Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
06/2002
06/18/2002US6405936 Stabilized capillary microjet and devices and methods for producing same
06/18/2002US6405594 Silicon base plate with low parasitic electrical interference for sensors
06/13/2002WO2002047172A1 A high frequency interconnect system using micromachined plugs and sockets
06/13/2002WO2002046091A2 Method for producing a fluid component, fluid component and an analysis device
06/13/2002US20020072203 Thin film-structure and a method for producing the same
06/13/2002US20020072143 Method of producing vacuum container
06/13/2002US20020071166 Magnetically packaged optical MEMs device and method for making the same
06/13/2002US20020070639 Piezoelectric/electrostrictive element
06/13/2002US20020070634 Freestanding polymer MEMS structures with anti stiction
06/13/2002DE10060433A1 Verfahren zur Herstellung eines Fluidbauelements, Fluidbauelement und Analysevorrichtung A method for producing a fluid device, the fluid device and analysis device
06/13/2002DE10055872A1 Porous structure production used for sieve or filter comprise anodizing silicon substrate to form porous silicon layer
06/12/2002EP1213260A2 Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
06/12/2002EP1213259A2 Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
06/11/2002US6404402 Preferential crystal etching technique for the fabrication of millimeter and submillimeter wavelength horn antennas
06/11/2002US6401544 Micromechanical component protected from environmental influences
06/06/2002WO2002044078A1 Method of manufacturing ultra-precise, self-assembled micro systems
06/06/2002WO2002044033A2 Mems device with integral packaging
06/06/2002WO2002043937A2 Method of making a product with a micro or nano sized structure and product
06/06/2002WO2002043615A2 Microfabricated elastomeric valve and pump systems
06/06/2002WO2001089788A3 Patterning of surfaces utilizing microfluidic stamps including three-dimensionally arrayed channel networks
06/06/2002US20020068462 Forming a carbon layer on at least a part of the material layer to prevent the part of the material layer from being etched; and wet-etching the material layer using an alkali solution.
06/06/2002US20020068370 Method of trimming micro-machined electromechanical sensors (MEMS) devices
06/06/2002US20020068021 Transparent on both sides, which can easily be used for transmitted-light analysis; not necessary to adjust the active height of the fluid structure by very precisely controlled etching parameters
06/06/2002US20020066978 Method of forming articles including waveguides via capillary micromolding and microtransfer molding
06/06/2002US20020066870 Mask for electron beam projection lithography and method of fabricating the same
06/06/2002DE10058864A1 Production of a micromechanical structure used for integrated sensor arrays comprises applying an auxiliary layer and a membrane to a substrate to cover contact surfaces
06/05/2002EP1211219A2 Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
06/05/2002EP1116166B1 Sensor field for capacitive measuring fingerprint sensor and method for the production of said sensor field
06/04/2002US6399900 Contact structure formed over a groove
06/04/2002US6399516 Plasma etch techniques for fabricating silicon structures from a substrate
06/04/2002US6399406 Encapsulated MEMS band-pass filter for integrated circuits and method of fabrication thereof
06/04/2002US6399177 Deposited thin film void-column network materials
05/2002
05/30/2002WO2002043118A2 Wafer-level transfer of membranes in semiconductor processing
05/30/2002WO2002042716A2 Wafer eutectic bonding of mems gyros
05/30/2002WO2002023115A3 Enhanced surface structures for passive immersion cooling of integrated circuits
05/30/2002WO2001090761A3 Methods of sampling specimens for microanalysis
05/30/2002WO2001089787A3 Microfluidic systems including three-dimensionally arrayed channel networks
05/30/2002WO2001078893A3 Fluidic impedances in microfluidic system
05/30/2002WO2001046489A9 Ion beam modification of residual stress gradients in thin film polycrystalline silicon membranes
05/30/2002US20020064957 Method of manufacturing a microstructure
05/30/2002US20020063107 Methods of fabricating microelectromechanical and microfluidic devices
05/29/2002EP1208403A1 Microelectromechanical optical switch and method of manufacture thereof
05/29/2002EP1208002A1 Deposited thin film void-column network materials
05/29/2002DE10055421A1 Verfahren zur Erzeugung einer mikromechanischen Struktur und mikromechanische Struktur Method for producing a micromechanical structure and micromechanical structure
05/28/2002US6396368 CMOS-compatible MEM switches and method of making
05/28/2002US6396174 Method for manufacturing a microintegrated structure with buried connections, in particular an integrated microactuator for a hard-disk drive unit
05/28/2002US6395574 Micromechanical component and appropriate manufacturing method
05/28/2002US6394429 Device and method for fluid aeration via gas forced through a liquid within an orifice of a pressure chamber
