Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
10/2001
10/10/2001CN1317148A Mechanical patterning of device layer
10/09/2001US6300156 Process for fabricating micromechanical devices
10/09/2001US6299145 Device and method for fluid aeration via gas forced through a liquid within an orifice of a pressure chamber
10/04/2001WO2001072631A1 Fabrication and controlled release of structures using etch-stop trenches
10/04/2001WO2000041213A9 Methods utilizing scanning probe microscope tips and products therefor or produced thereby
10/04/2001US20010026997 Method and device for controlled cleaving process
10/02/2001US6297072 Method of fabrication of a microstructure having an internal cavity
10/02/2001US6297069 Method for supporting during fabrication mechanical members of semi-conductive dies, wafers, and devices and an associated intermediate device assembly
09/2001
09/27/2001WO2001036319A8 Method for reducing variations in arrays of micro-machined cantilever structures using ion implantation
09/27/2001US20010024711 Micromechanical component with sealed membrane openings and method of fabricating a micromechanical component
09/26/2001CN1314219A Method for forming a hollow cavity by using a thin substrate board
09/25/2001US6294814 Cleaved silicon thin film with rough surface
09/25/2001US6294020 Device for applying photoresist to a base body surface
09/20/2001WO2001069317A1 Device for transferring a pattern to an object
09/20/2001WO2001068512A1 Micro-actuator and method of manufacturing the actuator
09/20/2001US20010023010 Multilayer films on substrate
09/18/2001US6291345 Controlled-stress stable metallization for electronic and electromechanical devices
09/18/2001US6291317 Method for dicing of micro devices
09/18/2001US6290859 Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
09/18/2001US6290858 Manufacturing method for a micromechanical device
09/18/2001US6290804 Controlled cleavage process using patterning
09/13/2001WO2001066065A2 Systems and methods for fluid transport through dermal barriers
09/13/2001WO2000042231A8 Polycrystalline silicon germanium films for forming micro-electromechanical systems
09/13/2001US20010021585 Etching method and manufacturing method of a structure
09/13/2001US20010021570 Process for making microstructures and microstructures made thereby
09/13/2001US20010021538 Micromechanical component and process for its fabrication
09/13/2001US20010021419 Method for applying photoresist to a base body surface
09/13/2001US20010021166 Memory medium
09/13/2001US20010021159 Method of and apparatus for recording/reproducing an information signal, recording/reproducing head device, memory medium, and head element
09/13/2001DE10054964A1 Acceleration sensor for e.g. airbag system, antilock braking system, navigation system in motor vehicle has acceleration detection chip that is arranged in through hole of signal processing chip
09/11/2001US6287885 Method for manufacturing semiconductor dynamic quantity sensor
09/06/2001US20010019897 High etch rate method for plasma etching silicon nitride
09/06/2001US20010019532 Method of and apparatus for recording/reproducing an information signal, recording/reproducing head device, memory medium, and head element
09/06/2001US20010019034 Parylene micro check valve and fabrication method thereof
09/06/2001US20010018792 Method of forming a cavity structure with a thin bottom base plate
09/06/2001DE10106008A1 Microreactor for performing polymerase chain reactions, requires only very small sample and is made of material stable during temperature cycling
09/06/2001DE10050364A1 Semiconductor element used as a semiconductor sensor comprises a sensor substrate, a substrate which lies opposite the first main surface of the sensor substrate to transfer the electrical signal from the sensor substrate
09/05/2001EP1130631A1 Process for forming a buried cavity in a semiconductor material wafer
09/05/2001EP1129479A1 System for assembling substrates to bonding zones provided with cavities
09/05/2001EP1129478A1 Method and apparatus for improving accuracy of plasma etching process
09/04/2001US6284670 Method of etching silicon wafer and silicon wafer
09/04/2001US6284649 Chemical vapor phase growing method of a metal nitride film and a method of manufacturing an electronic device using the same
09/04/2001US6284631 Method and device for controlled cleaving process
09/04/2001US6284560 Method for producing co-planar surface structures
09/04/2001US6284345 Designer particles of micron and submicron dimension
09/04/2001US6284148 Method for anisotropic etching of silicon
09/04/2001US6284072 Multifunctional microstructures and preparation thereof
08/2001
08/30/2001WO2001063657A1 Two etchant etch method
08/30/2001WO2001007506A3 Microfabricated devices and method of manufacturing the same
08/30/2001US20010018232 Process for manufacturing a semiconductor arrangement
08/30/2001US20010017726 Micro mirror unit, optical disc drive using same, and method for producing micro mirror unit
08/30/2001US20010017358 Microelectromechanical valves including single crystalline material components
08/30/2001US20010017058 Micromechanical component and method for producing the micromechanical component
