Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
09/2002
09/05/2002US20020123232 High density wafer production method
09/05/2002US20020123227 Intermediate transfer layers for nanoscale pattern transfer and nanostructure formation
09/05/2002US20020123048 Detecting and measuring the concntration of preferential particles in solution; a substrate; obtain substrate, expose to electrodes, generate electric current, monitor actvity of particle in sample
09/05/2002US20020122894 Separating wafers coated with plastic films
09/05/2002US20020122881 Micromechanical device recoat methods
09/05/2002DE10207523A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
09/05/2002DE10106952A1 Chip-Reaktor Chip reactor
09/04/2002CN1367273A Chemical preparation method of controllable metal nano conductor
09/03/2002US6445053 Micro-machined absolute pressure sensor
09/03/2002US6444543 Forming semiconductor chips surrounded by peripheral grooves for separating into individual pieces on substrate surface, pasting protecting sheet on surface so sheet is bent along and adheres to bottom walls of grooves, dicing along grooves
09/03/2002US6444488 Comprising a fixed plate and a deformable membrane which are located opposite each other, which comprises the following depositing a first metal layer on an oxide layer, depositing a metal ribbon depositing a sacrificial resin layer generating,
09/03/2002US6444138 Method of fabricating microelectromechanical and microfluidic devices
09/03/2002US6444135 Method to make gas permeable shell for MEMS devices with controlled porosity
08/2002
08/29/2002WO2001018857A9 Process for fabrication of 3-dimensional micromechanisms
08/29/2002US20020119589 Method of manufacturing a micromechanical component
08/29/2002US20020118027 Nanostructured ceramic platform for micromachined devices and device arrays
08/29/2002US20020117728 Bonded wafer optical MEMS process
08/29/2002DE10206140A1 Verfahren zum Ausbilden einer Vertiefung in einem Halbleitersubstrat A method of forming a recess in a semiconductor substrate
08/29/2002DE10106135A1 Verfahren und Vorrichtung zur Herstellung von galvanisch abformbaren Negativformen mikrostukturierter Körper,insbesondere Zahnräder Method and apparatus for the production of mouldable electrically negative molds mikrostukturierter body, in particular toothed wheels
08/27/2002US6441481 Hermetically sealed microstructure package
08/27/2002US6441450 Acceleration sensor and method of manufacturing the same
08/27/2002US6441405 Micro-mechanical elements
08/27/2002US6440820 Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
08/27/2002US6440766 Microfabrication using germanium-based release masks
08/27/2002US6440645 Production of microstructures for use in assays
08/27/2002US6439693 Thermal bend actuator
08/22/2002WO2002065187A2 Method for making an optical micromirror and micromirror or array of micromirrors obtained by said method
08/22/2002WO2002065186A2 Pivoting optical micromirror, array for such micromirrors and method for making same
08/22/2002WO2002064497A1 Gyroscope and fabrication method thereof
08/22/2002WO2002064496A2 Method for forming microelectronic spring structures on a substrate
08/22/2002WO2002064495A2 Enhanced sacrificial layer etching technique for microstructure release
08/22/2002WO2002064193A2 Microneedle devices and production thereof
08/22/2002US20020115264 Controlled cleavage process using pressurized fluid
08/22/2002US20020115200 Miniaturized thermal cycler
08/22/2002US20020114058 Light-transmissive substrate for an optical MEMS device
08/22/2002US20020113296 Wafer level hermetic sealing method
08/22/2002US20020113281 MEMS device having an actuator with curved electrodes
08/22/2002US20020113034 Methods of fabricating microelectromechanical and microfluidic devices
08/22/2002DE10106715A1 Mikromechanisches Bauelement und Verfahren zu seiner Herstellung Micromechanical component and process for its preparation
08/22/2002DE10104868A1 Mikromechanisches Bauelement sowie ein Verfahren zur Herstellung eines mikromechanischen Bauelements Micromechanical component as well as a process for producing a micromechanical component
08/22/2002DE10104258A1 Verfahren zum Aufbringen einer strukturierten Schicht auf ein Trägersubstrat A method for applying a patterned layer to a carrier substrate
08/22/2002CA2437817A1 Method for making an optical micromirror and micromirror or array of micromirrors obtained by said method
08/22/2002CA2437816A1 Pivoting optical micromirror, array for such micromirrors and method for making same
08/21/2002EP1232996A2 Micromechanical device and process for its manufacture
08/21/2002EP1232785A2 Chip-reactor
