Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
08/2013
08/28/2013CN101776476B Systems, gyroscope sensors, and fabrication methods for forming structures for the gyroscope sensors.
08/22/2013WO2013122585A1 Method and apparatus for buidlling three-dimensional mems elements
08/22/2013WO2013121253A1 Methods for forming a sealed liquid metal drop
08/22/2013WO2013095147A4 Method of bonding two substrates and device manufactured thereby
08/22/2013WO2013082064A3 Method to align covers on structured layers and resulting devices
08/22/2013US20130214405 Component and Method for Producing a Component
08/22/2013US20130214368 Semiconductor integrated device assembly process
08/22/2013DE102013201509A1 Optisches Bauelement Optical component
08/22/2013DE102013201506A1 Optisches Bauelement Optical component
08/22/2013DE102012202611A1 Manufacturing a micro-system by deep reactive-ion etching, comprises e.g.: providing an etching tool for deep reactive-ion etching, carrying out multiple repeating-processing intervals of the deep ion etching including an etching step
08/21/2013EP2629084A1 Integrated circuit and manufacturing method
08/21/2013EP2628708A1 Microelectronic substrate having a buried layer of organic material
08/21/2013EP2627605A2 Process for producing highly ordered nanopillar or nanohole structures on large areas
08/21/2013CN103262207A Multi-layer substrate structure and manufacturing method for the same
08/21/2013CN103260125A Chip packaging structure and manufacturing method thereof
08/21/2013CN103258778A Method for preparing substrate with hollow cavity
08/21/2013CN103253628A Method for manufacturing and assembling tiny metal parts based on deep etching technique
08/21/2013CN103253627A Semiconductor integrated device assembly process
08/21/2013CN103253626A Silicon material taper structure and preparation method thereof
08/21/2013CN103253625A Micro-electro mechanical systems (mems) structures and methods of forming the same
08/21/2013CN102538949B Nano-electromechanical resonant sensor based on graphene sheet layer and manufacturing method thereof
08/21/2013CN101767765B Micro electromechanical element with protective ring and manufacture method thereof
08/21/2013CN101665231B Structure of thin film device manufactured by means of double-faced opposite-penetrated corrosion based on (100) silicon chip and method thereof
08/21/2013CN101665230B Micro-electro-mechanical systems (mems) package and method for forming the mems package
08/21/2013CN101636344B Mems cavity-coating layers and methods
08/21/2013CN101355076B Integrated circuit having a semiconductor substrate with a barrier layer
08/20/2013US8512578 Multi-step release method for electrochemically fabricated structures
08/15/2013WO2013119832A1 Anhydride copolymer top coats for orientation control of thin film block copolymers
08/15/2013WO2013119811A1 Using chemical vapor deposited films to control domain orientation in block copolymer thin films
08/15/2013WO2013064634A3 Micromechanical element, component having a micromechanical element, and method for producing a component
08/15/2013US20130207281 Microelectronic substrate comprising a layer of buried organic material
08/15/2013US20130207208 Pressure Sensor with Doped Electrode
08/14/2013EP2626208A1 Micro-extrusion printhead with offset orifices for generating gridlines on non-square substrates
08/14/2013DE102013202212A1 Zweistufig gemoldeter Sensor Two-stage gemoldeter sensor
08/14/2013DE102012202183A1 Micromechanical structure, has aeration layer formed as lime layer in cavity for releasing gas in cavity and comprising reactant for endothermic reaction, and heating device provided in cavity for providing thermal energy to aeration layer
08/14/2013DE102012201981A1 Micromechanical component for deflecting light beams in e.g. pico projector, has assembly comprising torsion bars and bending bar, where torsion bars are suspended at drive body over bending bar aligned inclined to longitudinal direction
08/14/2013DE102012201976A1 Bauelement mit einer Durchkontaktierung Component with a via
08/14/2013DE102009031545B4 Verfahrenen zur Herstellung eines Mikroelektromechanischen-System- (MEMS-) Bauelements Traversed for producing a micro-electro-mechanical system (MEMS) device
08/14/2013CN203128182U Sensor packaging device
08/14/2013CN103245990A Novel high-permeable and high-haze easy-to-clean diffusion plate and preparation method thereof
08/14/2013CN103245653A Uniform-height nano-silver surface-enhanced Raman scattering active substrate
08/14/2013CN103245634A Miniature single-chip integrated infrared gas sensor
08/14/2013CN103245421A Pyrogenicity type MEMS (micro-electro-mechanical system) thermopile infrared detector structure and manufacturing method thereof
08/14/2013CN103241708A Preparation method of substrate with cavity
08/14/2013CN103241707A Method for packaging wafer-level chip of gallium arsenide image sensor and its structure
08/14/2013CN103241706A Manufacturing method for stress-matching bimaterial microcantilever
08/14/2013CN103241705A Manufacturing method for local termination layer of silicon corrosion
08/14/2013CN103241704A Three-dimensional integrated sensor and production method thereof
08/14/2013CN103241703A Electronic device, method for manufacturing thereof, and electronic apparatus
08/14/2013CN103241702A Electronic device, method for manufacturing thereof, and electronic apparatus
