Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 1 - Manufacture or treatment of devices or systems in or on a substrate
Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
06/2014
06/04/2014CN102353609B MEMS fluid density sensor chip with dual Wheatstone full bridges structure and its preparation method
06/04/2014CN102190285B Manufacturing method of MEMS device, and substrate used therefor
06/04/2014CN101633490B Component and component module provided with micro-cap, and wafer-level packaging methods thereof
06/03/2014US8742872 MEMS element, and manufacturing method of MEMS element
06/03/2014US8741380 Fine metal structure, process for producing the same, fine metal mold and device
06/03/2014CA2504080C A manufacturing method of a microchemical chip made of a resin and a microchemical chip made of a resin by the method
05/2014
05/30/2014WO2014080935A1 Etching method, mask, functional component, and method for manufacturing functional component
05/30/2014WO2014079315A1 Substrate etching method
05/29/2014US20140147955 Method of encapsulating a micro-electromechanical (mems) device
05/29/2014US20140147473 Functional Nanostructured "Jelly Rolls" with Nanosheet Components
05/29/2014US20140145551 Vibrator, manufacturing method of vibrator, electronic apparatus, and moving object
05/29/2014US20140145276 Mems microphone and method for manufacture
05/29/2014US20140145275 Ultrasonic transducer and method of manufacturing the same
05/28/2014EP2734454A1 Food packing material having hydrophobicity, manufacturing method and mold thereof
05/28/2014DE112007000263B4 Differentialmikrofon, hergestellt in Mikrofertigung Differential microphone made in micro-manufacturing
05/28/2014DE10322523B4 Halbleiterdrucksensor mit einer Membran A semiconductor pressure sensor comprising a diaphragm
05/28/2014DE102012221509A1 Integrated device of microphone device, has function layer which is patterned from micro-mechanical functional element, so that function elements are arranged one above other and spaced from each other
05/28/2014DE102007051823B4 Sensor für eine physikalische Grösse und Verfahren zur Fertigung des Sensors A physical quantity sensor and method for manufacturing the sensor
05/28/2014DE102005009422B4 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
05/28/2014CN203616041U 高过载背压式绝压传感器模块 Backpressure high overload absolute pressure sensor module
05/28/2014CN203612945U 一种晶片承载器 A wafer carrier
05/28/2014CN103827019A 高区域堆叠层金属结构及相关方法 High area stacked layers of metal structures and related methods
05/28/2014CN103825494A 物联网射频收发组件中固支梁振动电磁自供电微传感器 Things RF transceiver module solid-supported beam of electromagnetic self-powered micro-vibration sensor
05/28/2014CN103824813A 一种单片集成的微荧光分析系统及其制作方法 A monolithic integrated micro-fluorescence analysis system and its production methods
05/28/2014CN103822961A 电化学微流芯片及其制备方法 Electrochemical microfluidic chip and its preparation method
05/28/2014CN103818875A 一种微纳功能材料生长方法及其量子点电池应用 A micro-nano functional material growth method and quantum dot cell applications
05/28/2014CN103818874A Mems结构与处理电路集成系统的新型封装方法 The new packaging method Mems structure and processing circuitry integrated system
05/28/2014CN103818873A 一种大厚度、高深宽比的全金属沟道型微结构的加工方法 A large thickness, the processing method of micro-channel all-metal structure of high aspect ratio
05/28/2014CN103818872A Mems器件和制造mems器件的方法 Mems mems device and a method of manufacturing the device
05/28/2014CN103818868A 双压力mems芯片圆片级封装方法及其双压力mems芯片 Dual pressure mems chip wafer level packaging method and dual-pressure mems chip
05/28/2014CN102336394B 柔性mems减阻蒙皮的制造方法 Mems drag reduction method for manufacturing flexible skinning
05/28/2014CN102336389B 微机电元件与电路芯片的整合装置及其制造方法 MEMS device integrated circuit chip device and a method of manufacturing
05/28/2014CN102320554B 一种纳米缝的模板对准压印制备工艺 A nano-seam preparation imprint template alignment
05/28/2014CN102320549B 一种提高薄膜应变线性度的方法 Method for improving the linearity of the method of thin-film strain
