Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
07/2000
07/26/2000EP1022764A1 Article comprising enhanced nanotube emitter structure and process for fabricating article
07/26/2000EP1021815A1 Micromechanical electrostatic relay and method for the production thereof
07/25/2000US6093520 High aspect ratio microstructures and methods for manufacturing microstructures
07/25/2000US6093362 Miniaturized planar columns in novel support media for liquid phase analysis
07/25/2000CA2294656A1 Article comprising enhanced nanotube emitter structure and process for fabricating article
07/20/2000WO2000042666A1 Inertia force sensor and method for producing inertia force sensor
07/20/2000WO2000042231A2 Polycrystalline silicon germanium films for forming micro-electromechanical systems
07/20/2000DE10001361A1 Inertial microsensor, e.g. an acceleration sensor or gyroscope, is produced by thinning a thick silicon layer bonded to a glass substrate, forming the sensor structure and etching the glass to form a vacuum space below the structure
07/19/2000EP1020545A2 Method of producing structure having narrow pores and structure produced by the same method
07/13/2000WO2000041213A1 Methods utilizing scanning probe microscope tips and products therefor or produced thereby
07/11/2000US6088162 Multilayered filter films
07/11/2000US6087747 Microelectromechanical beam for allowing a plate to rotate in relation to a frame in a microelectromechanical device
07/11/2000US6087701 Semiconductor device having a cavity and method of making
07/11/2000US6086774 Method of making released micromachined structures by directional etching
07/06/2000DE19962650A1 Oberflächenkleinstgerät Surface micro device
07/05/2000EP1016621A2 Method for producing narrow pores and structure having the narrow pores, and narrow pores and structure produced by the method
07/05/2000EP1016620A2 Method for producing co-planar surface structures
07/05/2000EP1016135A1 Fusion-bond electrical feed-through
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
07/05/2000CN1054210C Wafer-like processing after sawing DMDS
07/04/2000US6082197 Acceleration sensor
06/2000
06/29/2000WO2000038209A1 Micromachine switch and its production method
06/29/2000WO2000038208A1 Micromachine switch and its production method
06/29/2000DE19961331A1 Federartiger Kupferfaserkörper, Verfahren zur Herstellung desselben und Kupfermikrospirale Copper of the same spring-like fiber body, methods for preparing and copper microcoil
06/22/2000WO2000036383A1 Method of producing calibration structures in semiconductor substrates
06/22/2000WO2000013129A3 Method for producing metallic microstructures and use of this method in the production of sensor devices for detecting fingerprints
06/22/2000WO2000012987A3 Micromechanical component protected against environmental influences
06/21/2000EP1011130A1 Method of anodizing silicon substrate and method of producing acceleration sensor of surface type
06/14/2000EP1008161A1 Thermal arched beam microelectromechanical devices and associated fabrication methods
06/14/2000EP1007873A1 Thermal microvalves
06/14/2000EP0938738B1 Method for manufacturing a micromechanical relay
06/13/2000US6075585 Vibrating probe for a scanning probe microscope
06/13/2000US6074888 Method for fabricating semiconductor micro epi-optical components
06/08/2000WO2000013130A3 Sensor field for capacitive measuring fingerprint sensor and method for the production of said sensor field
06/06/2000US6071819 Flexible skin incorporating mems technology
05/2000
05/31/2000EP1004882A2 Inertia sensor and method of fabricating the same
05/31/2000EP0764346A4 High vertical aspect ratio thin film structures
05/31/2000DE19957111A1 Semiconductor component, e.g. wafer of sensor chips or chips with air bridge wiring structures, has attached adhesive foil with low adhesion region above wafer structure portion
05/31/2000DE19854803A1 Locally thickened metallic microstructure, for a thermally controlled micro-mirror, is produced using an organic mask layer during metal layer structuring
05/25/2000WO2000029770A2 Parylene micro check valve and fabrication method thereof
05/25/2000CA2350595A1 Parylene micro check valve and fabrication method thereof
05/18/2000DE19954022A1 Semiconductor sensor, e.g. a capacitive-type acceleration sensor, is designed to avoid mobile and fixed section adhesion caused by electrostatic force, liquid surface tension and/or excessive external force
05/17/2000EP1001440A2 Switching structure and method of fabrication
05/16/2000US6064081 Silicon-germanium-carbon compositions and processes thereof
05/11/2000WO2000026958A1 System for assembling substrates to bonding zones provided with cavities
05/10/2000EP0998597A4 Field emitter fabrication using open circuit electrochemical lift off
05/10/2000EP0998597A1 Field emitter fabrication using open circuit electrochemical lift off
05/10/2000EP0941460B1 Process for producing micromechanical sensors
05/09/2000US6059982 Micro probe assembly and method of fabrication
