Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
01/2014
01/22/2014EP2686268A2 Controlled fabrication of nanopores in nanometric solid state materials
01/22/2014CN103534647A Photosensitive resin composition for forming biochip, and biochip
01/22/2014CN103534196A Method for achieving smooth side walls after bosch etch process
01/22/2014CN103534195A Method of forming membranes with modified stress characteristics
01/22/2014CN103531909A Terahertz frequency-scanning H-plane sectoral horn antenna and preparation method thereof under bulk silicon MEMS (micro-electromechanical system) process
01/22/2014CN103528576A Hemispherical resonance micro mechanical gyroscope and processing technology thereof
01/22/2014CN103523745A Si conductive post based wafer-level packaging method and monolithic integrated MEMS (Micro Electro Mechanical System) chip for same
01/22/2014CN103523744A Two-stage grating positioning method of high-speed precise motion platform
01/22/2014CN103523743A Miniature friction energy harvester and method for manufacturing same
01/22/2014CN103523742A Radiation dosage detector of MOS structure and preparation method thereof
01/22/2014CN103523741A Hybrid integrated component and method for the manufacture thereof
01/22/2014CN103523740A Micromechanical assembly, method for manufacturing the micromechanical assembly and method for operating the micromechanical assembly
01/22/2014CN103523739A Packaging structure of three-dimensional flexible substrate of environment MEMS sensor and manufacturing method
01/22/2014CN103523738A Micro electro mechanical system sheet and manufacturing method thereof
01/22/2014CN103523737A MEMS-based interdigital gap beam structure energy collector and manufacturing method thereof
01/22/2014CN103523736A Hierarchical structure and preparing method thereof
01/21/2014US8632714 Mold structures, and method of transfer of fine structures
01/16/2014WO2014008819A1 Micro-electro-mechanical systems structure and sacrificial layer wet etching method thereof
01/16/2014WO2013138706A3 Systems and methods for containing biological samples
01/16/2014WO2013132065A3 Micromechanical measuring element, and method for producing a micromechanical measuring element
01/16/2014WO2012150278A9 Hierarchical carbon nano and micro structures
01/16/2014US20140017844 Integrated circuit switches, design structure and methods of fabricating the same
01/16/2014US20140017843 Semiconductor package and manufacturing method thereof
01/16/2014US20140017842 Methods for forming a sealed liquid metal drop
01/16/2014US20140016798 Mems device
01/16/2014US20140015071 Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
01/16/2014DE102008060796B4 Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur A method of forming a micro-surface structure as well as for manufacturing a microelectromechanical device, micro-structure and surface micro-electromechanical device having such a structure
01/15/2014EP2684837A2 Wafer level sensor package and method of forming same
01/15/2014CN103518138A Method of fabricating an inertial sensor
01/15/2014CN103510088A Solid-state hole array and manufacturing method thereof
01/15/2014CN103508413A Method for manufacturing a component having an electrical through-connection
01/15/2014CN103508412A Encapsulating method of pressure sensor chip and pressure sensor
01/15/2014CN103508411A Preparation method of microfluidic monolithic column chip and application of chip in raman detection
01/15/2014CN103508410A Method for manufacturing a component having an electrical through-connection
01/15/2014CN103508409A Control method of silicon membrane corrosion thickness
01/15/2014CN103508408A Hybrid integrated component and method for manufacturing the same
01/15/2014CN103508407A Package structure having micro-electro-mechanical element and method of fabricating the same
01/15/2014CN103508406A AZO thin film, preparing method and MEMS device comprising AZO thin film
01/15/2014CN102520376B Cross current type three-axis vector magnetic sensor
01/15/2014CN102496470B Asymmetric miniature ultracapacitor based on MEMS technology and manufacturing method thereof
01/15/2014CN102216015B Machine and method for machining a part by micro-electrical discharge machining
01/15/2014CN102110585B Method for manufacturing metal layer
01/14/2014CA2462098C Method and electrode for defining and replicating structures in conducting materials
01/09/2014WO2014008110A1 Compliant bipolar micro device transfer head with silicon electrodes
01/09/2014WO2014005496A1 Mems chip and manufacturing method therefor
01/09/2014WO2013035247A3 High aspect ratio structure and method for manufacturing the same
01/09/2014US20140011313 Leadframe-based premolded package having air channel for microelectromechanical system (mems) device
01/09/2014US20140010960 Method of producing microstructured gel
01/09/2014US20140008740 Mems microphone and method for packaging the same
