Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 1 - Manufacture or treatment of devices or systems in or on a substrate
Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
10/2003
10/29/2003CN1126135C Thermal arched beam microelectromechanicals devices and associated fabrication method
10/28/2003US6639724 Device having a barrier layer located therein and a method of manufacture therefor
10/28/2003US6639722 Stress tuned blazed grating light valve
10/28/2003US6639325 Microelectromechanic relay and method for the production thereof
10/28/2003US6639289 Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
10/23/2003WO2003088370A2 Hermetic encapsulation of organic electro-optical elements
10/23/2003WO2003088354A2 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003WO2003088347A2 Method for connecting substrates and composite element
10/23/2003WO2003088340A2 Method for the production of structured layers on substrates
10/23/2003WO2003087935A2 Nanoimprint resist
10/23/2003WO2003087424A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003WO2003087423A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003WO2003086958A2 Method for producing a product having a structured surface
10/23/2003US20030199177 Semiconductor crystal-structure-processed mechanical devices, and methods and systems for making
10/23/2003US20030199116 Integrated circuit-integrated flexible shear-stress sensor skin and method of fabricating the same
10/23/2003US20030197214 Monolithic integrated crystal-structure-processed mechanical, and combined mechanicaland electrical devices, and methods and systems for making
10/23/2003US20030196989 Selective & damage free Cu cleaning process for pre-dep, post etch/CMP
10/23/2003US20030196988 Process for producing an SPM sensor
10/23/2003US20030196679 For cleaning of semiconductor wafers, masks
10/23/2003US20030196593 Thin-film crystal-structure-processed mechanical devices, and methods and systems for making
10/23/2003US20030196592 Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making
10/23/2003US20030196591 Formation of crystal-structure-processed mechanical, and combined mechanical and electrical, devices on low-temperature substrates
10/23/2003US20030196590 Crystal-structure-processed mechanical devices and methods and systems for making
10/23/2003US20030196489 Method of trimming micro-machined electromechanical sensors (MEMS) devices
10/23/2003CA2505014A1 Hermetic encapsulation of organic electro-optical elements
10/23/2003CA2485022A1 Method for connecting substrates and composite element
10/23/2003CA2480854A1 Method for producing a product having a structured surface
10/23/2003CA2480797A1 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003CA2480737A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003CA2480691A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003CA2479823A1 Method for the production of structured layers on substrates
10/22/2003EP0831963B1 Microfabricated porous membranes with bulk support
10/21/2003US6635506 Method of fabricating micro-electromechanical switches on CMOS compatible substrates
10/21/2003US6635311 Microfabrication and nanofabrication, atomic force microscope imaging
10/21/2003US6635226 Device having substrate of non-silicon based materials, with cavity serving as reaction zone in fluid communication with microchannels, cover plate defining reaction chamber, ports defining fluid flow path, and surface containing polyether
10/16/2003WO2003051765A3 Method of dividing a substrate into a plurality of individual chip parts
10/16/2003WO2002100771A3 Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
10/16/2003US20030194873 Structure having recesses and projections, method of manufacturing structure, and functional device
10/16/2003US20030193286 Hermetic encapsulation of organic, electro-optical elements
10/16/2003US20030192587 Microfluidic device and manufacture thereof
10/16/2003US20030192476 Sputtered spring films with low stress anisotropy
10/16/2003US20030192179 Method for assembling micro structures and related apparatus
10/15/2003EP1353443A2 Spring contact
10/15/2003EP1352414A2 A tunneling sensor or switch and a method of making same
10/15/2003CN1448333A 静电激励器 Static actuator
10/14/2003US6632724 Controlled cleaving process
10/14/2003US6632698 Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS
10/14/2003US6632373 Method for an optical switch on a substrate
10/09/2003WO2003083952A2 Device and sensor for receiving light signals and method for the production thereof
10/09/2003WO2003083912A2 Field-assisted fusion bonding
