Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 1 - Manufacture or treatment of devices or systems in or on a substrate
Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
12/2000
12/12/2000US6159825 Controlled cleavage thin film separation process using a reusable substrate
12/12/2000US6159824 Low-temperature bonding process maintains the integrity of a layer of microbubbles; high-temperature annealing process finishes the bonding process of the thin film to the target wafer
12/12/2000US6159762 Process for producing micromechanical sensors
12/12/2000US6159761 Method of manufacturing a force sensor having an electrode which changes resistance or electrostatic capacitance in response to force
12/12/2000US6159413 Micro structure and its manufacture method
12/12/2000US6159385 Providing a first and second substrates, bonding both substrates with an adhesive polymer layer, etching a portion of first substrate, selectively etching a portion of adhesive to release microelectromechanical component
12/07/2000WO2000073839A1 Micromachined electrostatic actuator with air gap
12/07/2000WO2000073056A1 Method for producing microcomponents
12/07/2000DE19922612A1 Micropump with peristaltic action for liquids having volumes within microliter ranges comprises a membrane separating pumping and pumped media within a groove with an endless configuration
12/07/2000CA2372938A1 Method of manufacturing micro-components
12/06/2000EP1057213A2 A method of component manufacture
12/06/2000EP1057006A1 A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method
12/05/2000US6156215 Method of forming a projection having a micro-aperture, projection formed thereby, probe having such a projection and information processor comprising such a probe
12/05/2000US6155909 Controlled cleavage system using pressurized fluid
11/2000
11/30/2000WO2000042231A3 Polycrystalline silicon germanium films for forming micro-electromechanical systems
11/30/2000DE19926025A1 Verfahren zum Herstellen von Mikrobauteilen A method of manufacturing micro-components
11/29/2000EP1055015A1 Method for designing and producing a micromechanical device
11/28/2000US6153524 Cluster tool method using plasma immersion ion implantation
11/28/2000US6152181 Microdevices based on surface tension and wettability that function as sensors, actuators, and other devices
11/23/2000WO2000070224A1 Micromechanic pump
11/21/2000US6150275 Micromechanical system fabrication method using (111) single crystalline silicon
11/21/2000US6149190 Micromechanical accelerometer for automotive applications
11/15/2000EP0919015B1 Process and device for applying a photoresist lacquer on uneven base body surfaces
11/14/2000US6146979 Pressurized microbubble thin film separation process using a reusable substrate
11/14/2000US6146716 Conservatively printed displays and methods relating to same
11/09/2000WO2000067537A2 Conservatively printed displays and methods relating to same
11/09/2000WO2000067306A1 Method for anisotropic plasma etching of semiconductors
11/09/2000WO2000066815A1 Method of producing a filter
11/09/2000DE19929776A1 Production of a device for manufacturing semiconductors comprises forming a protective layer on a substrate, joining to a further substrate and alternately forming a film with high molecular weight and etching
11/09/2000DE19919832A1 Verfahren zum anisotropen Plasmaätzen von Halbleitern A method for anisotropic plasma etching of semiconductors
11/09/2000CA2369963A1 Method of producing a filter
11/08/2000EP1050740A2 Method for the integrated manufacture of tips mounted to a support
11/07/2000US6143583 Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
11/07/2000US6143190 Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head
11/02/2000EP1049157A1 Process for manufacturing buried channels and cavities in semiconductor wafers
11/02/2000DE19919903A1 Verfahren zur Herstellung eines Filters A method for manufacturing a filter
10/2000
10/31/2000US6140709 Bonding pad structure and method for manufacturing the bonding pad structure
10/31/2000US6140144 Method for packaging microsensors
10/31/2000US6140143 Method of producing a buried boss diaphragm structure in silicon
10/31/2000US6139758 Method of manufacturing a micromachined thermal flowmeter
10/26/2000WO2000063836A1 Integrated circuit device which is secured against attacks resulting from controlled destruction of an additional layer
10/26/2000WO2000063654A1 Integrated optoelectronic thin-film sensor and method of producing same
10/26/2000DE19917950A1 Integrated optoelectronic thin film sensor, useful for scale scanning in a length, angle or two-dimensional measuring system, has a semiconductor layer of thickness corresponding to that of the detecting region of photodetectors
10/25/2000EP1046917A2 Method of manufacturing an external force detection sensor
10/25/2000CN1271474A Method and system for locally annealing a microstructure formed on a substrate and device formed thereby
10/24/2000US6136712 Method and apparatus for improving accuracy of plasma etching process
10/24/2000US6136243 Depositing and patterning a first mask layer of non-photoresist material and second mask layer of photoresist on substrate; etching to form mold pattern; removing portions of mask layers; depositing filler material, lapping, polishing