08/14/2013CN103241701A 3-degree of freedom (DOF) silicon-based plane parallel-connection positioning platform with automatic displacement detecting function and manufacture method
08/08/2013WO2013014321A3 Magnetometer mems cmos device including a multiwire compass
08/08/2013US20130200957 Mems oscillator and manufacturing method thereof
08/08/2013US20130200473 Micromechanical component and method for the manufacture of same
08/08/2013DE102013001674A1 Vertikale druckempfindliche Struktur Vertical pressure sensitive structure
08/08/2013DE102012201714A1 Method for manufacturing micro fluid system used in e.g. medical field, involves providing connecting element with respect to the position on the primary polymer layer
08/08/2013DE102012201713A1 Method for positioning e.g. sensors in microelectromechanical system, involves positioning microstructure elements within frame located on or below platform or between parts of frame, where parts of frame are extended over platform
08/08/2013DE102012201480A1 Mikromechanisches Bauelement und Verfahren zu dessen Herstellung Micromechanical component and method for its production
08/08/2013DE102010062149B4 MEMS-Mikrophonhäusung und MEMS-Mikrophonmodul MEMS and MEMS microphone module Mikrophonhäusung
08/07/2013EP2624290A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624289A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2623991A1 Base body and method for manufacturing base body
08/07/2013EP2622002A1 Method for the manufacture of articles of thiol-ene polymers
08/07/2013CN203112491U Parasitic motion principle-based high-efficiency micro array machining device
08/07/2013CN103235483A Large-area nanometer imaging device and large-area nanometer imaging method
08/07/2013CN103235156A Single elastic beam type interdigital capacitor accelerometer
08/07/2013CN103233273A Plasma etching method
08/07/2013CN103233229A Simplified tungsten-titanium alloy film photolithography process
08/07/2013CN103232023A Silicon microstructure processing method based on femtosecond laser treatment and wet etching
08/07/2013CN103232022A Batch thermal-forming micromachining method for three-dimensional surface microstructure
08/07/2013CN103231518A Polydimethylsiloxane array micropore film preparation method
08/07/2013CN102411088B Four-input micromechanical clamped beam thermoelectric microwave power sensor and preparation method thereof
08/07/2013CN102411086B Five-port capacitance type microwave power sensor based on micro mechanical clamped beam
08/07/2013CN102393487B 72-degree five-port micro-electromechanical microwave power sensor and manufacturing method thereof
08/07/2013CN102385001B Three-channel micro-mechanical cantilever beam indirect-type microwave power sensor and preparation method
08/07/2013CN102360039B Five-port micromachine cantilever-based capacitance type microwave power sensor and manufacturing method thereof
08/07/2013CN102338825B 120-degree three-channel micro electro mechanical microwave power sensor and preparation method thereof
08/07/2013CN102323475B Three-channel micromechanical clamped beam indirect microwave power sensor and preparation method
08/01/2013WO2013078364A8 Articles, systems, and methods relating to thermal stability of nanostructured and/or microstructured materials
08/01/2013WO2013068633A3 Methods and systems for mems cmos-based radio frequency filters having arrarys of elements
08/01/2013WO2013061313A8 Method for manufacturing a protective layer against hf etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
08/01/2013US20130195723 Methods, systems and devices for forming nanochannels
08/01/2013US20130193529 Micro-electromechanical semiconductor component and method for the production thereof
08/01/2013DE102012201304A1 Mikromechanische Feststoffelektrolyt-Sensorvorrichtung und entsprechendes Herstellungsverfahren Micromechanical solid electrolyte sensor device and manufacturing method thereof
07/2013
07/31/2013EP2620409A1 Method for producing thin, free-standing layers of solid state materials with structured surfaces
07/31/2013EP2620408A1 Method for producing thin, free-standing layers of solid state materials with structured surfaces
07/31/2013EP2619536A2 Microelectromechanical pressure sensor including reference capacitor
07/31/2013EP2619130A2 Through silicon via with reduced shunt capacitance
07/31/2013CN203089372U Medical devices
07/31/2013CN103226125A Micromechanical solid-electrolyte sensor device and corresponding production method
07/31/2013CN103224219A Integration method of nanometer getter used for micro-device wafer level packaging
07/31/2013CN103224218A Encapsulation method of MEMS device
07/31/2013CN103224217A Systems and methods for conductive pillars
07/31/2013CN103224216A A microelectronic mechanical system (MEMS) structure equipped with substrate through holes and a forming method therefore
07/31/2013CN103224215A Hexagonal nanosheet array and preparation method thereof
07/31/2013CN102690128B Regulating device and method for super hydrophobic surface wettability
07/31/2013CN102180442B Microparticle capturing device and microparticle transport equipment using same
07/31/2013CN101588988B Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly
07/31/2013CN101548184B Biochip reader
07/30/2013CA2517988C Method for manufacturing microstructures having multiple microelements with through-holes
1 ... 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 ... 146