Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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01/22/2014 | EP2686268A2 Controlled fabrication of nanopores in nanometric solid state materials |
01/22/2014 | CN103534647A Photosensitive resin composition for forming biochip, and biochip |
01/22/2014 | CN103534196A Method for achieving smooth side walls after bosch etch process |
01/22/2014 | CN103534195A Method of forming membranes with modified stress characteristics |
01/22/2014 | CN103531909A Terahertz frequency-scanning H-plane sectoral horn antenna and preparation method thereof under bulk silicon MEMS (micro-electromechanical system) process |
01/22/2014 | CN103528576A Hemispherical resonance micro mechanical gyroscope and processing technology thereof |
01/22/2014 | CN103523745A Si conductive post based wafer-level packaging method and monolithic integrated MEMS (Micro Electro Mechanical System) chip for same |
01/22/2014 | CN103523744A Two-stage grating positioning method of high-speed precise motion platform |
01/22/2014 | CN103523743A Miniature friction energy harvester and method for manufacturing same |
01/22/2014 | CN103523742A Radiation dosage detector of MOS structure and preparation method thereof |
01/22/2014 | CN103523741A Hybrid integrated component and method for the manufacture thereof |
01/22/2014 | CN103523740A Micromechanical assembly, method for manufacturing the micromechanical assembly and method for operating the micromechanical assembly |
01/22/2014 | CN103523739A Packaging structure of three-dimensional flexible substrate of environment MEMS sensor and manufacturing method |
01/22/2014 | CN103523738A Micro electro mechanical system sheet and manufacturing method thereof |
01/22/2014 | CN103523737A MEMS-based interdigital gap beam structure energy collector and manufacturing method thereof |
01/22/2014 | CN103523736A Hierarchical structure and preparing method thereof |
01/21/2014 | US8632714 Mold structures, and method of transfer of fine structures |
01/16/2014 | WO2014008819A1 Micro-electro-mechanical systems structure and sacrificial layer wet etching method thereof |
01/16/2014 | WO2013138706A3 Systems and methods for containing biological samples |
01/16/2014 | WO2013132065A3 Micromechanical measuring element, and method for producing a micromechanical measuring element |
01/16/2014 | WO2012150278A9 Hierarchical carbon nano and micro structures |
01/16/2014 | US20140017844 Integrated circuit switches, design structure and methods of fabricating the same |
01/16/2014 | US20140017843 Semiconductor package and manufacturing method thereof |
01/16/2014 | US20140017842 Methods for forming a sealed liquid metal drop |
01/16/2014 | US20140016798 Mems device |
01/16/2014 | US20140015071 Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer |
01/16/2014 | DE102008060796B4 Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur A method of forming a micro-surface structure as well as for manufacturing a microelectromechanical device, micro-structure and surface micro-electromechanical device having such a structure |
01/15/2014 | EP2684837A2 Wafer level sensor package and method of forming same |
01/15/2014 | CN103518138A Method of fabricating an inertial sensor |
01/15/2014 | CN103510088A Solid-state hole array and manufacturing method thereof |
01/15/2014 | CN103508413A Method for manufacturing a component having an electrical through-connection |
01/15/2014 | CN103508412A Encapsulating method of pressure sensor chip and pressure sensor |
01/15/2014 | CN103508411A Preparation method of microfluidic monolithic column chip and application of chip in raman detection |
01/15/2014 | CN103508410A Method for manufacturing a component having an electrical through-connection |
01/15/2014 | CN103508409A Control method of silicon membrane corrosion thickness |
01/15/2014 | CN103508408A Hybrid integrated component and method for manufacturing the same |
01/15/2014 | CN103508407A Package structure having micro-electro-mechanical element and method of fabricating the same |
01/15/2014 | CN103508406A AZO thin film, preparing method and MEMS device comprising AZO thin film |
01/15/2014 | CN102520376B Cross current type three-axis vector magnetic sensor |
01/15/2014 | CN102496470B Asymmetric miniature ultracapacitor based on MEMS technology and manufacturing method thereof |
01/15/2014 | CN102216015B Machine and method for machining a part by micro-electrical discharge machining |
01/15/2014 | CN102110585B Method for manufacturing metal layer |
01/14/2014 | CA2462098C Method and electrode for defining and replicating structures in conducting materials |
01/09/2014 | WO2014008110A1 Compliant bipolar micro device transfer head with silicon electrodes |
01/09/2014 | WO2014005496A1 Mems chip and manufacturing method therefor |
01/09/2014 | WO2013035247A3 High aspect ratio structure and method for manufacturing the same |
01/09/2014 | US20140011313 Leadframe-based premolded package having air channel for microelectromechanical system (mems) device |
01/09/2014 | US20140010960 Method of producing microstructured gel |
01/09/2014 | US20140008740 Mems microphone and method for packaging the same |
