| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 05/05/2011 | WO2010129405A3 Nickel-based bonding of semiconductor wafers |
| 05/05/2011 | WO2010092399A3 Integrated mems transducer and circuitry |
| 05/05/2011 | US20110101490 Contoured insulator layer of silicon-on-insulator wafers and process of manufacture |
| 05/05/2011 | US20110101474 Method for protecting encapsulated sensor structures using stack packaging |
| 05/05/2011 | DE102010060194A1 Kopplungsstruktur mit hoher Spannungsfestigkeit Coupling structure with high electric strength |
| 05/05/2011 | DE102009046259A1 Stärkere Haftung eines PECVD-Kohlenstoffs auf dielektrischen Materialien durch Vorsehen einer Haftungsgrenzfläche Greater liability of a PECVD carbon on dielectric materials by providing an adhesion interface |
| 05/04/2011 | EP2316789A1 Device with microstructure and method of forming such a device |
| 05/04/2011 | EP2316788A1 MEMS device with electrosatic discharge protection |
| 05/04/2011 | EP2316787A2 Process of forming a microphone using support member |
| 05/04/2011 | EP2316786A2 Process of forming a microphone using support member |
| 05/04/2011 | EP2316505A2 Mems device for delivery of therapeutic agents |
| 05/04/2011 | EP2315719A1 Method for packaging semiconductors at a wafer level |
| 05/04/2011 | EP1116038B1 Formation of a bridge in a micro-device |
| 05/04/2011 | CN1603225B Mems device and method of forming mems device |
| 05/04/2011 | CN102046514A Capacitive sensor with stress relief that compensates for package stress |
| 05/04/2011 | CN102042832A Micro electro mechanical system (MEMS) gyroscope, chip level temperature control method thereof and processing method thereof |
| 05/04/2011 | CN102041536A Method for preparing two types of super-hydrophobic membranes simultaneously by utilizing nickel chloride |
| 05/04/2011 | CN102041535A Method for preparing two types of super-hydrophobic membranes simultaneously by utilizing ferric chloride |
| 05/04/2011 | CN102041534A Method for simultaneously preparing two types of super-hydrophobic films by utilizing copper chloride |
| 05/04/2011 | CN102040188A Method for eliminating adhesion phenomenon of suspended structure of micro-electromechanical system (MEMS) |
| 05/04/2011 | CN102040187A Method for growing core-shell structure ZnO nanowire array |
| 05/04/2011 | CN102040186A High vacuum ceramic LCC packaging method |
| 05/04/2011 | CN102040185A Manufacturing method of load bearing wafer and load bearing wafer |
| 05/04/2011 | CN101561319B Capacitive MEMS non-refrigerated infrared detector and preparation method thereof |
| 05/04/2011 | CN101544349B Method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process |
| 05/04/2011 | CN101445218B Fabrication method of Ti movable device |
| 05/04/2011 | CN101445217B On-substrate base sheet micro-processing method |
| 05/03/2011 | US7935613 Three-dimensional silicon on oxide device isolation |
| 04/28/2011 | WO2011050111A2 Light-based sealing and device packaging |
| 04/28/2011 | WO2011049092A1 Treatment solution for preventing pattern collapse in metal fine structure body, and process for production of metal fine structure body using same |
| 04/28/2011 | WO2011049091A1 Treatment solution for preventing pattern collapse in metal fine structure body, and process for production of metal fine structure body using same |
| 04/28/2011 | WO2010148398A3 A thin-film device and method of fabricating the same |
| 04/28/2011 | WO2010147839A3 Silicon-rich nitride etch stop layer for vapor hf etching in mems device fabrication |
| 04/28/2011 | WO2010138267A3 Thin semiconductor device having embedded die support and methods of making the same |
| 04/28/2011 | DE19921241B4 Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Größe A process for producing a semiconductor dynamic quantity sensor |
| 04/28/2011 | DE102009050199A1 Herstellung von Leiterstrukturen auf Kunststoff-Folien mittels Nanotinten Production of conductor structures on plastic films by means of nanoinks |
| 04/27/2011 | EP2313339A1 A microfluidic device and method for fabricating the microfluidic device |
