| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
|---|
| 12/25/2013 | EP2274108B1 Methods of manufacturing a capacitive electromechanical transducer |
| 12/25/2013 | CN203365711U Micro lens and micro lens array structure |
| 12/25/2013 | CN103477421A Method and device for detecting termination of etching |
| 12/25/2013 | CN103477405A Electronic device and method for manufacturing same |
| 12/25/2013 | CN103476702A Process for manufacturing electro-mechanical systems |
| 12/25/2013 | CN103474739A Micro-machine manufacturing method for rectangular waveguide transmission device |
| 12/25/2013 | CN103472579A Manufacturing method for self-inclining micromirror of micro electro mechanical system |
| 12/25/2013 | CN103472260A MEMS cross beam capacitor accelerometer and manufacture method thereof |
| 12/25/2013 | CN103471760A Force sensing resonant element and manufacturing method thereof |
| 12/25/2013 | CN103466541A 晶圆级封装方法以及晶圆 Wafer-level packaging method and wafer |
| 12/25/2013 | CN103466540A Method used for preparing wrinkles of multilayer composite silver film on PDMS elastomer substrate |
| 12/25/2013 | CN103466539A Super-lyophobic surface and preparation method thereof |
| 12/25/2013 | CN102569563B Wafer level packaging method of light emitting diode with adjustable lens focus |
| 12/25/2013 | CN102001614B MEMS devices and method for manufacturing same |
| 12/25/2013 | CN101903286B Method for producing capping wafer for sensor |
| 12/24/2013 | DE102013210303A1 PT-Nanoröhren PT nanotubes |
| 12/24/2013 | DE102012224359A1 Verfahren zur Herstellung von Stempeln für Vorrichtungen für die plasmonische Nanolithographie und Vorrichtung für die plasmonische Nanolithographie A process for the production of stamps for devices for the plasmonic nanolithography and apparatus for the plasmonic nanolithography |
| 12/24/2013 | DE102012210480A1 Verfahren zum Herstellen eines Bauelements mit einer elektrischen Durchkontaktierung A method of manufacturing a device having an electrical plated-through hole |
| 12/24/2013 | DE102012210472A1 Verfahren zum Herstellen eines Bauelements mit einer elektrischen Durchkontaktierung A method of manufacturing a device having an electrical plated-through hole |
| 12/19/2013 | WO2013188884A1 Microstructure-based wound closure devices |
| 12/19/2013 | WO2013188662A1 Teeter-totter type mems accelerometer with electrodes on circuit wafer |
| 12/19/2013 | WO2013187843A1 Embossing method and embossing arrangement |
| 12/19/2013 | WO2013187267A1 Microstructure and method of manufacturing the same |
| 12/19/2013 | WO2013186408A1 Cell culture device and method associated with said |
| 12/19/2013 | US20130335122 Electronic device, method of manufacturing the electronic device, and method of driving the electronic device |
| 12/19/2013 | US20130334713 Electrostatic discharge compliant patterned adhesive tape |
| 12/19/2013 | US20130334628 Process for manufacturing electro-mechanical systems |
| 12/19/2013 | US20130334627 Semiconductor integrated device assembly and related manufacturing process |
| 12/19/2013 | US20130334626 Hybrid integrated component and method for the manufacture thereof |
| 12/19/2013 | US20130334622 Micromechanical device and method for manufacturing a micromechanical device |
| 12/19/2013 | US20130334621 Hybrid integrated component and method for the manufacture thereof |
| 12/19/2013 | DE112011103124T5 Biegelager zum Verringern von Quadratur für mitschwingende mikromechanische Vorrichtungen Flexure pivots for reducing quadrature for resonant micromechanical devices |
| 12/19/2013 | DE102013002977B3 Three-dimensional structuring component surfaces involves directing laser beam on component surface, wetting surface using liquid or immersing, and coupling microwaves from microwave source in liquid in which irradiation is carried out |
