Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 1 - Manufacture or treatment of devices or systems in or on a substrate
Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
04/2012
04/18/2012CN102417156A 一种刻蚀金属钼材料的方法 A method for etching metal molybdenum materials
04/18/2012CN102417155A Production method of tri-axial accelerometer
04/18/2012CN102417154A Multiple bonding in wafer level packaging
04/18/2012CN101955152B 具有倒y形通孔的圆片级气密性封装方法 An inverted y-shaped through-hole tightness wafer level packaging method
04/18/2012CN101704498B 静电致动器及其制备方法、抗瞬时扰动方法 Electrostatic actuator and its preparation method, anti-transient perturbation method
04/18/2012CN101359645B Semiconductor device, premolding packaging structure and manufacture method
04/12/2012WO2012045835A1 Anti-stiction method in an inertial mems, corresponding computer program product, storage means and device
04/12/2012WO2011159351A3 Electrodes to improve reliability of nanoelectromechanical systems
04/12/2012US20120085728 Novel process for MEMS scanning mirror with mass remove from mirror backside
04/12/2012DE112005001713B4 Verfahren zum Ätzen und Herstellen einer Mikrospiegelvorrichtung A method of etching and producing a micromirror device
04/12/2012DE102011084014A1 Integrierte Schaltungen mit Magnetkerninduktoren und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same Magnetkerninduktoren
04/12/2012DE102010042113A1 Semiconductor component for use in micro-electromechanical system in microsystems technology, has dielectric closure layer attached on structured dielectric layer, where surface of layer comprises depth profile in direction of chip interior
04/12/2012DE102007056992B4 Verfahren zur Erzeugung von Submikrometer-Strukturen an einer ausgeprägten Topographie A process for the production of submicron structures on a pronounced topography
04/12/2012DE102007013410B4 Verfahren zum Ausbilden von Diamant-Mikrokanal-Strukturen und daraus resultierende Vorrichtungen A method for forming diamond micro-channel structures and resultant devices
04/12/2012CA2809073A1 Anti-stiction method in an inertial mems, corresponding computer program product, storage means and device
04/11/2012EP2440025A1 Covering device for an organic substrate, substrate with a covering device, and method for producing a covering device
04/11/2012EP2439172A1 Anti-stiction method in an inertial MEMS
04/11/2012EP2438767A1 Component having a micro-mechanic microphone structure and method for producing same
04/11/2012EP2438005A2 Micromechanical component having eutectic bond between two substrates and method for producing such a micromechanical component
04/11/2012EP1546028B1 Method for selectively covering a micro machined surface
04/11/2012CN102413408A 一种增加背腔空间的微机电麦克风芯片及其制作工艺 An increase in MEMS microphone chip and its manufacturing process back cavity space
04/11/2012CN102411088A 四输入微机械固支梁热电式微波功率传感器及制备方法 Four inputs clamped beam micromechanical thermoelectric microwave power sensors and preparation methods
04/11/2012CN102411087A 呈90°角四输入微电子机械微波功率传感器及制备方法 90 ° angle four-input MEMS microwave power sensor and the preparation method was
04/11/2012CN102411086A Five-port capacitance type microwave power sensor based on micro mechanical clamped beam
04/11/2012CN102408094A 高重复性表面增强拉曼光谱活性基底的制备方法 High repeatability surface enhanced Raman spectroscopy active preparation of the substrate
04/11/2012CN102408093A 隔离腔体的制造方法 The method of producing a cavity isolated
04/11/2012CN102408092A Semiconductor manufacturing and semiconductor device with semiconductor structure
04/11/2012CN102408091A 一种改进的微机电系统平台圆片级封装结构 An improved MEMS wafer level package structure of the platform
04/11/2012CN102408090A Microstructure with enhanced anchor
04/11/2012CN101898746B 要求不同气氛压力的mems器件圆片级集成封装方法 Require different atmosphere pressure mems device wafer level packaging method to integrate
04/11/2012CN101788605B 无线接收式微电子机械微波频率检测系统及其制备方法 Wireless receiver type MEMS microwave frequency detection system and its preparation method
04/10/2012US8153079 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection
04/10/2012CA2721172C Microfabricated elastomeric valve and pump systems
04/05/2012WO2012043726A1 Base body and method for manufacturing base body
04/05/2012WO2012042059A1 Method for the manufacture of articles of thiol-ene polymers
04/05/2012WO2012040861A1 Digital microfluidic devices and methods incorporating a solid phase
04/05/2012WO2011114018A3 Method of forming a pattern on the surface of a substrate
04/05/2012DE102011084024A1 Method for preparing semiconductor structure i.e. micro-electromechanical pressure sensor, involves removing portion of main surface of substrate opposite to other main surface to depth of trenches
04/05/2012DE102010041900A1 Micromechanical component e.g. acceleration sensor, manufacturing method, involves forming trench of sacrificial layer under gitter mask structures that remain overstretched after etching of structures, and closing structures
04/05/2012DE102010041763A1 Mikromechanisches Substrat Micromechanical substrate
04/05/2012CA2813090A1 Digital microfluidic devices and methods incorporating a solid phase
04/04/2012EP2435358A1 Self-deformable mirrors and the support thereof
04/04/2012EP2435357A2 Method of accurately spacing z-axis electrode
04/04/2012EP2435356A1 A moems apparatus comprising a comb drive and a method for manufacturing same
04/04/2012CN202181210U 长玻璃柱体阳极键合的加热加压装置 Long glass cylinder anodic bonding of heat and pressure device
04/04/2012CN1872657B 微结构及其制造方法 Micro-structure and manufacturing method