10/09/2003WO2003083906A2 An integrated circuit-integrated flexible shear-stress sensor skin
10/09/2003WO2003083492A1 Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same
10/09/2003WO2003031321A3 Hybrid mems fabrication method and new optical mems device
10/09/2003WO2002098788A3 Applications of a strain-compensated heavily doped etch stop for silicon structure formation
10/08/2003EP1350759A2 Methods for embossing and bonding of PAEK for microfluidic devices
10/08/2003EP1349731A1 Microscale nozzle and method for manufacturing the same
10/08/2003EP0885452B1 Electrochemical removal of material, particularly excess emitter material in electron-emitting device
10/08/2003CN1447093A Micro inertia sensor and its mfg. method
10/07/2003US6630367 Single crystal dual wafer, tunneling sensor and a method of making same
10/02/2003WO2002076880A3 Method for producing micromechanic sensors and sensors produced by said method
10/02/2003US20030186027 Micro-passage element used for fluid analysis
10/02/2003US20030183887 MEMS device and fabrication method thereof
10/02/2003US20030183222 Device and method for creating aerosols for drug delivery
10/02/2003US20030183009 Micro inertia sensor and method of manufacturing the same
10/02/2003US20030183008 Complex microdevices and apparatus and methods for fabricating such devices
10/02/2003DE20311971U1 Three-dimensional electron beam gas ion lithograph for generating three-dimensional structures deposits given images in vacuum chamber and the scanner electron microscope is supplemented with mini gas pressure chamber
10/01/2003EP1348121A1 Method for producing thin film sensors, especially hot film anemometers and humidity sensors
10/01/2003EP1347937A2 Micromechanical component and corresponding production method
10/01/2003EP1177333B1 Method of producing a filter
10/01/2003CN1446368A Method for forming barrier structures on substrate and resulting article
09/2003
09/30/2003US6627842 Micro-protrusion arrays fabricated by e-beam exposure
09/30/2003US6627096 Single mask technique for making positive and negative micromachined features on a substrate
09/30/2003US6626468 Pipe joint, its manufacturing method, and fluid device using the same
09/30/2003US6625874 Depositing layers of sacrificial material on substrate containing electrical drive circuitry, defining deposition areas for actuator arms and cross-arm, depositing actuator layer, selectively etching to form actuator arms
09/25/2003WO2003079414A2 Optical polymer nanocomposite substrates with surface relief structures
09/25/2003WO2003078306A1 An orientation coating method of the top of micro tip.
09/25/2003WO2003078304A2 Surface relief structures for joining and adhesion
09/25/2003WO2003078301A2 Micro-electromechanical systems
09/25/2003WO2003031318A3 Method for producing cavities having an optically transparent wall
09/25/2003WO2003009318A3 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
09/25/2003WO2003009317A3 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
09/25/2003WO2002090245A3 Methods of forming microstructure devices
09/25/2003WO2002030809A3 Micromachined component and method of manufacture
09/25/2003US20030180029 Optical polymer nanocomposite substrates with surface relief structures
09/25/2003US20030178635 Perpendicular torsion micro-electromechanical switch
09/25/2003US20030178075 Fabrication of ultra-shallow channels for microfluidic devices and systems
09/24/2003EP1347264A1 Method of fabricating a probe for SPM
09/24/2003EP1345844A2 Soi/glass process for forming thin silicon micromachined structures
09/24/2003EP1345842A2 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
09/24/2003EP1345841A1 Valve integrally associated with microfluidic liquid transport assembly
09/24/2003EP1345646A2 Microneedle devices and production thereof
09/24/2003EP1345551A2 Microfabricated elastomeric valve and pump systems
09/24/2003CN1444738A Micromirror elements, package for micromirror elements, and projection system therefor
09/23/2003US6624921 Micromirror device package fabrication method
09/18/2003WO2003076331A2 Method for producing micro-mechanical components and components produced according to said method
09/18/2003WO2003076330A2 Silicon carbide microelectromechanical devices with electronic circuitry
09/18/2003WO2002095799A3 Thin films and production methods thereof
09/18/2003US20030176071 Method for manufacturing semiconductor device
09/18/2003US20030176007 Microstructure and method for the production thereof
09/18/2003US20030176006 Method for manufacturing semiconductor device
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