| 04/27/2011 | EP2313338A2 Process for manufacturing a component, process for manufacturing a component arrangement, component and component arrangement |
| 04/27/2011 | EP1687237B1 Method to test the hermeticity of a sealed cavity micromechanical device and the device to be so tested |
| 04/27/2011 | CN1898150B Method for containing a device and a corresponding device |
| 04/27/2011 | CN102036908A Fabrication of microscale tooling |
| 04/27/2011 | CN102036907A Method for the production of separate micromechanical parts arranged on a silicon substrate, and parts made therewith |
| 04/27/2011 | CN102033425A Method for manufacturing micromechanical shutter |
| 04/27/2011 | CN102033135A Integrated microfluidic chip interface, interface mould, and interface manufacturing and using methods |
| 04/27/2011 | CN102031525A Method for etching deep through silicon via (TSV) |
| 04/27/2011 | CN102030310A Method for preparing Si/Mn27Si47 core-shell structure nanowire array |
| 04/27/2011 | CN102030309A Preparation method of Mn27Si47-Si heterostructure nanometer linear array or Mn27Si47 nanometer linear array |
| 04/27/2011 | CN102030308A Method for assembling particle ordered array in polarized way based on ferroelectric film electric domain |
| 04/27/2011 | CN102030307A Manufacturing method for micromechanical component and micromechanical component |
| 04/27/2011 | CN102030306A Cleaning method, cleaning system, and method for manufacturing microstructure |
| 04/27/2011 | CN102030305A Micro suspension structure compatible with semiconductor element and manufacturing method thereof |
| 04/27/2011 | CN102030304A Micro-electromechanical pretreatment method and structure |
| 04/27/2011 | CN102030303A Microstructure manufacturing method |
| 04/27/2011 | CN102030302A Micromechanical structure and method for manufacturing micromechanical structure |
| 04/27/2011 | CN102030301A Micro suspension structure compatible with semiconductor element and manufacturing method thereof |
| 04/27/2011 | CN101510509B Method for generating right-angle structure compensation figure of silicon (10) substrate aeolotropism corrosion |
| 04/27/2011 | CN101368826B Vibration isolation frame work decoupled silicon micro-gyroscope |
| 04/21/2011 | WO2011046986A2 Method and apparatus for forming mems device |
| 04/21/2011 | WO2011046169A1 Method for producing microstructure |
| 04/21/2011 | WO2011045988A1 Method, apparatus, and program for manufacturing silicon structural body |
| 04/21/2011 | WO2011016859A3 Micromachined inertial sensor devices |
| 04/21/2011 | WO2010107619A3 Substrate with multiple encapsulated pressures |
| 04/21/2011 | DE102009050703B3 Verfahren zur Selbstassemblierung elektrischer, elektronischer oder mikromechanischer Bauelemente auf einem Substrat und damit hergestelltes Erzeugnis A method for self-assembly of electrical, electronic or micro-mechanical devices on a substrate and thereby product produced |
| 04/21/2011 | DE102009048200A1 Verfahren zum massenhaften Aufbringen von mikro- und/oder nanogroßen Strukturen auf feste Körper A method for mass application of micro- and / or nano-sized structures on solid bodies |
| 04/21/2011 | DE102009045693A1 Micromechanical component e.g. pirani-sensor, for use in Hall-sensor device utilized for measuring e.g. magnetic fields, has semiconductor region connected with semiconductor substrate by holding element that partially overstretches cavern |
| 04/21/2011 | DE10128577B4 Halbleiterdrucksensor mit Dehnungsmesser und Schaltungsabschnitt auf einem Halbleitersubstrat A semiconductor pressure sensor with strain gauges and circuit portion on a semiconductor substrate |
| 04/21/2011 | DE10023379B4 Membranmeßfühler und Membranmessfühleraufbauten, Verfahren zu ihrer Herstellung und mit ihnen angewandte Testverfahren Membranmeßfühler and membrane probe structures, processes for their preparation and applied them test method |
| 04/20/2011 | EP2311567A1 Capillary-channel probes for liquid pickup, transportation and dispense using spring beams |
| 04/20/2011 | EP2310911A1 Process and system for fabrication of patterns on a surface |