04/04/2012CN102403561A 微电子机械悬臂梁开关式微波功率耦合器及其制备方法 MEMS cantilever switch-mode microwave power coupler and its preparation method
04/04/2012CN102401842A Non-equal height comb teeth capacitive triaxial acceleration transducer and method for manufacturing same
04/04/2012CN102401840A Si基HEMT嵌入式微加速度计及其生产方法 Si-based HEMT embedded micro-accelerometer and its production method
04/04/2012CN102401706A Mems压力传感器件及其制造方法 Mems device and method of manufacturing the pressure sensor
04/04/2012CN102398890A 一种玻璃基微流控芯片的超声波加工方法 A glass-based microfluidic chip ultrasonic machining method
04/04/2012CN102398889A 一种在（100）型soi硅片表面自上而下制备纳米结构的方法 A (100) silicon surface soi type top-down approach for preparing nanostructures
04/04/2012CN102398888A 晶圆级封装 Wafer Level Packaging
04/04/2012CN102398887A 一种深孔硅刻蚀方法 A deep silicon etching method
04/04/2012CN102398886A 具微机电元件的封装结构及其制法 Jiqizhifa package structure with micro-electromechanical components
03/2012
03/29/2012WO2012040245A2 Through silicon via with reduced shunt capacitance
03/29/2012WO2012040211A2 Microelectromechanical pressure sensor including reference capacitor
03/29/2012DE102010046966A1 Baustein, Verfahren zur Herstellung eines Bausteins und Vorrichtung zur Laser-Ablation Module, process for manufacturing a device and apparatus for laser ablating
03/29/2012DE102010041287A1 Verfahren zum Herstellen einer fluidischen Vorrichtung A method of manufacturing a fluidic device
03/29/2012DE102006040235B4 Verfahren zur Herstellung einer optischen Vorrichtung, sowie hiermit hergestellte optische Vorrichtung A process for producing an optical device and optical device produced therewith
03/28/2012EP2432728A2 Methods and systems for fabrication of mems cmos devices
03/28/2012EP2432727A2 Substrate with multiple encapsulated pressures
03/28/2012EP1963227B1 Micromechanical component and production method
03/28/2012EP1719012B1 Mems scanning system with improved performance
03/28/2012CN1717437B Sacrificial compositions, methods of use thereof, and methods of decomposition thereof
03/28/2012CN102393487A 72-degree five-port micro-electromechanical microwave power sensor and manufacturing method thereof
03/28/2012CN102393252A Two-layer micrometering bolometer and manufacturing method thereof
03/28/2012CN102393251A Two-layer micrometering bolometer and manufacturing method thereof
03/28/2012CN102390804A Method and system used for manufacturing nanometer channel by combining dynamic nanometer scraping and plasma body
03/28/2012CN102390803A High-overload and recoverable pressure sensor and manufacturing method thereof
03/28/2012CN102390802A Indentation forming method comprising electric capillary force driving filling and back electric field-assisted demoulding
03/28/2012CN101935009B Method for manufacturing intermediate P-type electrode of tunable resonant cavity enhanced detector
03/28/2012CN101850944B Method for sedimentating silicon nitride thin film by using 13.56 MHz radio frequency power source
03/28/2012CN101823685B Bionic micro/nano structure preparing method
03/28/2012CN101804960B Ultra-fine cone electrode array and method for manufacturing same
03/28/2012CN101479185B MEMS device and its manufacture method
03/28/2012CN101301991B Micromechanical component, device for designing micromechanical component, procedures for manufacturing micromechanical component, and micro-mechanical system
03/27/2012US8142669 Electromechanical element, electric circuit device and production method of those
03/22/2012WO2012037539A1 Micromachined 3-axis accelerometer with a single proof-mass
03/22/2012WO2012037538A2 Micromachined monolithic 6-axis inertial sensor
03/22/2012WO2012037537A2 Sealed packaging for microelectromechanical systems
03/22/2012WO2012037501A2 Flexure bearing to reduce quadrature for resonating micromachined devices
03/22/2012WO2012037492A2 Multi-die mems package
03/22/2012DE102011082885A1 Laserstrukturierungsvorrichtung und Laserstrukturierungsverfahren Laser patterning apparatus and laser ablation method
03/22/2012DE102010041129A1 Multifunktionssensor als PoP-mWLP Multifunction sensor as PoP mWLP
03/22/2012DE102010041101A1 Bauelement mit einer Durchkontaktierung Component with a via
03/21/2012EP2019812B1 Method for producing a micromechanical component having a membrane and micromechanical component
03/21/2012EP1949147B1 Method of producing a diffraction grating element
03/21/2012CN102386238A Sensor apparatus and method for mounting semiconductor sensor device
03/21/2012CN102386166A Wafer level package including a device wafer integrated with a passive component
03/21/2012CN102385001A Three-channel micro-mechanical cantilever beam indirect-type microwave power sensor and preparation method
03/21/2012CN102384984A Capacitive single-mass block full comb electrode sensor for triaxial acceleration and manufacturing method thereof
03/21/2012CN102381682A Method and device for preparing silicon-based three-dimensional (3D) microstructure
03/21/2012CN102381681A Micromechanical structure and integrated circuit monolithic integrated processing method
03/21/2012CN102381680A Micromechanical structures and integrated circuit monolithic integrated processing method
03/21/2012CN102381679A Manufacturing method of gecko hair-imitating dry adhesive
03/21/2012CN102381678A MEMS device assembly and method of packaging same
03/21/2012CN102381677A Composite wafer semiconductor
03/20/2012US8137569 Method of fabricating a membrane having a tapered pore
03/15/2012WO2012033645A1 Process of forming an air gap in a microelectromechanical system device using a liner material
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