05/27/2014US8734904 Methods of forming topographical features using segregating polymer mixtures
05/27/2014US8733343 Device and method for creating aerosols for drug delivery
05/22/2014WO2014075761A1 Method for producing a shaped body having a superhydrophobic surface and shaped body which can be obtained by said method and use thereof
05/22/2014WO2014075373A1 Silicon nanowire chip for simultaneously detecting mirnas and protein markers, detecting method and application thereof
05/22/2014US20140141184 Bowl-shaped structure, method for manufacturing same, and bowl array
05/22/2014US20140139937 Micro-electro-mechanical system based focusing device and manufacturing method thereof
05/22/2014US20140138351 Method For Making A Silicon Separation Microcolumn For Chromatography Or Gas Chromatography
05/22/2014DE102012201714B4 Verfahren zur herstellung von mikrofluidsystemen Process for the preparation of micro-fluid systems
05/21/2014EP2733114A1 Thin film device and manufacturing method thereof
05/21/2014EP2731908A2 Miniaturised sensor comprising a heating element, and associated production method
05/21/2014CN103813975A 具有凹部及电子组件的背板 A concave portion having a backplate, and electronic components
05/21/2014CN103809285A 自对准垂直式梳状传感器及其制作方法 Self-aligned vertical comb sensor and manufacturing method thereof
05/21/2014CN103805920A 用于塑性变形加工的金属玻璃薄膜及其微器件的制备方法 Preparation of metallic glass film for plastic deformation and micro devices
05/21/2014CN103803487A 半导体结构的形成方法 The method for forming a semiconductor structure
05/21/2014CN103803486A 一种超细硅纳米线阵列的制备方法 Method for preparing ultrafine silicon nanowire arrays
05/21/2014CN103803485A 激光直写玻璃表面制备光学微结构的方法 Laser direct writing method for preparing the glass surface of optical microstructures
05/21/2014CN103803484A 基于摩擦诱导选择性刻蚀的氮化硅膜/硅微纳米加工方法 Based on the silicon nitride film friction-induced selective etching / silicon micro-nanofabrication methods
05/21/2014CN103803483A 形成焊垫的方法 The method of forming the pad
05/21/2014CN103803482A Soi衬底上制作半导体微纳结构器件的方法 The method of fabricating a semiconductor device on micro and nano structures Soi substrate
05/21/2014CN103803480A 电子设备封装的盖件和用于制造其的方法 The cover member and the electronic device package manufacturing method thereof for
05/21/2014CN103803479A 集成电微流控探针卡、系统及其使用方法 Integrated circuits microfluidic probe card, the system and method of use
05/21/2014CN103803478A 金属弹性构件、微机械装置、微机械装置的制造方法、摆动控制装置以及摆动控制方法 A metal elastic member, the micro-mechanical device, a method of manufacturing a micromechanical device, the swing control device and a control method swing
05/21/2014CN102692276B 一种非制冷红外探测器 A non-cooled infrared detectors
05/21/2014CN102530831B Mems器件的制作方法 Mems device manufacturing method
05/21/2014CN102431958B 一种针对玻璃-硅-玻璃三明治结构防水圆片级封装方法 One for glass - silicon - glass sandwich structure waterproof wafer level packaging method
05/21/2014CN102424356B 一种金属纳米颗粒微阵列芯片的制备装置及方法 An apparatus and method for preparing metal nano-particles in the micro-array chips
05/21/2014CN102360121B 数字微镜器件及其形成方法 Digital micromirror device and method of forming
05/21/2014CN102259823B Mems压敏传感器件的制作方法 The method of making the pressure-sensitive sensor element Mems
05/21/2014CN101445215B 红外探测器及其制造方法 Infrared detector and method of manufacturing
05/15/2014WO2014072114A1 Semiconductor sensor device and method of producing a semiconductor sensor device
05/15/2014US20140131911 Cartridge Reactor for Production of Materials via the Chemical Vapor Deposition Process
05/15/2014US20140131821 Pressure sensing device having contacts opposite a membrane
05/15/2014US20140131820 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
05/15/2014US20140131819 Process for manufacturing a lid for an electronic device package, and lid for an electronic device package
05/15/2014DE102013112137A1 Verfahren zum Verarbeiten eines Dies This method of processing a