| 12/19/2013 | DE102012210052A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production |
| 12/19/2013 | DE102012210049A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production |
| 12/19/2013 | DE102012209973A1 Mikromechanische Vorrichtung und Verfahren zur Herstellung einer mikromechanischen Vorrichtung Micromechanical device and method of manufacturing a micromechanical device |
| 12/19/2013 | DE102012105218A1 Holding device for holding wafer for manufacturing MEMS microphones, has support device including upper side for supporting wafer, and liquid column changing curvature of upper side and exerting force on support device |
| 12/19/2013 | CA2875227A1 Microstructure-based wound closure devices |
| 12/18/2013 | EP2674392A1 Integrated circuit with pressure sensor and manufacturing method |
| 12/18/2013 | EP2014612B1 Method of manufacturing micro electro mechanical systems device avoiding a sacrificial layer |
| 12/18/2013 | EP1552721B1 Micromachined ultrasonic transducers and method of fabrication |
| 12/18/2013 | CN203346068U MEMS (Micro-electro-mechanic System) device clamp |
| 12/18/2013 | CN103459304A Strengthened micro-electromechanical system devices and methods of making thereof |
| 12/18/2013 | CN103449358A Manufacturing method of closed cavity of micro-electromechanical system (MEMS) |
| 12/18/2013 | CN103449357A Hybridly integrated component and method for the production thereof |
| 12/18/2013 | CN103449356A Stress coupling method for bi-material cantilever beam |
| 12/18/2013 | CN103449355A Manufacturing method of nano-pore array |
| 12/18/2013 | CN103449354A MEMS sensor and producing method thereof |
| 12/18/2013 | CN103449352A Electronic device, electronic apparatus, and method of manufacturing electronic device |
| 12/18/2013 | CN103449351A Hybrid integrated component and method for the manufacture thereof |
| 12/18/2013 | CN103447523A Gold nanoparticle-silver nano-semisphere array as well as preparation method and application thereof |
| 12/18/2013 | CN102259820B Cavity structure, manufacturing method of cavity structure and manufacturing method of pressure-sensitive sensor |
| 12/12/2013 | WO2013184559A1 Superhydrophobic surfaces |
| 12/12/2013 | US20130330870 Micro-Electromechanical System Devices |
| 12/12/2013 | US20130330501 Hierarchical structured surfaces to control wetting characteristics |
| 12/12/2013 | US20130328143 Semiconductor Manufacturing and Semiconductor Device with semiconductor structure |
| 12/12/2013 | US20130328141 Hermetic plastic molded mems device package and method of fabrication |
| 12/12/2013 | DE102013009419A1 Laserausheil- bzw. -annealingsysteme und Verfahren mit ultrakurzen Verweil- bzw. Haltezeiten Laserausheil- or -annealingsysteme and procedures with ultra-short holding and holding times |
| 12/12/2013 | DE102012209676A1 Method for manufacturing micro-fluidic device for use in lab-on-a-chip (LOC) system, involves melting and welding the materials of lower and upper layers with each other, after cooling below certain temperature |
| 12/11/2013 | CN103443660A Superhydrophobic substrate and method for manufacturing same |
| 12/11/2013 | CN103443021A Wafer-level package and method for production thereof |
| 12/11/2013 | CN103443020A Method for increasing a sacrificial layer etching rate and device formed thereof |
| 12/11/2013 | CN103442324A Backboard and manufacturing method thereof |
| 12/11/2013 | CN103441063A Method for preparing silicon carbide micro-structures |
| 12/11/2013 | CN103440985A Multi-electrode MEMS capacitor achieving linear adjustment |
| 12/11/2013 | CN103439527A Capacitance type minitype machine wind speed wind direction sensor |
| 12/11/2013 | CN103435003A Method for etching contact hole for MEMS (Micro Electro Mechanical Systems) AMR (Adaptive Multiple Rate) and method for manufacturing contact hole for MEMS AMR |
| 12/11/2013 | CN103435002A MEMS sacrificial layer etching method |