08/21/2002CN1365504A Microelectromechanical relay and method for production thereof
08/21/2002CN1365009A Method for producing micro structure
08/20/2002US6437981 Thermally enhanced microcircuit package and method of forming same
08/20/2002US6436853 Microstructures
08/20/2002US6436821 Method for producing a micromechanical structure and a micromechanical structure
08/20/2002US6436794 Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer
08/20/2002US6436229 Gas phase silicon etching with bromine trifluoride
08/20/2002US6435028 Acceleration sensor
08/15/2002WO2002063394A1 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography
08/15/2002WO2002063288A1 Microfluidic devices
08/15/2002WO2002062698A2 Method for producing surface micromechanical structures, and sensor
08/15/2002WO2002062202A2 Microprotrusion array and methods of making a microprotrusion
08/15/2002WO2002038490A3 Method for producing glass-silicon-glass sandwich structures
08/15/2002US20020111031 Deep reactive ion etching process and microelectromechanical devices formed thereby
08/15/2002US20020110761 Photolithography patterns
08/15/2002US20020110758 Overcoating elastic material onto substrate; forming stress profiles; photolithographical patterning
08/15/2002US20020110757 Low cost integrated out-of-plane micro-device structures and method of making
08/15/2002US20020109903 Micro-electromechanical system
08/15/2002US20020109419 Method for manufacturing a microintegrated structure with buried connections, in particular an integrated microactuator for a hard-disk drive unit
08/15/2002US20020109207 Deep reactive ion etching process and microelectromechanical devices formed thereby
08/15/2002US20020108926 Method for producing micromachined devices and devices obtained thereof
08/15/2002CA2433076A1 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography
08/14/2002EP1231617A1 Out-of-plane micro-device structures
08/14/2002EP1231616A1 Out-of-plane micro-device structures
08/14/2002EP1231182A2 Out-of-plane micro-device structures
08/14/2002EP1230660A2 Cmos-compatible mem switches and method of making
08/14/2002CA2371413A1 Tiled microelectromechanical device modules and fabrication methods
08/13/2002US6433463 Method and apparatus for stress pulsed release and actuation of micromechanical structures
08/13/2002US6433401 Microfabricated structures with trench-isolation using bonded-substrates and cavities
08/13/2002US6433390 Bonded substrate structures and method for fabricating bonded substrate structures
08/13/2002US6432695 Miniaturized thermal cycler
08/13/2002US6432148 Fuel injection nozzle and method of use
08/08/2002WO2002061486A1 Bulk micromachining process for fabricating an optical mems device with integrated optical aperture
08/08/2002WO2002060811A2 Mems singulation process utilizing protective coating
08/08/2002WO2002060584A2 Method for carrying out a biochemical protocol in continuous flow in a microreactor
08/08/2002US20020106871 Optical membrane singulation process utilizing backside and frontside protective coating during die saw
08/08/2002US20020106870 Controlled cleaving process
08/08/2002US20020106867 Wafer-level transfer of membranes in semiconductor processing
08/08/2002US20020104990 Across-wafer optical MEMS device and protective lid having across-wafer light-transmissive portions
08/08/2002US20020104379 Accelerometer with re-entrant grooves
08/08/2002DE10105187A1 Verfahren zum Erzeugen von Oberflächenmikromechanikstrukturen und Sensor A process for producing surface micromechanical structures and sensor
08/08/2002CA2436488A1 Method for carrying out a biochemical protocol in continuous flow in a microreactor
08/07/2002EP1229152A1 Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk
08/07/2002EP1229151A1 Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk
08/07/2002EP1228998A2 Micromechanical device and process for the manufacture of a micromechanical device
08/07/2002EP1228401A1 Step and flash imprint lithography
08/07/2002EP1228244A1 Methods and apparatuses for analyzing polynucleotide sequences
08/06/2002US6429506 Semiconductor device produced by dicing
08/06/2002US6428713 MEMS sensor structure and microfabrication process therefor
08/01/2002WO2002059942A2 Actuator and micromirror for fast beam steering and method of fabricating the same
08/01/2002WO2002022492A3 Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods
08/01/2002US20020101719 Thermally enhanced microcircuit package and method of forming same
08/01/2002US20020101663 Diffractive optical element
08/01/2002US20020100714 Microfluidic devices
08/01/2002DE10104324A1 Verfahren zum Ätz-Strukturieren der Oberfläche eines Bauteils A method of etching patterning the surface of a component