with a self-aligned metallization structure with air gaps, which are formed on the basis of a sacrificial material
12/15/2010CN201670723U System for stripping polyimide film by supercritical water
12/15/2010CN101918304A Clean and hermetic sealing of a package cavity
12/15/2010CN101917784A Three-dimensional micro heater with groove-shaped heating film region and manufacturing method thereof
12/15/2010CN101917783A Three-dimensional micro-heater comprising circular arc-shaped heating film region with adjustable radian and method
12/15/2010CN101916754A Through-hole, through-hole forming method and through-hole filling method
12/15/2010CN101915871A MEMS (Micro Electronic Mechanical System) clamped beam type online microwave power sensor and production method thereof
12/15/2010CN101915870A MEMS (Micro Electronic Mechanical System) cantilever beam type online microwave power sensor and production method thereof
12/15/2010CN101915793A Microelectrode array and microchannel integrated sensor structure and manufacturing method thereof
12/15/2010CN101914296A Metal fiber reinforced polymeric matrix composite material and preparation method thereof
12/15/2010CN101913553A Bulk silicon etching and gold silicon bonding combined process method
12/15/2010CN101913552A Method for preparing suspension micro-sensitive structure based on aluminum sacrificial layer process
12/15/2010CN101913550A Microbridge structure of micro-electromechanical system and manufacture method thereof
12/15/2010CN101912665A Flexible beam microelectrode array and preparation method thereof
12/14/2010US7853027 Electret condenser
12/14/2010US7851976 Micro movable device and method of making the same using wet etching
12/14/2010US7850657 Microneedle structure and production method therefor
12/09/2010WO2010139499A2 Micromechanical component and method for producing a micromechanical component
12/09/2010WO2010139498A1 Component having a micro-mechanic microphone structure and method for producing same
12/09/2010WO2010139067A1 Semi-conductor sensor fabrication
12/09/2010WO2010139034A2 Method of fabricating mems devices with electrical components in their sidewalls
12/09/2010US20100312191 Microneedle Devices and Methods of Manufacture and Use Thereof
12/09/2010US20100310773 Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device
12/09/2010US20100307786 Packaging For Micro Electro-Mechanical Systems And Methods Of Fabricating Thereof
12/09/2010DE102009026738A1 Mikromechanischer Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors A micromechanical acceleration sensor and method for manufacturing an acceleration sensor
12/09/2010DE102009026682A1 Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung Component having a micromechanical microphone structure and process for its preparation
12/09/2010DE102009026639A1 Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon
12/09/2010DE102009026629A1 Micromechanical system for use in microphone, comprises thin structured polysilicon layers between substrate and micromechanical functional layer, where one of polysilicon layer has stabilizing bar
12/09/2010DE102009026628A1 Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements Micromechanical component and process for producing a micromechanical component
12/09/2010CA2761028A1 Semi-conductor sensor fabrication
12/08/2010EP2259018A1 Gap control for die or layer bonding using intermediate layers
12/08/2010EP2258656A1 Self-Deformable Mirrors and the Support Thereof
12/08/2010EP2258655A1 A method for producing a microstructure of crystalline sic and a microelectromechanical device made from such a structure
12/08/2010EP2258022A1 Substrate integrated waveguide
12/08/2010CN1893137B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/08/2010CN1564780B Method for producing a semiconductor component and a semiconductor component
12/08/2010CN101908466A Method for reducing contact angle on side surface of thin film after wet etching
12/08/2010CN101907769A Silicon on insulator (SOI) wafer double-mask etching-based vertical comb teeth driven torsional micro-mirror and manufacturing method thereof
12/08/2010CN101907637A Triaxial differential accelerometer and manufacture method thereof
12/08/2010CN101905858A Method for preventing MEMS (Micro-Electromechanical System) device structural layer material from being electrochemically corroded
12/08/2010CN101905857A Method for preventing structural layer materials of MEMS (Micro-Electromechanical System) devices from being electrochemically corroded on large scale
12/08/2010CN101905856A Method for preparing plane hollow microneedle for transdermal administration
12/08/2010CN101905855A Method o encapsulating a wafer level microdevice
12/08/2010CN101905854A Electronic component and its manufacturing method, and an electronic system
12/08/2010CN101905852A Electrostatic MEMS micro actuator combined device and processing method thereof
12/08/2010CN101565163B Preparation method of Zn2.33Sb0.67O4 in-situ growth material coated with ZnO fiber heterostructure
12/08/2010CN101441324B Method of manufacturing oscillator device, and optical deflector and optical instrument having oscillator device
12/08/2010CN101354404B Metal-silicon compound cantilever beam type microelectronic mechanical system probe card and manufacture method thereof
12/08/2010CN101120433B Method for fabricating and assembling printable semiconductor elements
12/07/2010US7846818 Controlled process and resulting device
12/02/2010WO2010138506A1 Methods and systems for electric field deposition of nanowires and other devices
12/02/2010WO2010138267A2 Thin semiconductor device having embedded die support and methods of making the same
12/02/2010WO2010138077A1 A microfluidic device
12/02/2010WO2010137319A1 Method for producing pinholder-shaped microneedles, and microneedle
12/02/2010WO2010137009A1 A moems apparatus comprising a comb drive and a method for manufacturing same
12/02/2010WO2010136986A2 Mems element
12/02/2010WO2010136815A1 Self-deformable mirrors and the support thereof
12/02/2010WO2010136322A1 Method for integrating mems microswitches on gan substrates comprising electronic power components
12/02/2010WO2010088267A4 Method and apparatus for etching
12/02/2010WO2010011488A3 Spacer for mems device package
12/02/2010WO2009158355A3 A method for packaging a display device and the device obtained thereby
12/02/2010DE102009026507A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
12/02/2010DE102009026506A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
12/02/2010DE102009026501A1 Micro-mechanical device i.e. micromirror, has outer actuator and stator electrode components designed such that middle actuator electrode component is adjustable by applying voltage between outer actuator and stator electrode components
12/02/2010DE102009023371A1 Verfahren zur Herstellung eines medizinischen Funktionselements mit einer freitragenden Gitterstruktur A method for producing a medical function element having a cantilever lattice structure
12/02/2010DE102009020163A1 Method for interlayer free connection of two semiconductor substrates through bonding by pretreatment, involves producing plasma between bonding surface and electrode by corona discharge
12/01/2010EP2256084A1 Method of manufacturing a mems element
12/01/2010EP2255870A2 A manufacturing method of a support unit for a microfluidic system
12/01/2010EP2254827A2 Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
12/01/2010CN101903286A Method for producing a capping wafer for a sensor
12/01/2010CN101903285A Method of component assembly on a substrate
12/01/2010CN101898746A Wafer-level integrated encapsulation method of MEMS (Micro Electric Mechanical System) devices requiring different atmosphere pressures
12/01/2010CN101898745A Mems device and method of fabricating the same
12/01/2010CN101898743A Micro-machined ultrasonic transducer
12/01/2010CN101458262B Six-beam structure acceleration sensor and method for making same
12/01/2010CN101246307B Method for manufacturing autogram template by semiconductor technology and autogram template manufactured by the same
12/01/2010CN101158809B Sub-wavelength micro-nano structure using polystyrol ball to focused photoetching form
11/2010
11/30/2010US7843649 Microlens, method of manufacturing microlens, and photomask used for manufacturing method
11/30/2010US7843025 Micromechanical semiconductor sensor
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