Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
01/2003
01/28/2003US6512432 Microswitch and method of fabricating a microswitch with a cantilevered arm
01/28/2003US6511899 Controlled cleavage process using pressurized fluid
01/28/2003US6511894 MEMS relay and method of fabricating the same
01/28/2003US6511859 IC-compatible parylene MEMS technology and its application in integrated sensors
01/28/2003US6511793 Method of manufacturing microstructure using photosensitive glass substrate
01/23/2003WO2003007026A1 Method for producing microscopic components
01/23/2003WO2003006396A1 Bonding method and product
01/23/2003WO2003006221A1 Injection molding a flash free microfluidic structure
01/23/2003WO2002042716A3 Wafer eutectic bonding of mems gyros
01/23/2003US20030017609 Microdevice and method for component separation in a fluid
01/23/2003US20030017305 Paek embossing and adhesion for microfluidic devices
01/23/2003US20030016428 Light deflector, method of manufacturing light deflector, optical device using light deflector, and torsion oscillating member
01/22/2003EP1276565A2 Fluidic impedances in microfluidic system
01/22/2003EP1276426A2 Systems and methods for the transport of fluids through a biological barrier and production techniques for such systems
01/22/2003CN1099614C Method for providing sacrificial spacer for micro-mechanical devices
01/21/2003US6510359 Method and system for self-replicating manufacturing stations
01/21/2003US6509670 Single stage microactuator for multidimensional actuation with multi-folded spring
01/21/2003US6509186 Miniaturized thermal cycler
01/21/2003US6508947 Method for fabricating a micro-electro-mechanical fluid ejector
01/16/2003WO2003005421A2 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection
01/16/2003WO2003005420A2 Method and apparatus for fabricating structures using chemically selective endpoint detection
01/16/2003WO2002064193A3 Microneedle devices and production thereof
01/16/2003WO2002028766A3 Method of trimming micro-machined electromechanical sensors (mems) devices
01/16/2003WO2001087765A3 Micromechanical component and method for producing the same
01/16/2003US20030013246 Method of manufacturing a dual wafer tunneling gyroscope
01/15/2003EP1275997A2 Light deflector, method of manufacturing light deflector, optical device using light deflector, and torsion oscillating member
01/15/2003EP1275020A1 Optical switch with mobile components and method for making same
01/15/2003EP1274648A1 Micromechanical component and method for producing the same
01/15/2003EP1274647A1 Micromechanical component and corresponding production method
01/15/2003EP1196788A4 Merged-mask micro-machining process
01/15/2003CN1391281A Multi-layer integrated circuit for join of substrates with wide gaps
01/14/2003US6507103 Semiconductor device
01/14/2003US6506620 Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
01/09/2003WO2003002779A1 Method for forming ultra-high strength elastic diamond like carbon structure
01/09/2003WO2002017985A3 Microneedle structure and production method therefor
01/09/2003WO2002012115A3 Methods for reducing the curvature in boron-doped silicon micromachined structures
01/09/2003US20030008519 Method and apparatus for fabricating structures using chemically selective endpoint detection
01/09/2003US20030008506 Anti-stiction method and apparatus for drying wafer using centrifugal force
01/09/2003US20030007913 Overcoating substrate with thin film; forming windows; miniaturization
01/09/2003US20030007262 Micromirror unit with torsion connector having nonconstant width
01/09/2003US20030006502 Hermetically sealed microstructure package
01/09/2003US20030006146 Method for machining micro grooves of dynamic pressure pneumatic bearing
01/07/2003US6504967 Passive alignment method and apparatus for fabricating a MEMS device
01/07/2003US6504253 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure
01/07/2003US6503775 Production method of a micromachine
01/07/2003US6503359 Monomolecular adhesion methods for manufacturing microfabricated multilaminate devices
01/07/2003US6503231 Microneedle device for transport of molecules across tissue
01/03/2003WO2003001565A2 Method for improved die release of a semiconductor device from a wafer
01/02/2003US20030003753 Method and apparatus for fabricating encapsulated micro-channels in a substrate
01/02/2003US20030003695 Semiconductor substrate, SOI substrate and manufacturing method therefor