08/30/2001DE10008273A1 Assembly of small components produced by separation from semi-finished part onto bearer involves applying adhesive material to semi-finished part for adhesion to bearer after separation
08/30/2001DE10005850A1 Verfahren zur Herstellung von Mikrostrukturen A process for the fabrication of microstructures
08/29/2001CN1310854A Micromechanical electrostatic relay and method for the production thereof
08/23/2001US20010015342 Method of fabricating a refractive silicon microlens
08/23/2001US20010015106 Micromechanical sensor and method for its production
08/21/2001US6278231 An anodized film on a substrate surface; said film having a nanohole with diameters that differ at the surface of film and the surface of substrate and having a constriction of the nanohole between the surfaces; uniform shape and depth
08/21/2001US6277756 Method for manufacturing semiconductor device
08/21/2001US6277712 Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof
08/21/2001US6277666 Precisely defined microelectromechanical structures and associated fabrication methods
08/21/2001US6276992 Method of forming a groove in a surface of a mother substrate
08/21/2001US6276207 Semiconductor physical quantity sensor having movable portion and fixed portion confronted each other and method of manufacturing the same
08/16/2001WO2001058803A2 Method for producing a micromechanical component, and a component produced according to said method
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
08/16/2001US20010013630 Isolation in micromachined single crystal silicon using deep trench insulation
08/16/2001EP1123215A1 Three-dimensional microstructure
08/16/2001DE10006035A1 Micro-mechanical component production, used as sensor element or actuator element, comprises providing functional element and/or functional layer with protective layer
08/14/2001US6274462 Method of fabrication of an infrared radiation detector and infrared detector device
08/09/2001WO2001057921A1 Etching solution and method
08/09/2001WO2001057920A1 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
08/09/2001WO2001056771A2 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
08/09/2001DE10004964A1 Micromechanical cap structure comprises substrate in the form of wafer with a cavern having a base surface and parallel side wall sections lying opposite each other with stabilizing wall sections connected to the side wall sections
08/07/2001US6272083 Method of and apparatus for recording/reproducing information signal, recording/reproducing head device. Memory medium, and head element and manufacture thereof
08/07/2001US6271145 Method for making a micromachine
08/07/2001US6270685 Method for producing a semiconductor
08/07/2001US6270634 Method for plasma etching at a high etch rate
08/07/2001US6270622 Method and apparatus for improving accuracy of plasma etching process
08/07/2001US6270571 By depositing a material other than titanium on the surface of a base containing titanium and thermally treating in titanium-oxidation atmosphere; high crystallinity; whiskers; use in photoelectric transducers, photocatalytic devices
08/02/2001WO2001054810A1 Method for covering a microfluidic assembly
08/02/2001US20010010973 Method for producing a structure with narrow pores
08/02/2001US20010010676 Memory medium
08/02/2001US20010010338 Device and method for creating spherical particles of uniform size
07/2001
07/31/2001US6269067 Method of and apparatus for recording/reproducing information signal recording/reproducing head device memory and head element and manufacture thereof
07/31/2001US6268232 Method for fabricating a micromechanical component
07/26/2001WO2001053194A1 Microdevice and its production method
07/26/2001US20010009777 Forming patterned masking layer over wafer layer, removing uncovered portions of wafer layer using patterned masking layer to leave first raised structure and sacrificial raised structure in the side substrate region, etching
07/24/2001US6265238 Electrostatic capacitive sensor and method for manufacturing the same
07/24/2001US6264892 Miniaturized planar columns for use in a liquid phase separation apparatus
07/19/2001WO2001051973A1 Mems optical switch and method of manufacture
07/19/2001WO2001051276A2 Fabrication of metallic microstructures via exposure of photosensitive composition
07/19/2001WO2001001025A3 Microfabricated elastomeric valve and pump systems
07/19/2001US20010008457 Microelectromechanical optical switch and method of manufacture thereof
07/19/2001US20010008357 Methods of fabricating in-plane MEMS thermal actuators
07/19/2001US20010008300 Semiconductor device with flat protective adhesive sheet and method of manufacturing the same
07/19/2001DE19962431A1 Verfahren zum Herstellen einer Halbleiteranordnung A method of manufacturing a semiconductor device
07/19/2001CA2397238A1 Mems optical switch and method of manufacture
07/19/2001CA2396570A1 Fabrication of metallic microstructures via exposure of photosensitive composition
07/18/2001EP1116166A2 Sensor field for capacitive measuring fingerprint sensor and method for the production of said sensor field