05/09/2000US6059001 Apparatus for manufacturing microtubes with axially variable geometries
05/03/2000EP0997781A1 Exposure method
05/03/2000EP0997780A1 Exposure method
05/03/2000EP0996547A2 The production of microstructures for use in assays
04/2000
04/27/2000WO2000023376A1 Method for processing silicon using etching processes
04/27/2000DE19847455A1 Silicon multi-layer etching, especially for micromechanical sensor production, comprises etching trenches down to buried separation layer, etching exposed separation layer and etching underlying silicon layer
04/27/2000DE19839606C1 Mikromechanisches Bauelement und Verfahren zu dessen Herstellung Micromechanical component and method for its production
04/20/2000WO2000021877A1 Micromachine and method of manufacturing the same
04/20/2000DE19911150C1 Microelectronic structure, especially semiconductor memory, production comprising physically etching a conductive layer from a substrate such that removed material is transferred onto a layer structure side wall
04/20/2000DE19847305A1 Micromechanical device, especially an oscillating mirror, is produced by electrodepositing a device element onto a quasi-insular attachment region and an adjacent region of a bond layer
04/19/2000EP0994330A1 Method for manufacturing an angular rate sensor
04/19/2000CN1250871A Method for making angular rate sensor
04/18/2000US6051855 Electrostatic capacitive sensor
04/13/2000DE19841785A1 Verfahren zur Herstellung eines Körpers mit Mikrostrukturen aus thermisch aufgespritzem Material A process for the production of a body with microstructures of thermally aufgespritzem material
04/11/2000US6048734 Thermal microvalves in a fluid flow method
04/11/2000US6048411 Silicon-on-silicon hybrid wafer assembly
04/06/2000WO2000019505A1 Method and apparatus for improving accuracy of plasma etching process
04/06/2000DE19844418A1 Protective layer, useful for protecting complementary metal oxide semiconductor circuits during wet alkali etching of micromechanical silicon elements, comprises a plasma deposited carbon-containing layer or plasma treated photoresist layer
04/04/2000US6046067 Micromechanical device and method for its production
04/04/2000US6046066 Method of forming cantilever structure in microelectromanical system
04/04/2000US6044981 Microfabricated filter with specially constructed channel walls, and containment well and capsule constructed with such filters
03/2000
03/30/2000WO2000017094A1 Method for producing nanometer structures on semiconductor surfaces
03/30/2000WO2000016907A1 Micromachined electrical field-flow fractionation system
03/30/2000WO2000016833A1 Surface micromachined microneedles
03/30/2000CA2344398A1 Surface micromachined microneedles
03/29/2000EP0989595A2 Device for processing a surface of a substrate
03/29/2000EP0988695A1 Method and system for locally annealing a microstructure formed on a substrate and device formed thereby
03/23/2000WO2000016159A1 Method for producing a body having microstructures comprised of material applied by thermal spraying
03/23/2000WO2000016105A1 Formation of a bridge in a micro-device
03/23/2000DE19841964A1 Plasma etching of structure with trenched of different width or depth-width ratio, where etching speed is dependent upon temperature of silicon layer
03/23/2000CA2343308A1 Formation of a bridge in a micro-device
03/22/2000EP0987743A1 Semiconductor device and method of anodization for the semiconductor device
03/22/2000EP0625285B1 Method for anisotropically etching silicon
03/21/2000US6039897 Injection molding with microstructure from reservoirs
03/16/2000WO2000013916A1 Three-dimensional microstructure
03/16/2000WO1999059810A3 Microstructured films
03/15/2000EP0986106A1 Article comprising an inductor
03/09/2000WO2000013130A2 Sensor field for capacitive measuring fingerprint sensor and method for the production of said sensor field
03/09/2000WO2000013129A2 Method for producing metallic microstructures and use of this method in the production of sensor devices for detecting fingerprints
03/09/2000WO2000012987A2 Micromechanical component protected against environmental influences
03/09/2000WO2000012428A1 Micromechanical component with sealed membrane openings
03/09/2000WO2000012427A1 Micromechanical component and its production method
03/09/2000DE19839122A1 Vor Umwelteinflüssen geschützter mikromechanischer Sensor Protected from environmental influences micromechanical sensor
03/08/2000EP0983610A1 Method and apparatus for manufacturing a micromechanical device
03/08/2000EP0983609A1 Method for making a machined silicon micro-sensor
03/08/2000EP0846328B1 Electrostatically operated, micromechanical capacitor
03/07/2000US6033974 Method for controlled cleaving process
03/07/2000US6033766 Coated with a thin layer of silver
03/07/2000US6033628 Miniaturized planar columns for use in a liquid phase separation apparatus
03/01/2000EP0981710A1 Low-power thermopneumatic microvalve
02/2000
02/29/2000US6030850 Method for manufacturing a sensor