Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
06/2014
06/26/2014WO2014098985A1 Inductive inertial sensor architecture & fabrication in packaging build-up layers
06/26/2014WO2014095940A1 Thin metal membrane with support
06/26/2014WO2014070091A3 Through substrate vias and device
06/26/2014WO2014062273A3 Substrate with multiple encapsulated devices
06/26/2014US20140180201 Microarray for delivery of therapeutic agent and methods of use
06/26/2014US20140175572 Mems device with multiple electrodes and fabricating method thereof
06/26/2014US20140175571 Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region
06/26/2014US20140175525 CMOS Integrated Moving-Gate Transducer with Silicon as a Functional Layer
06/26/2014DE102012222426A1 Herstellungsverfahren für ein mikromechanisches Bauelement und entsprechendes mikromechanisches Bauelement Manufacturing method for a micromechanical component and corresponding micromechanical component
06/26/2014DE102012112836A1 Method for simulating recycle of semiconductor structures, involves determining output geometry of semiconductor structures as function of cross-sectional areas of microstructures of semiconductor substrate
06/25/2014EP2746217A1 Reducing MEMS stiction by introduction of a carbon barrier
06/25/2014EP2744744A2 Ultra-light micro-lattices and a method for forming the same
06/25/2014CN203667995U 一种大面积单层胶体球阵列制备仪 One kind of large-scale preparation of single colloidal sphere array instrument
06/25/2014CN103890699A 触敏膜、触摸感测装置以及电子装置 The touch-sensitive film, a touch sensing device and an electronic device
06/25/2014CN103889888A 提供用于可自组装聚合物的图案化取向模板的方法 Provides a method for patterning self-assembled polymer orientation template
06/25/2014CN103889887A Mems装置锚固 Mems device anchoring
06/25/2014CN103885300A 一种疏水表面光刻工艺 A hydrophobic surface of the photolithography process
06/25/2014CN103885122A Mems阵列电可调谐光衰减器及其制备方法 Mems array of electrically tunable optical attenuator and its preparation method
06/25/2014CN103879953A 一种基于蜡的刮涂图案化方法 A doctor blade method of patterning a wax-based
06/25/2014CN103879952A Mems器件真空封装结构的制作方法 The method of making a vacuum package device structure Mems
06/25/2014CN103879951A 硅通孔的制作方法 TSV production methods
06/25/2014CN103879950A Mems器件真空封装结构 Mems device vacuum package
06/25/2014CN103879949A 具多重电极的微机电装置及其制作方法 MEMS device and method of making a multi-electrode
06/25/2014CN102556957B 一种mems空气放大器离子聚集装置的制作方法 One kind of ion aggregation mems air amplifier device manufacturing method
06/25/2014CN102556956B Mems器件的真空封装结构及其制作方法 Vacuum packaging structure and method of making Mems devices
06/25/2014CN102259827B Mems高量程加速度传感器的封装方法 Encapsulation method Mems high range acceleration sensor
06/19/2014WO2014092541A1 A method for releasing mems device
06/19/2014US20140170811 Method of fabricating a 3d integrated electronic device structure including increased thermal dissipation capabilities
06/19/2014US20140167295 Coatings for relatively movable surfaces
06/19/2014US20140167189 Reducing mems stiction by deposition of nanoclusters
06/19/2014US20140167188 Reducing mems stiction by introduction of a carbon barrier
06/19/2014US20140166618 Ultra-high speed anisotropic reactive ion etching
06/19/2014US20140166612 Analyte sensor and fabrication methods
06/18/2014CN103871804A Indoor-temperature Pd thin film large-area nanometer seam array parallel manufacturing method
06/18/2014CN103869611A Method for manufacturing three-layer composite structured transparent soft mold for full-chip nano-imprint lithography in situ
06/18/2014CN103864009A Method for realizing metal film figure with slope-shaped edge by utilizing dielectric film mask plate
06/18/2014CN103864008A Technological method for controlling deposition morphology of thin film by silicon chip serving as mask
06/18/2014CN103864007A High-purity alkali metal filling method for realizing on-chip atomic clock bubble absorption
06/18/2014CN103864006A Reducing MEMS stiction by introduction of a carbon barrier
06/18/2014CN103864005A Reducing MEMS stiction by deposition of nanoclusters
06/18/2014CN103864004A Method for producing oscillator
06/18/2014CN103864003A Manufacturing method of micromotor structure
06/18/2014CN103863999A Method for preparing metal nano-structure
06/18/2014CN103861670A Ice printing-based method for preparing microfluidic apparatus
06/18/2014CN103091982B Microtube fabrication process
06/18/2014CN102530832B Inertia MEMS (micro-electro-mechanical system) sensor and making method thereof
06/18/2014CN102328902B Method for preparing surface microstructure of super-hydrophobic amorphous alloy
06/18/2014CN102320559B Preparation method of hollow-structured micro-array electrode
06/18/2014CN102076602B A method for packaging a display device and the device obtained thereof
06/18/2014CN102000912B Laser micro/nano processing system and method
06/12/2014WO2014088977A1 Sensor device comprising inertial sensor modules using moving-gate transducers and a μετηd of manufacturing such inertial sensor modules
06/12/2014WO2014088976A1 Structured gap for a mems pressure sensor
