Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
03/2012
03/15/2012WO2012033397A1 A method of fabricating silicon nano-channels
03/15/2012WO2012032856A1 Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid
03/15/2012WO2012032855A1 Processing liquid for suppressing pattern collapse of microstructure, and method for producing microstructure using same
03/15/2012WO2012031818A2 Lithography using self-assembled polymers
03/15/2012US20120064647 Method of fabricating microelectromechanical systems devices
03/15/2012DE102010045056A1 Verfahren und Vorrichtung zum Herstellen von Chip-Bauelementen sowie mittels des Verfahrens hergestelltes Chip-Bauelement Method and apparatus for the manufacture of chip components as well as produced by the method of chip component
03/15/2012DE102010040768A1 Spectral dispersion device e.g. transform spectrometer, for analyzing sample, has exit-side construction element fixed at substrate stack such that exit window is partially covered and optical exit diaphragm is defined
03/14/2012EP2428487A1 Integrated circuit comprising a device with a vertical mobile element integrated in a supporting substrate and method for manufacturing the device with a mobile element
03/14/2012EP1781566B1 Method for depositing a nonstick coating
03/14/2012CN102375332A Suspension photoresist planarization technology for MEMS structure
03/14/2012CN102375090A Micromechanical cantilever beam switch online microwave power detector and manufacturing method thereof
03/14/2012CN102374918A Micro-electromechanical Piezoresistive Pressure Sensor
03/14/2012CN102374910A Carbon nanotube / polymer composite membrane array type flexible force sensor and manufacturing method thereof
03/14/2012CN102372250A Method for etching metal tungsten material
03/14/2012CN102372249A Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough
03/14/2012CN102372248A Sensor module and method for manufacturing the same
03/14/2012CN101646117B Soft support bridge type silicon micro-piezoelectric microphone chip and prepration method thereof
03/13/2012US8133455 Micro-fabricated stamp array for depositing biologic diagnostic testing samples on bio-bindable surface
03/13/2012US8133338 Stack structure and method of manufacturing the same
03/08/2012WO2012030660A1 Flexible film interferometric modulator devices and methods of forming the same
03/08/2012WO2012028595A1 Process for producing a microfluidic apparatus and related laminating devices
03/08/2012DE102008005350B4 Mikrofluidische Vorrichtungen mit Nanokanälen Microfluidic devices with nanochannels
03/07/2012EP2426237A1 Mold and manufacturing method therefor
03/07/2012EP2215008B1 Module housing and method for producing a module housing
03/07/2012CN102368098A Submicron diffraction grating with modulatable period and preparation method thereof
03/07/2012CN102367165A Method for interconnecting electrodes of MEMS (micro electro mechanical system) device based on SOI (silicon-on-insulator)
03/07/2012CN102367164A One-dimensional microstructural array and preparation method thereof
03/07/2012CN101973510B Method for preparing gas-sensitive sensor element based on carbon nano tube microarray/tungsten oxide nano composite structure
03/07/2012CN101893483B Packaging technology and packaging device of non-refrigerated infrared focal plane array device
03/07/2012CN101656147B Method for preparing soft magnetic alloy thin strip magnetic core solenoid micro inductor
03/06/2012US8129802 Integrated micro electro-mechanical system and manufacturing method thereof
03/06/2012US8129255 Firm, insulating and electrically conducting connection of processed semiconductor wafers
03/01/2012WO2012025334A1 Component and method for producing a component
03/01/2012WO2011095386A3 Production method for a porous micro needle assembly having rear face connection and corresponding porous micro needle assembly
03/01/2012DE102010036217A1 Method for manufacturing hermetic housing for microsystem e.g. microelectromechanical system (MEMS), involves placing base with lid in protective atmosphere, and forming adhesive joint between base and lid
03/01/2012DE102010035606A1 Fabricating microstructure with inner metal structure, comprises preparing substrate structure with internal fluid channel, introducing electrolyte solution into fluid channel, and forming internal metal structure
03/01/2012DE102009047922B4 Gitterstruktur für die Oberflächenplasmonenresonanzspektroskopie Grid structure for surface plasmon resonance spectroscopy
03/01/2012DE102007050873B4 Verfahren zum Erzeugen einer integrierten HPLC-Säule oder gaschromatographischen Kapillarsäule in einem Titansubstrat A method for generating an integrated HPLC column, or by gas chromatography capillary column in a titanium substrate
03/01/2012DE102004062992B4 Schaltbares Hochfrequenz-MEMS-Element mit bewegbarem Schaltelement und Verfahren zu seiner Herstellung Switchable RF MEMS element with movable switching element and method for its preparation
02/2012
02/29/2012EP2423159A1 Methods of forming alpha and beta tantalum films with controlled and new microstructures
02/29/2012EP2423158A1 Methods of forming alpha and beta tantalum films with controlled and new microstructures
02/29/2012EP2423157A2 MEMS pressure sensor device and method of fabricating same
02/29/2012EP2422197A2 Multiplexed biomolecule arrays made by polymer pen lithography
02/29/2012EP2421792A1 Method for making a cavity in the body of a substrate capable of forming a site for receiving a component
02/29/2012EP2421656A1 Atomising body, atomising device, inhaler, manufacturing method of manufacturing an atomising body and assembly method for assembling an atomising device
02/29/2012EP2125607B1 Sensor element for measuring relative pressure and method of manufacture
02/29/2012CN202153165U 一种电容式mems压力传感器 Capacitive pressure sensor mems
02/29/2012CN102365229A Sensor device with reduced parasitic-induced error
02/29/2012CN102363520A Wafer level three-dimensional encapsulation method for micro-electro-mechanical system (MEMS) device