10/24/2000US6136171 High resolution sample analysis
10/19/2000WO2000062328A1 Method and apparatus for stabilising a plasma
10/17/2000US6134042 Reflective mems actuator with a laser
10/17/2000US6133059 Integrated micromechanical sensor device and process for producing it
10/17/2000US6131466 Integrated piezoresistive pressure sensor
10/12/2000WO2000059824A1 Method for producing self-supporting micro-structures, consisting of thin, flat sections or membranes, and use of micro-structures produced by said method as a resistance grid in a device for measuring weak gas flows
10/10/2000US6130010 A silicon composite with minimizing the size of corner-undercut portions for detecting an amount of acceleration, pressure in an air bag system
10/10/2000US6129559 Microconnector and method of manufacturing the same
10/10/2000US6129331 Low-power thermopneumatic microvalve
10/10/2000US6128953 Dynamical quantity sensor
10/05/2000DE19914007A1 Strukturierte flüssigkeitsabweisende Oberflächen mit ortsdefinierten flüssigkeitsbenetzenden Teilbereichen Structured liquid-repellent surfaces with spatially defined wettable subregions
10/04/2000EP1041621A2 Multilayered wafer with thrick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof
10/04/2000EP1041036A1 Micromachine and method of manufacturing the same
10/04/2000EP1040874A2 Structured liquid-repellent surface with defined liquid-wettable spots
10/04/2000EP1039972A1 Method and device for production of components for microfabrication
10/04/2000EP1039971A1 Device and method for creating aerosols for drug delivery
10/04/2000EP0651693B1 Method and apparatus for separating circuit dies from a wafer
10/03/2000US6127765 Micro-electromechanical device
10/03/2000US6127273 Process for anisotropic plasma etching of different substrates
09/2000
09/29/2000CA2302118A1 Structured liquid-repellent surfaces having regions which are liquid-wetting in a defined location
09/27/2000EP1039529A1 Method for manufacturing a microintegrated structure with buried connections, in particular an integrated microactuator for a hard-disk drive unit
09/27/2000EP1037858A1 Device and method for creating spherical particles of uniform size
09/27/2000EP1037713A1 Device and method for creating dry particles
09/27/2000EP1037712A1 Stabilized capillary microjet and devices and methods for producing same
09/26/2000US6124148 Method of manufacturing semiconductor acceleration sensor
09/21/2000WO2000055089A1 A method of manufacturing a thermal bend actuator
09/21/2000DE10013067A1 Semiconductor device production method, involves fastening protective layer at assembly mounting device with wafer edge removed from protective layer and wafer connected at side opposite to assembly mounting device
09/14/2000WO2000054318A1 Method for producing a microelectronic structure
09/14/2000WO2000054312A1 Ic-compatible parylene mems technology and its application in integrated sensors
09/14/2000WO2000054107A1 Step and flash imprint lithography
09/12/2000US6116516 Stabilized capillary microjet and devices and methods for producing same
09/08/2000WO2000052740A1 Gas delivery system
09/08/2000WO2000051938A1 Chlorotrifluorine gas generator system
09/08/2000WO2000051937A1 Gas generation system
09/05/2000US6114794 Thermal arched beam microelectromechanical valve
09/05/2000US6113722 Microscopic tube devices and method of manufacture
08/2000
08/31/2000WO2000050198A1 Method for machining work by laser beam
08/30/2000EP1031736A1 Process for manufacturing mechanical, electromechanical and opto-electromechanical microstructures having suspended regions subject to mechanical stresses during assembly
08/17/2000WO2000048238A1 Multilayer structure with controlled internal stresses and method for making same
08/17/2000DE19959169A1 Microactuator has piezoelectric element on which grooves are etched and is connected to voltage application line via upper electrode of substrate
08/17/2000DE10005804A1 Production of a semiconductor device comprises using a gas plasma during the formation of the trench and protective film and etching of the base of the trench
08/15/2000US6104073 Semiconductor integrated capacitive acceleration sensor and relative fabrication method
08/15/2000US6103399 Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method
08/10/2000WO2000046852A1 Micro-relay
08/10/2000WO2000029770A3 Parylene micro check valve and fabrication method thereof
08/10/2000DE19904307A1 Verfahren zur Herstellung von dreidimensionalen Strukturen mittels eines Ätzprozesses A process for producing three-dimensional structures by means of an etching process
08/10/2000CA2361756A1 Micro-relay
08/09/2000EP1026735A2 Method of dividing a wafer and method of manufacturing a semiconductor device
08/09/2000CN1262529A Micro-driver and its manufacturing method
08/08/2000US6101371 Article comprising an inductor
08/03/2000WO2000044667A1 Method for producing three-dimensional structures by means of an etching process
08/01/2000US6096656 Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
07/2000
07/27/2000WO2000005749A3 Method and apparatus for anisotropic etching
1 ... 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146