06/12/2014WO2014088878A1 Stiction reduction for mems devices
06/12/2014WO2014086903A1 Method for producing nanostructures
06/12/2014US20140162393 Multi-axis integrated mems devices with cmos circuits and method therefor
06/12/2014US20140162392 Production method for a suspended structure component and a transistor co-integrated on a same substrate
06/12/2014US20140162391 Method for producing oscillator
06/12/2014US20140161290 Mems device and process
06/12/2014DE10310339B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
06/12/2014DE102012222491A1 Elektronisches Bauteil mit einem gespritzten Bauteilgehäuse Electronic component with a molded component housing
06/12/2014DE102012112058A1 MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen MEMS device and method of encapsulating MEMS devices
06/12/2014DE102012112030A1 Verfahren zum Mikrokontaktprägen A method of microcontact printing
06/11/2014EP2741331A2 Method for producing a component with a suspended structure and a transistor integrated on a single substrate
06/11/2014EP2739562A2 Elimination of silicon residues from mems cavity floor
06/11/2014CN203643063U 一种soi压力应变计 One kind of strain gauge pressure soi
06/11/2014CN203643061U 电容式压力传感器和惯性传感器集成器件 Capacitive pressure sensors and inertial sensors integrated devices
06/11/2014CN103855251A Manufacturing method of monolithic integration type infrared micro lens line
06/11/2014CN103848394A Hydraulic focusing assembling method for various nano-wire arrays based on micro-fluid chip
06/11/2014CN103848393A Ultraprecise parallelism adjusting and detecting system for static induction technology
06/11/2014CN103848392A Method for manufacturing large-area black silicon with controllable microstructure period
06/11/2014CN103848391A Embedded chip package, chip package, and method for manufacturing the embedded chip package
06/11/2014CN103848390A MEMS structure with adaptable inter-substrate bond
06/11/2014CN103048487B Wind speed and wind direction sensor with high sensitivity
06/11/2014CN102119118B Method for producing a micromechanical component, and micromechanical component
06/05/2014US20140151869 Integrated heater on mems cap for wafer scale packaged mems sensors
06/05/2014US20140151822 Structured Gap for a MEMS Pressure Sensor
06/05/2014US20140150553 Packaging system and process for inertial sensor modules using moving-gate transducers
06/04/2014EP2736635A1 A substrate surface structured with thermally stable metal alloy nanoparticles, a method for preparing the same and uses thereof, in particular as a catalyst
06/04/2014CN103843370A Piezoelectric microphone fabricated on glass
06/04/2014CN103843368A Piezoelectric microphone fabricated on glass
06/04/2014CN103842885A Mechanical layer for interferometric modulators and methods of making the same
06/04/2014CN103840744A Light, heat, electromagnetism and vibration self-powered micro-nano sensor of Internet-of-things radio frequency transceiving assembly
06/04/2014CN103840709A Hole-formed mixed-beam vibration and electromagnetism self-powered micro-sensor of internet of things radio frequency receiving-transmitting assembly
06/04/2014CN103840708A Hole-formed cantilever beam vibration and electromagnetism self-powered micro-sensor of internet of things radio frequency receiving-transmitting assembly
06/04/2014CN103840707A Cantilever beam vibration and electromagnetism self-powered microsensor of Internet-of-things radio frequency transceiving assembly
06/04/2014CN103840706A Perforated cantilever beam vibration energy self-powered microsensor of Internet-of-things radio frequency transceiving assembly
06/04/2014CN103840075A Miniature piezoelectric vibration energy collector and manufacturing method thereof
06/04/2014CN103837980A Aperture adjusting device based on MEMS and preparation method thereof
06/04/2014CN103837979A Focal length setting device based on MEMS and preparation method thereof
06/04/2014CN103837517A Preparation method of metal film/zinc oxide (ZnO) nanorod array fluorescence enhancement material
06/04/2014CN103837289A Pressure sensor and manufacturing method thereof
06/04/2014CN103832968A Manufacturing method of MEMS (micro-electro-mechanical system) device
06/04/2014CN103832967A Method for processing micro-electromechanical systems (MEMS) sensor
06/04/2014CN103832966A Forming method and detection method of semiconductor device
06/04/2014CN103832965A Substrate etching method
06/04/2014CN103832964A Micro-electro-mechanical system device manufacturing method
06/04/2014CN103832963A Micro-bubble generator and manufacturing method thereof
06/04/2014CN102732885B Magnetic-field-assisted silicon micro-nano processing technology and equipment
06/04/2014CN102583226B Preparation method for multielement dissymmetrical microsphere and heterogeneous microsphere shell
06/04/2014CN102403561B Micro-electromechanical cantilever beam switch type microwave power coupler and method for preparing microwave power coupler
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