05/28/2002US6393685 Microjoinery methods and devices
05/23/2002WO2002040874A1 Apparatus and methods for conducting assays and high throughput screening
05/23/2002DE10054247A1 Betätigungselement und Verfahren zu seiner Herstellung Actuating element and process for its preparation
05/22/2002EP1055015B1 Method for producing a micromechanical device
05/22/2002EP0838005B1 Method for the manufacture of a membrane-containing microstructure
05/21/2002US6391788 Two etchant etch method
05/21/2002US6391741 Fabrication process for microstructure protection systems related to hard disk reading unit
05/21/2002US6391740 Generic layer transfer methodology by controlled cleavage process
05/21/2002US6389902 Micromechanical sensor and method for its production
05/16/2002WO2002038491A1 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof
05/16/2002WO2002038490A2 Method for producing glass-silicon-glass sandwich structures
05/16/2002US20020058422 Stiction-free microstructure releasing method for fabricating MEMS device
05/16/2002US20020058332 Microfabricated crossflow devices and methods
05/16/2002US20020058279 Microarray for use in the accurate detection of preferential particles in sample
05/16/2002US20020056519 Controlled cleavage using patterning
05/16/2002DE10053307A1 Capsule used for microsensors comprises capsule elements connected together to form inner chamber, and metallizations as bond connections to join both capsule elements
05/16/2002DE10053111A1 Production of field effect structure used in electronic devices comprises preparing substrate with gate region arranged between drain and source, and producing a germanium sacrificial layer
05/16/2002DE10052419A1 Production of micromechanical component comprises applying auxiliary layer and membrane layer on substrate, applying spacer layer, back-etching spacer layer, etching auxiliary layer and applying sealing layer
05/15/2002EP1204853A1 Inorganic permeation layer for micro-electric device
05/14/2002US6388279 Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
05/14/2002US6387778 Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag
05/14/2002US6387713 Method for manufacturing microfabrication apparatus
05/14/2002US6386507 Microelectromechanical valves including single crystalline material components
05/14/2002US6386463 Fuel injection nozzle and method of use
05/10/2002WO2002037911A1 Method and arrangement relating to providing a substrate with cavities
05/10/2002WO2002037660A1 Actuating member and method for producing the same
05/10/2002WO2002036485A1 Valve integrally associated with microfluidic liquid transport assembly
05/10/2002WO2002036484A1 Micromechanical component and corresponding production method
05/10/2002WO2001032930A9 Methods and apparatuses for analyzing polynucleotide sequences
05/09/2002US20020055266 Controlled cleavage process using pressurized fluid
05/09/2002US20020055260 CMOS-compatible MEM switches and method of making
05/09/2002US20020055253 Method for producing a micromechanical structure and a micromechanical structure
05/08/2002EP1203748A1 Microdevice and its production method
05/08/2002EP1203391A1 Microelectromechanic relay and method for the production thereof
05/08/2002EP1203096A2 Integration of biochemical protocols in a continuous flow microfluidic device
05/08/2002DE10054484A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
05/08/2002DE10053326A1 Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support
05/07/2002US6383833 Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape
05/02/2002WO2002034684A1 Method for anodic bonding at low temperatures
05/02/2002WO2002034667A1 Method for microstructures fabrication
05/02/2002WO2002011188A3 A mem sensor and a method of making same
05/02/2002WO2002010063A3 A tunneling sensor or switch and a method of making same
05/02/2002WO2001099149A3 Method for forming barrier structures on a substrate and the resulting article
05/02/2002WO2001096958A3 Process for producing microfluidic articles
05/02/2002WO2000054107A9 Step and flash imprint lithography
05/02/2002US20020052113 First etchant is used to etch through the layer in the fastest etching region, and then a second etchant is used to complete etching through the layer in the slowest etching region; microelectrical mechanical system (MEMS) applications
05/02/2002US20020051864 Laminated substrate including electroconductive film layer and layer of polytetrafluorethylene etched with synchrotron radiation light for use in plastic machinery
05/02/2002EP1201604A2 A method for producing micromachined devices and devices obtained thereof
05/02/2002EP1201603A2 Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch
05/02/2002EP1171378A4 A method of manufacturing a thermal bend actuator
05/01/2002CN1347535A Integrated circuit device which is secured against attacks resulting from controlled destruction of additional layer
05/01/2002CA2359506A1 Polysilicon microelectronic reflectors and beams and methods of fabricating same