01/02/2003US20030003619 Microfluidic structures in a semiconductor substrate and method and apparatus for rapid prototyping and fabrication of same
01/02/2003US20030003382 Microchip having grayscale and micromachined features and single mask process for patterning same
01/02/2003US20030003024 Chip reactors having at least two different microreaction channels
01/02/2003US20030001221 Micromechanical component as well as a method for producing a micromechanical component
01/02/2003US20030001150 Structure having narrow pores
01/02/2003EP1271155A1 Micromechanical component comprising a diamond layer, and production process
01/02/2003EP1270507A2 Passivation of anodic bonding regions in microelectromechanical systems
01/02/2003EP1270506A1 Micro-actuator and method of manufacturing the actuator
01/02/2003EP1270505A2 Anti-stiction method and apparatus for drying wafer using centrifugal force
01/02/2003EP1270504A1 Semiconductor device joint to a wafer
01/02/2003EP1269527A1 Fluorinated solvent compositions containing hydrogen fluoride
01/02/2003EP1269526A2 Method for depositing polycrystalline sige suitable for micromachining and devices obtained thereof
01/01/2003CN1388267A Locating and filming process to tip of micro pointed cone
12/2002
12/31/2002US6501725 Method of recording/reproducing an information signal
12/31/2002US6500348 Deep reactive ion etching process and microelectromechanical devices formed thereby
12/31/2002US6500268 Dry cleaning method
12/31/2002CA2102987C Formation of microstructures using a preformed photoresist sheet
12/26/2002US20020197873 Method for improved die release of a semiconductor device from a wafer
12/26/2002US20020197862 Semiconductor component in a wafer assembly
12/26/2002US20020197762 Micromechanical and microoptomechanical structures with single crystal silicon exposure step
12/26/2002US20020195673 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
12/26/2002US20020195463 Control mechanism for trace quantity of liquid
12/26/2002US20020195196 Process for the flush connection of bodies
12/25/2002CN1387251A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002CN1387250A Processing method binded by selenide chip for atomic resolution store shuffling device
12/24/2002US6498053 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
12/19/2002WO2002100771A2 Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
12/19/2002WO2002100542A1 Method of manufacturing a microfluidic structure, in particular a biochip, and structure obtained by said method_________________
12/19/2002WO2002100474A2 Microneedles for minimally invasive drug delivery and method of manufacturing the same
12/19/2002WO2002082047A3 High throughput screening of crystallization of materials
12/19/2002US20020193754 Microneedles for minimally invasive drug delivery
12/19/2002US20020192852 Micromechanical and microoptomechanical structures with backside metalization
12/19/2002US20020190319 Method for microfabricating structures using silicon-on-insulator material
12/18/2002EP1266863A2 Multi-level integrated circuit for wide-gap substrate bonding
12/17/2002US6495945 Piezoelectric/electrostrictive element
12/17/2002US6495389 Method for manufacturing semiconductor pressure sensor having reference pressure chamber
12/17/2002US6495387 Electronic devices including micromechanical switches
12/12/2002WO2002098788A2 Applications of a strain-compensated heavily doped etch stop for silicon structure formation
12/12/2002WO2002044033A3 Mems device with integral packaging
12/12/2002WO2001089788A9 Patterning of surfaces utilizing microfluidic stamps including three-dimensionally arrayed channel networks
12/12/2002US20020187648 Material removal method for forming a structure
12/12/2002US20020187312 Matrix-free desorption ionization mass spectrometry using tailored morphology layer devices
12/12/2002US20020185737 Multi-level integrated circuit for wide-gap substrate bonding
12/12/2002US20020185550 Fuel injection nozzle and method of use
12/12/2002US20020185469 Method of micromachining a multi-part cavity
12/11/2002EP1264215A1 Device for transferring a pattern to an object
12/11/2002EP1263675A1 Three-dimensional suspended integrated microstructure and method for making same
12/11/2002CN1384042A Method of making suspended microstructure
12/10/2002US6492309 Fluorinated solvent compositions containing hydrogen fluoride
12/05/2002WO2002097054A2 Shaped microcomponents via reactive conversion of biologically-derived microtemplates