01/09/2014US20140008738 Mems die and methods with multiple-pressure sealing
01/09/2014US20140007705 Microelectromechanical load sensor and methods of manufacturing the same
01/08/2014EP2682363A1 Method for producing a mems device including a vapour release step
01/08/2014EP2681568A1 Method of fabricating an inertial sensor
01/08/2014CN103502139A Implantation of gaseous chemicals into cavities formed in intermediate dielectric layers for subsequent thermal diffusion release
01/08/2014CN103502138A Method for the wafer-level integration of shape memory alloy wires
01/08/2014CN103501852A Method for manufacturing microstructure body
01/08/2014CN103499534A High-sensitivity terahertz microfluidic channel sensor and preparation method thereof
01/08/2014CN103496665A Pressure, flow and temperature integrated chip and method for manufacturing same
01/08/2014CN103496664A Method for manufacturing self-support polymer structure with large depth-width ratio
01/07/2014US8623458 Methods of directed self-assembly, and layered structures formed therefrom
01/03/2014WO2014000708A1 Aluminum-doped zinc oxide thin film, preparation method thereof, and micro electro mechanical system device comprising same
01/03/2014WO2014000332A1 Solid-state aperture array and fabrication method thereof
01/02/2014US20140004374 Multi-Layer Encapsulated Structures
01/02/2014US20140003746 Nano/micro roller bearing having tolerance compensation function and method of manufacturing the same
01/02/2014US20140001584 Mems pressure sensor and manufacturing method therefor
01/02/2014US20140001581 Mems microphone and forming method therefor
01/02/2014US20140001580 Transducer with Enlarged Back Volume
01/02/2014US20140001579 Mems pressure sensor and manufacturing method therefor
01/02/2014DE112005002435B4 Salzschmelzebad, Abscheidung erhalten unter Verwendung des Salzschmelzebades, Herstellungsverfahren für ein Metallprodukt und Metallprodukt Molten salt bath, deposition obtained using the molten salt bath, manufacturing method of a metal product, and the metal product
01/01/2014EP2680298A1 Method and device for detecting termination of etching
01/01/2014EP2679537A1 Method for producing metal lines on top of a non-flat mems topography
01/01/2014EP2678672A1 Biosensor and method of manufacturing such a biosensor
01/01/2014CN203377207U Vacuum-packaged CMOS and MEMS chip
01/01/2014CN203373144U Packaging structure for micro electro mechanical system chip
01/01/2014CN103489751A Method and electrode structure for improving microelectrode array electrode density based on electrochemical bipolar behavior
01/01/2014CN103488051A Preparation method of composite structure of photoresist film and substrate for LIGA (Lithographie, Galvanoformung and Abformung) technology
01/01/2014CN103487474A MEMS (micro-electromechanical systems) capacitive humidity sensor with high sensitivity and fast response
01/01/2014CN103487467A Manufacturing process of minitype gas-sensitive sensor of integrated heating element
01/01/2014CN103482566A Deep groove manufacturing method used in MEMS process
01/01/2014CN103482565A Method for preparing porous array polyethylene template
01/01/2014CN103482564A Graphical hydrophilic/hydrophobic composite surface preparation process based on nano particle mask etching
01/01/2014CN103482563A MEMS microstructure preparation method
01/01/2014CN103482562A Tiny gas sensor of laminated structure and preparation method of micro-gas sensor
01/01/2014CN102259828B Isolation cavity body manufacturing method compatible with semiconductor process, and isolation cavity body
01/01/2014CN102241389B Method for packing alkali metal simple substance
12/2013
12/31/2013US8617406 Device for the actively-controlled and localized deposition of at least one biological solution
12/31/2013US8617362 Electrode and method of forming the master electrode
12/27/2013WO2013188958A1 Superoleophobic surfaces and methods of making same
12/27/2013CA2877244A1 Superoleophobic surfaces and methods of making same
12/26/2013US20130341773 Encapsulation of an mems component and a method for producing said component
12/26/2013US20130341742 Wafer level mems force dies
12/26/2013US20130341741 Ruggedized mems force die
12/26/2013US20130341738 Method for manufacturing a component having an electrical through-connection
12/26/2013US20130341737 Packaging to reduce stress on microelectromechanical systems
12/26/2013US20130341736 Packaging Compatible Wafer Level Capping of MEMS Devices
12/26/2013US20130341299 Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing
12/26/2013US20130340526 Mems inertial sensor and forming method therefor
12/25/2013EP2676923A1 Method for producing conductive lines in close proximity in the fabrication of micro-electromechanical systems
12/25/2013EP2675749A1 Compensation of stress effects on pressure sensor components
12/25/2013EP2326450B1 Machine and method for machining a part by micro-electrical discharge machining
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