| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 03/04/2004 | DE10339921A1 Production of liquid fine particles comprises atomizing a liquid to form atomized liquid particles, removing the micro-fine liquid particles, and contacting with a heated carrier gas to thermally dry the particles and form liquid droplets |
| 03/04/2004 | DE10237787A1 Schichtsystem mit einer Siliziumschicht und einer Passivierschicht, Verfahren zur Erzeugung einer Passivierschicht auf einer Siliziumschicht und deren Verwendung Layer system having a silicon layer and a passivation layer, method for producing a passivating layer on a silicon layer and the use thereof |
| 03/04/2004 | DE10237249A1 Verfahren zum selektiven Abtragen von Material aus der Oberfläche eines Substrats, Maskierungsmaterial für einen Wafer und Wafer mit einem Maskierungsmaterial A method for selectively removing material from the surface of a substrate, the masking material for a wafer and the wafer with a masking material |
| 03/03/2004 | EP1394101A2 Method of selective bonding of wafers |
| 03/03/2004 | EP1392484A2 High throughput screening of crystalization of materials |
| 03/03/2004 | EP0950172B1 Method for producing a suspended element in a micro-machined structure |
| 03/02/2004 | US6700121 Methods of sampling specimens for microanalysis |
| 03/02/2004 | US6698454 Valve integrally associated with microfluidic liquid transport assembly |
| 02/26/2004 | WO2004017361A2 Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material |
| 02/26/2004 | WO2004016547A1 Method for the production of a micromechanical device, particularly a micromechanical oscillating mirror device |
| 02/26/2004 | WO2004016546A2 Layer system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof |
| 02/26/2004 | WO2004016406A1 Imprint lithography processes and systems |
| 02/26/2004 | US20040038060 Fine structure composite and drying method of fine structure using the same |
| 02/26/2004 | US20040037956 Vapor deposition a silane coupling agent on electronics, under control pressure in vacuum chamber; preventing non-uniform coatings |
| 02/26/2004 | US20040035821 Methods for forming and releasing microelectromechanical structures |
| 02/26/2004 | US20040035820 Fabrication of MEMS devices with spin-on glass |
| 02/26/2004 | US20040035605 Electrically active patterns are applied using colloidal suspension of nanoparticles that exhibit a desired electrical characteristic; nanoparticles are surrounded by insulative shells that may be removed by application of energy |
| 02/26/2004 | US20040035206 Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same |
| 02/26/2004 | US20040035021 Drying resist with a solvent bath and supercritical CO2 |
| 02/26/2004 | DE10236150A1 Method for forming opening in semiconductor substrate layer for manufacture of calibration standard for scanning microscopy, micromechanical sensor or other components |
| 02/26/2004 | DE10236149A1 Production of a structure having a sharp tip or cutting edge comprises providing a semiconductor substrate on a surface having a recess with a tip section, side walls and a layer, and deforming the substrate in the region of the recess |
| 02/25/2004 | EP1390988A2 Method for producing optically transparent regions in a silicon substrate |
| 02/25/2004 | EP1390794A2 Method for making an optical micromirror and micromirror or array of micromirrors obtained by said method |
| 02/25/2004 | EP1390793A2 Pivoting optical micromirror, array for such micromirrors and method for making same |
| 02/25/2004 | EP1390765A1 Method for manufacturing a silicon sensor and a silicon sensor |
| 02/25/2004 | CN1478054A Micromachined component and method of manufacture |
| 02/25/2004 | CN1477655A Floating structure radio-frequency microinductor and its production process |
| 02/25/2004 | CN1476977A Method for making microstructure body, method for making liquid spray nozzle and liquid spray nozzle |
| 02/24/2004 | US6696364 Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support |
| 02/24/2004 | US6696352 Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer |
| 02/24/2004 | US6696343 Micro-electromechanical varactor with enhanced tuning range |
| 02/24/2004 | US6695455 Fabrication of micromirrors on silicon substrate |
| 02/19/2004 | WO2004016036A2 Micromachined ultrasonic transducers and method of fabrication |
| 02/19/2004 | WO2004015362A2 Method for producing a structure comprising a narrow cutting edge or tip and cantilever beam provided with a structure of this type |
| 02/19/2004 | WO2004014785A2 Method for producing at least one small opening in a layer on a substrate and components produced according to said method |
| 02/19/2004 | WO2004014784A1 Micromachine and production method therefor |
| 02/19/2004 | WO2003050035A3 Adhesiveless microfluidic device fabrication |
| 02/19/2004 | US20040033639 Integrated method for release and passivation of MEMS structures |
| 02/19/2004 | US20040031320 Method of producing self-supporting microstructures, thin flat parts or membranes, and method of measuring weak gas flows with an assembly incorporating the self-supporting microstructures as resistance grids |
| 02/19/2004 | DE10236812A1 For the production of metal/ceramic micro-components, a lost negative mold is shaped in a three-dimensional body by injection molding using two polymer fractions, where one is electrically conductive |
| 02/17/2004 | US6694504 Etch mask patterning; photolithography |
| 02/17/2004 | US6693045 High density wafer production method |
| 02/17/2004 | US6693039 Process for forming a buried cavity in a semiconductor material wafer and a buried cavity |
| 02/12/2004 | WO2004013039A2 Low temperature plasma si or sige for mems applications |
| 02/12/2004 | WO2004013038A2 Etch stop control for mems device formation |
| 02/12/2004 | WO2004013037A1 Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device |
| 02/12/2004 | WO2003086958A3 Method for producing a product having a structured surface |