02/29/2012CN101987719B Sensing element structure and manufacturing method
02/29/2012CN101823684B Method for preparing butterfly lepidoptera-simulated hierarchical multi-layer symmetrical micro/nano structure
02/28/2012US8124435 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
02/28/2012US8124218 Microfabricated elastomeric valve and pump systems
02/28/2012US8123963 Method for producing a semiconductor component and a semiconductor component produced according to the method
02/23/2012WO2011094486A3 Assembly of flat layer on structured glass layers
02/23/2012US20120046639 Microfluidic free interface diffusion techniques
02/23/2012DE10206711B4 Mikromechanisches Bauelement Micromechanical component
02/23/2012DE102009043412B4 Verbindungs-Element mit dreidimensionaler Mikro-Struktur, Anordnung mit mindestens zwei der Verbindungs-Elemente und Verwendung des Verbindungs-Elements Connection element with three-dimensional micro-structure arrangement with at least two of the connecting elements and use of the connecting element
02/23/2012DE102009019393B4 Verfahren zur Herstellung von Mikrostrukturen, die ein hohes Aspektverhältnis aufweisen A process for the production of microstructures having a high aspect ratio
02/23/2012DE102009015306B4 Verfahren zur Herstellung von MEMS-Bauelementen A process for the production of MEMS devices
02/22/2012EP2419926A1 Acid-etch resistant, protective coatings
02/22/2012CN102362346A Via structure and method thereof
02/22/2012CN102360121A Digital micro-mirror device and forming method thereof
02/22/2012CN102360120A Digital micro-mirror device and forming method thereof
02/22/2012CN102360119A Light modulator pixel unit and manufacturing method thereof
02/22/2012CN102360039A Five-port micromachine cantilever-based capacitance type microwave power sensor and manufacturing method thereof
02/22/2012CN102359981A Resistance type gas sensor with two support suspension beams and six-layer structure, and method thereof
02/22/2012CN102359980A Resistance-type gas sensor with two support suspension beams and four-layer structure and method
02/22/2012CN102359836A Manufacturing methods of MEMS piezoresistive pull pressure chip and sensor
02/22/2012CN102359828A Micro-electronic temperature sensor and manufacturing process thereof
02/22/2012CN102358616A Airtight sintering device of glass tube and MEMS chip
02/22/2012CN102358615A Preparation method of multifunctional integrated nano-wire array
02/22/2012CN102358614A Processing method of graphene nano-patterns
02/22/2012CN102358613A Manufacturing method of micro-electromechanical systems (MEMS) arch structure
02/22/2012CN102358612A Silicon-based coplanar micro-gas sensor chip and its application in micro-gas sensor preparation
02/22/2012CN102358611A Dielectrophoretic force embossing and forming method for manufacturing microlens array with parabolic concave surface
02/22/2012CN102358610A Preparation method of conductive polymer one-dimensional nanostructured array
02/22/2012CN102358609A System and method for display device with integrated desiccant
02/22/2012CN101830427B 基于mems技术的抗磁粒子三维操纵装置 Mems technology-based anti-dimensional magnetic particle manipulation device
02/22/2012CN101776603B 一种利用人工金属微纳结构实现拉曼散射增强的方法 One way to achieve artificial metallic micro- and nanostructures using enhanced Raman scattering
02/22/2012CN101117207B 对于微型装置的抗粘连材料的原位应用 For the in situ application of anti-adhesion material of the micro-device
02/16/2012WO2012021776A2 Method of forming monolithic cmos-mems hybrid integrated, packaged structures
02/16/2012WO2011138635A8 Capillary electrophoresis chips
02/16/2012WO2011128446A3 Method for manufacturing a hermetically sealed structure
02/16/2012DE102011079232A1 Struktur und verfahren zur anordnung eines schwingungsisolierten targets Structure and process for the formation of a vibration-isolated targets
02/16/2012DE102010039330A1 Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung A method of making an electrical plated-through hole in a substrate as well as substrate to an electrical through-contact
02/16/2012DE102010039298A1 Verfahren zum Füllen von Hohlräumen in Wafern, entsprechend gefülltes Sackloch und Wafer mit entsprechend gefüllten Isolationsgräben A method for filling cavities in wafers, according blind hole and filled wafer with corresponding filled isolation trenches
02/16/2012DE102010039293A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
02/16/2012DE102010039180A1 Method for manufacturing semiconductor chip for micro-electro-mechanical systems structure used in e.g. acceleration sensor, involves depositing seed layer of polycrystalline silicon on lateral regions of arrangement
02/16/2012DE102010034085A1 Prägewerkzeuge für Mikrostrukturelemente Embossing tools for microstructural elements
02/16/2012DE102009021244B4 MEMS-Bauelement, Halbleiterchip und Verfahren zu dessen Herstellung MEMS device, semiconductor chip and process for its preparation
02/15/2012EP2418170A2 Method for arranging fine particles on substrate by physical pressure
02/15/2012EP2418169A2 Method for manufacturing printed product by aligning and printing fine particles
02/15/2012EP2417054A2 Sensor device with reduced parasitic-induced error
02/15/2012CN102356349A Pixel black mask design and formation technique
02/15/2012CN102354789A MEMS (micro-electromechanical system)-based microwave power coupler with reconfigurable coupling degrees and preparation method thereof
02/15/2012CN102354052A Digital micro-mirror device and forming method thereof
02/15/2012CN102354049A System and method for protecting micro-structure of display array using spacers in gap within display device
02/15/2012CN102353811A Microelectronic acceleration sensor and manufacturing process thereof
02/15/2012CN102353709A Preparation method and application of myoglobin electrochemical biosensor fixed on alloy oxide nanotube array
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