| 12/11/2013 | CN103435001A Hybrid integrated circuit device and packaging method |
| 12/11/2013 | CN103435000A Wafer-level packaging structure and packaging method of sensor of integrated MEMS (micro-electromechanical system) device |
| 12/11/2013 | CN103434998A Test structure and test method of wafer level airtightness |
| 12/11/2013 | CN102519657B Two-dimensional vector flexible thermo-sensitive micro-shearing stress sensor, and array and preparation method thereof |
| 12/11/2013 | CN102435837B Micro electro mechanical system (MEMS) coupling degree-reconfigurable online detector for microwave power and preparation method thereof |
| 12/11/2013 | CN102103106B Manufacturing method of three-leg catalytic micro gas sensor with temperature modulation |
| 12/11/2013 | CN102009941B Micro-nano fluid system and preparation method thereof |
| 12/11/2013 | CN101726526B Solid electrolyte SO2 gas sensor and manufacturing method thereof |
| 12/10/2013 | US8603316 Method for electrochemical fabrication |
| 12/05/2013 | WO2013178057A1 Metal composite and method of preparing the same, metal-resin composite and method of preparing the same |
| 12/05/2013 | US20130323840 Cylinder channel having a sawtooth-shaped cross section, coaxial channel including same and method for manufacturing same |
| 12/05/2013 | US20130320503 Methods and devices for fabricating and assembling printable semiconductor elements |
| 12/05/2013 | US20130320467 Method for assembling conductive particles into conductive pathways and sensors thus formed |
| 12/05/2013 | US20130319138 Microelectromechanical sensor for measuring a force, and corresponding method |
| 12/05/2013 | DE102012209238A1 Ultraschallsensor sowie Vorrichtung und Verfahren zur Messung eines Abstands zwischen einem Fahrzeug und einem Hindernis Ultrasonic sensor, as well as apparatus and method for measuring a distance between a vehicle and an obstacle |
| 12/05/2013 | DE102012010549A1 Verfahren zur Fixierung einer beweglichen Komponente eines mikromechanischenBauelementes Method for fixing a movable component of a micromechanical component |
| 12/05/2013 | CA2875146A1 Bioactive agent delivery devices and methods of making and using the same |
| 12/04/2013 | EP2668312A1 Vapour etch of silicon dioxide with improved selectivity |
| 12/04/2013 | EP2668132A1 Method for obtaining hollow nano-structures |
| 12/04/2013 | CN103430260A Electronic apparatus comprising variable capacitance element and method of manufacturing same |
| 12/04/2013 | CN103429525A Detachable micro- and nano-components for a space-saving use |
| 12/04/2013 | CN103424998A Photoresist removing method after polyimides are photoetched in micro-electromechanical system manufacturing process |
| 12/04/2013 | CN103424441A Palladium-based hydrogen sensor with adjustable connectivity prepared on substrate with controllable flexibility and production method |
| 12/04/2013 | CN103424107A Micromechanical inertial sensor and method for manufacturing same |
| 12/04/2013 | CN103420330A Manufacturing method applied to micro device wafer level encapsulating through hole metal interconnection |
| 12/04/2013 | CN103420329A TaN etching polymer residue removing method used for MEMS technology |
| 12/04/2013 | CN103420328A AMR (Anisotropic Magneto-resistance) MEMS manufacturing method |
| 12/04/2013 | CN103420327A Interface protecting method applied to graphical SOI (silicon on insulator) material etching process |
| 12/04/2013 | CN103420326A MEMS (micro-electromechanical systems) piezoelectric energy collecting device and method for manufacturing same |
| 12/04/2013 | CN103420325A Method for manufacturing a hybrid integrated component |
| 12/04/2013 | CN103420323A Micromechanical component and method for manufacturing a micromechanical component |
| 12/04/2013 | CN103420322A Chip package and method for forming the same |