01/09/2014 | US20140008738 Mems die and methods with multiple-pressure sealing |
01/09/2014 | US20140007705 Microelectromechanical load sensor and methods of manufacturing the same |
01/08/2014 | EP2682363A1 Method for producing a mems device including a vapour release step |
01/08/2014 | EP2681568A1 Method of fabricating an inertial sensor |
01/08/2014 | CN103502139A Implantation of gaseous chemicals into cavities formed in intermediate dielectric layers for subsequent thermal diffusion release |
01/08/2014 | CN103502138A Method for the wafer-level integration of shape memory alloy wires |
01/08/2014 | CN103501852A Method for manufacturing microstructure body |
01/08/2014 | CN103499534A High-sensitivity terahertz microfluidic channel sensor and preparation method thereof |
01/08/2014 | CN103496665A Pressure, flow and temperature integrated chip and method for manufacturing same |
01/08/2014 | CN103496664A Method for manufacturing self-support polymer structure with large depth-width ratio |
01/07/2014 | US8623458 Methods of directed self-assembly, and layered structures formed therefrom |
01/03/2014 | WO2014000708A1 Aluminum-doped zinc oxide thin film, preparation method thereof, and micro electro mechanical system device comprising same |
01/03/2014 | WO2014000332A1 Solid-state aperture array and fabrication method thereof |
01/02/2014 | US20140004374 Multi-Layer Encapsulated Structures |
01/02/2014 | US20140003746 Nano/micro roller bearing having tolerance compensation function and method of manufacturing the same |
01/02/2014 | US20140001584 Mems pressure sensor and manufacturing method therefor |
01/02/2014 | US20140001581 Mems microphone and forming method therefor |
01/02/2014 | US20140001580 Transducer with Enlarged Back Volume |
01/02/2014 | US20140001579 Mems pressure sensor and manufacturing method therefor |
01/02/2014 | DE112005002435B4 Salzschmelzebad, Abscheidung erhalten unter Verwendung des Salzschmelzebades, Herstellungsverfahren für ein Metallprodukt und Metallprodukt Molten salt bath, deposition obtained using the molten salt bath, manufacturing method of a metal product, and the metal product |
01/01/2014 | EP2680298A1 Method and device for detecting termination of etching |
01/01/2014 | EP2679537A1 Method for producing metal lines on top of a non-flat mems topography |
01/01/2014 | EP2678672A1 Biosensor and method of manufacturing such a biosensor |
01/01/2014 | CN203377207U Vacuum-packaged CMOS and MEMS chip |
01/01/2014 | CN203373144U Packaging structure for micro electro mechanical system chip |
01/01/2014 | CN103489751A Method and electrode structure for improving microelectrode array electrode density based on electrochemical bipolar behavior |
01/01/2014 | CN103488051A Preparation method of composite structure of photoresist film and substrate for LIGA (Lithographie, Galvanoformung and Abformung) technology |
01/01/2014 | CN103487474A MEMS (micro-electromechanical systems) capacitive humidity sensor with high sensitivity and fast response |
01/01/2014 | CN103487467A Manufacturing process of minitype gas-sensitive sensor of integrated heating element |
01/01/2014 | CN103482566A Deep groove manufacturing method used in MEMS process |
01/01/2014 | CN103482565A Method for preparing porous array polyethylene template |
01/01/2014 | CN103482564A Graphical hydrophilic/hydrophobic composite surface preparation process based on nano particle mask etching |
01/01/2014 | CN103482563A MEMS microstructure preparation method |
01/01/2014 | CN103482562A Tiny gas sensor of laminated structure and preparation method of micro-gas sensor |
01/01/2014 | CN102259828B Isolation cavity body manufacturing method compatible with semiconductor process, and isolation cavity body |
01/01/2014 | CN102241389B Method for packing alkali metal simple substance |
12/31/2013 | US8617406 Device for the actively-controlled and localized deposition of at least one biological solution |
12/31/2013 | US8617362 Electrode and method of forming the master electrode |
12/27/2013 | WO2013188958A1 Superoleophobic surfaces and methods of making same |
12/27/2013 | CA2877244A1 Superoleophobic surfaces and methods of making same |
12/26/2013 | US20130341773 Encapsulation of an mems component and a method for producing said component |
12/26/2013 | US20130341742 Wafer level mems force dies |
12/26/2013 | US20130341741 Ruggedized mems force die |
12/26/2013 | US20130341738 Method for manufacturing a component having an electrical through-connection |
12/26/2013 | US20130341737 Packaging to reduce stress on microelectromechanical systems |
12/26/2013 | US20130341736 Packaging Compatible Wafer Level Capping of MEMS Devices |
12/26/2013 | US20130341299 Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing |
12/26/2013 | US20130340526 Mems inertial sensor and forming method therefor |
12/25/2013 | EP2676923A1 Method for producing conductive lines in close proximity in the fabrication of micro-electromechanical systems |
12/25/2013 | EP2675749A1 Compensation of stress effects on pressure sensor components |
12/25/2013 | EP2326450B1 Machine and method for machining a part by micro-electrical discharge machining |