05/15/2014DE102012110048B3 Producing molding comprises providing composite of substrate and workpiece, coating with metallic conductive layer, embossing other structures in existing structures of workpiece by metallic conductive mold insert and cooling mold insert
05/15/2014DE102009042319B9 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
05/15/2014DE102006054695B4 Verfahren zur Regelung nanoskaliger elektronenstrahlinduzierter Abscheidungen Method for controlling nanoscale electron-beam-induced deposition
05/15/2014DE102004024285B4 Verfahren zur Herstellung eines mikrostrukturierten Bauelements A process for producing a microstructured component
05/14/2014EP2731129A1 Molded semiconductor sensor device and method of producing the same at a wafer-level
05/14/2014EP2730540A1 Metal elastic member, miniature machine, method of manufacturing miniature machine, swing control device and swing control method
05/14/2014CN203596358U 连续式纳米图案装置及利用其制造的防反射基板 Continuous nano-patterning means and the substrate using antireflection its manufacture
05/14/2014CN103796148A 微机电装置与制作方法 MEMS device and manufacturing method
05/14/2014CN103795291A 微型植入式超声共振无线能量传送接收器及其制备方法 Implantable miniature ultrasonic resonance energy transfer wireless receiver and its preparation method
05/14/2014CN103794553A 用于在衬底中制造电覆镀通孔的方法以及具有电覆镀通孔的衬底 The method of manufacturing an electrical substrate in the substrate for plating through holes, and having an electric plating through hole
05/14/2014CN103792036A 气压与加速度传感器相集成的mems芯片及其制作方法 Mems pressure and acceleration sensor chip integrates its production methods
05/14/2014CN103789771A 等离子体处理方法 The plasma processing method
05/14/2014CN103787268A 一种高速宽带硅光转接板的制造方法及硅基光互连器件 A method for manufacturing high-speed broadband silicon and silicon-based optical adapter plate optical interconnection devices
05/14/2014CN103787267A 具有表面微结构的平板工件的制作方法 Production methods have flat workpiece surface microstructures
05/14/2014CN103787264A 一种应用于高速宽带光互连的硅通孔器件的制造方法及其器件 Applied to high-speed broadband optical interconnect silicon vias device manufacturing method and device
05/14/2014CN103787262A Tsv-mems组合 Tsv-mems portfolio
05/14/2014CN103787260A 微机械构件 Micro-mechanical components
05/14/2014CN103787259A 基于石墨烯用于获取微弱能量的柔性微结构及其制造方法 Based on flexible micro-structure and manufacturing method for obtaining graphene weak energy
05/14/2014CN103787258A 具有键合连接的微机械器件 A micro-mechanical devices connected to the bonding
05/14/2014CN102955046B 一种单片集成cmos mems多层金属三轴电容式加速度传感器及制备方法 A monolithic integrated cmos mems multilayer metal triaxial capacitive accelerometer and preparation methods
05/14/2014CN102442635B 一种手性选择性磁性功能化石墨烯修饰微流控芯片的方法 One chiral selective functionalization of graphene modified magnetic microfluidic chip method
05/08/2014WO2014067185A1 Structure for silicon nanowire chip for biological detection and manufacturing method therefor
05/08/2014US20140127456 Methods of improving long range order in self-assembly of block copolymer films with ionic liquids and materials produced therefrom
05/08/2014US20140126031 Method for Fabricating a Self-Aligned Vertical Comb Drive Structure
05/08/2014US20140124879 Component and method for producing same
05/08/2014DE10345962B4 Substrat und Verfahren zum Bilden eines Substrats für eine Fluidausstoßvorrichtung Substrate and method for forming a substrate for a fluid ejection device
05/08/2014DE102013206531A1 Device for displacing micromirror in optical module of illumination system, has compensating unit compensating linear displacement of micromirror or predetermined pivot axis during pivoting of micromirror
05/08/2014DE102012220323A1 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
05/07/2014EP2727880A1 Three-dimensional, micromechanical component having chamfer and method for its production
05/07/2014EP2727146A1 A method of making a system-in-package device, and a system-in-package device
05/07/2014EP2726401A1 Out-of-plane travel restriction structures
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