| 04/20/2011 | CN1994860B Silicon micromachine cantilever beam sensor driving structure, production method and uses under torsion mode |
| 04/20/2011 | CN102026909A Method for producing chips |
| 04/20/2011 | CN102025337A Resonator |
| 04/20/2011 | CN102024756A Method for forming nanometer crystalline silicon structure used for manufacturing integrated circuit devices |
| 04/20/2011 | CN102024667A Feeding driving mechanism and connecting component thereof |
| 04/20/2011 | CN102023234A Micromachined accelerometer with monolithic electrodes and method of making the same |
| 04/20/2011 | CN102020236A Micro-electromechanical system chip and package method thereof |
| 04/20/2011 | CN102020235A Low-moisture content packaging method for thin outline (TO) packaging structure and packaging assembly thereof |
| 04/20/2011 | CN102020234A Glue spraying processing device used in semiconductor manufacturing |
| 04/20/2011 | CN102020231A Enhanced Raman scattering substrates of silicon semiconductor and a manufacturing method and application for the same |
| 04/20/2011 | CN101694829B Sensor of electromechanical performance and microscopic structure for transmission electronic microscope and manufacturing method thereof |
| 04/20/2011 | CN101567394B Vertical surrounding grid junction type field effect transistor, preparation method and applications thereof |
| 04/20/2011 | CN101554987B Wafer-grade vacuum encapsulation process for micro-electro-mechanical system |
| 04/20/2011 | CN101538006B Method for preparing optical modulation thermal imaging focal plane array |
| 04/20/2011 | CN101538005B Manufacture method for optical modulation thermal imaging focal plane array |
| 04/20/2011 | CN101452907B Vertical interconnecting through-hole for three-dimensional systematic encapsulation, and preparation thereof |
| 04/20/2011 | CN101441112B Non-refrigeration infrared detector array based on monocrystal silicon PN junction and preparing method thereof |
| 04/20/2011 | CN101391744B Method for preparing micro needle array by means of lithography based on tilting rotary substrate and template |
| 04/20/2011 | CN101279710B Method for judging wafer backside alignment overlay accuracy and wafer thereof |
| 04/14/2011 | WO2011043086A1 Method for manufacturing microneedle stamper |
| 04/14/2011 | WO2011043085A1 Stamper for microneedle sheet, method for manufacturing the stamper, and method for manufacturing microneedle using the stamper |
| 04/14/2011 | WO2010147796A3 Selective uv-ozone dry etching of anti-stiction coatings for mems device fabrication |
| 04/14/2011 | WO2010139499A3 Micromechanical component with and method for producing an eutectic connection between two substrates and method for producing said type of micromechanical component |
| 04/14/2011 | WO2010093522A3 Display device with desiccant |
| 04/14/2011 | WO2010072675A3 Method for producing thin, free-standing layers of solid state materials with structured surfaces |
| 04/14/2011 | DE10392851B4 Verfahren zum Herstellen eines Mikroelektromechanischen variablen Kondensators A method of manufacturing a microelectromechanical variable capacitor |
| 04/14/2011 | DE102009045645A1 Sensor device has base plate, inertial mass and spring, where distance of counter electrode from rotation axis is less than distance of another counter electrode from rotational axis |
| 04/14/2011 | DE102009045541A1 Method for manufacturing micromechanical device, involves arranging micro-electro-mechanical system structures and bond contact surfaces respectively in rows on micro-electro-mechanical system-wafer |
| 04/14/2011 | DE102009045428A1 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil Manufacturing method for a micromechanical component and micromechanical component |
| 04/14/2011 | DE102009045421A1 Mikromechanische Struktur, Vewrfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur Micromechanical structure, Vewrfahren for manufacturing a micromechanical structure and use of a micromechanical structure |
| 04/13/2011 | EP2309130A2 Microfabricated elastomeric valve and pump systems |