| 02/12/2004 | WO2003049156A3 System and method for micro electro mechanical etching |
| 02/12/2004 | WO2003016205A3 Mems and method of manufacturing mems |
| 02/12/2004 | US20040029041 Lithography; curable thermoplastic resin; transferring patterns |
| 02/12/2004 | US20040028875 Method of making a product with a micro or nano sized structure and product |
| 02/12/2004 | US20040028814 Methods utilizing scanning probe microscope tips and products therefor or produced thereby |
| 02/12/2004 | US20040028327 Monolithic three-dimensional structures |
| 02/12/2004 | US20040027636 Device having a light-absorbing mask and a method for fabricating same |
| 02/12/2004 | US20040026366 Method of manufacturing ultra-precise, self-assembled micro systems |
| 02/12/2004 | DE10235371A1 Production of a micromechanical device used in integrated optical arrangements comprises preparing an SOI or EOI substrate having a silicon functional layer, forming a trench extending through the functional layer, and further processing |
| 02/12/2004 | DE10234589A1 Layer system used in the production of micro-electromechanical structures comprises a passivating layer consisting of an inorganic partial layer and a polymeric partial layer formed on a silicon layer |
| 02/11/2004 | EP1388369A2 Capillary-channel probes for liquid pickup, transportation and dispense using spring beams |
| 02/10/2004 | US6689694 Micromechanical system fabrication method using (111) single crystalline silicon |
| 02/05/2004 | WO2004011368A2 Low temperature anodic bonding method using focused energy for assembly of micromachined systems |
| 02/05/2004 | WO2004011366A1 Micromachine and method of manufacturing the micromachine |
| 02/05/2004 | US20040023498 Method of making multilevel MEMS structures |
| 02/05/2004 | US20040023429 Low temperature plasma Si or SiGe for MEMS applications |
| 02/05/2004 | US20040023424 Etch stop control for MEMS device formation |
| 02/05/2004 | US20040022931 Microelectromechanical system; sacrificial material is dissolved with a release solution that also acts as an electrolyte, forming a galvanic cell with the doped structural film and metal; nonionic detergent added |
| 02/05/2004 | US20040022681 For use in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems |
| 02/05/2004 | US20040020602 Field-assisted fusion bonding |
| 02/05/2004 | US20040020518 Providing enclosed pressure vessel containing supercritical carbon dioxide; adding a second fluid to vessel, forming an interface between supercritical fluid and second fluid; displacing supercritical fluid from vessel with pressure |
| 02/05/2004 | US20040020303 Surface-micromachined absolute pressure sensor and a method for manufacturing thereof |
| 02/05/2004 | US20040020173 Low temperature anodic bonding method using focused energy for assembly of micromachined systems |
| 02/05/2004 | DE10232190A1 Verfahren zur Herstellung eines Bauelements mit tiefliegenden Anschlußflächen Method for manufacturing a device with deep pads |
| 02/05/2004 | DE10231729A1 Component used in micro-mechanical structures has a surface micro-mechanical structure formed in a functional layer connected to a substrate via an insulating layer which is attacked by the process of removing the first sacrificial layer |
| 02/05/2004 | DE10055872B4 Verfahren zur Herstellung einer porösen Struktur für ein Sieb oder einen Filter und poröse Struktur für ein Sieb oder einen Filter A process for preparing a porous structure for a screen or a filter and porous structure for a screen or a filter |
| 02/04/2004 | CN1472133A Bridge for microelectromechanical structure |
| 02/03/2004 | US6686642 Micro-machined system comprising logic circuitry or electron emitter array; second surface with gradual incline; evacuation, hermetic sealing |
| 02/03/2004 | US6686638 Micromechanical component including function components suspended movably above a substrate |
| 02/03/2004 | US6686291 Undercut process with isotropic plasma etching at package level |
| 02/03/2004 | US6686184 Patterning of surfaces utilizing microfluidic stamps including three-dimensionally arrayed channel networks |
| 02/03/2004 | US6685844 Deep reactive ion etching process and microelectromechanical devices formed thereby |
| 01/29/2004 | WO2004010481A1 Method of manufacture of a multi-layered substrate with a thin single crystalline layer |
| 01/29/2004 | WO2004010449A1 Bimorph switch, method of producing the bimorph switch, electronic circuit, and method of producing the electronic circuit |
| 01/29/2004 | WO2003037782A3 Micromechanical component and method for producing same |
| 01/29/2004 | US20040018749 Method of decreasing brittleness of single crystals, semiconductor wafers, and solid-state devices |
| 01/29/2004 | US20040018734 Anisotropic dry etching technique for deep bulk silicon etching |
| 01/29/2004 | US20040016995 MEMS control chip integration |
| 01/28/2004 | EP1383707A2 Fabrication of silicon micro mechanical structures |
| 01/27/2004 | US6682871 Microelectromechanical optical switch and method of manufacture thereof |
| 01/22/2004 | WO2004008522A2 Method for producing a component having submerged connecting areas |
| 01/22/2004 | WO2004008504A1 Three dimensional thin film devices and methods of fabrication |
| 01/22/2004 | WO2003092048A3 Micro electro-mechanical system method |
| 01/22/2004 | US20040014300 Method of making device chips collectively from common material substrate |
| 01/22/2004 | US20040014253 Three dimensional thin film devices and methods of fabrication |
| 01/22/2004 | US20040012301 Actuating member and method for producing the same |
| 01/22/2004 | US20040012124 Apparatus and method of fabricating small-scale devices |
| 01/22/2004 | US20040012061 Decreased stiction |
| 01/22/2004 | US20040011761 Method for using drie with reduced lateral etching |
| 01/22/2004 | DE10326555A1 Brücken für mikroelektromechanische Strukturen Bridges for microelectromechanical structures |
| 01/22/2004 | DE10231730A1 Mikrostrukturbauelement und Verfahren zu dessen Herstellung Microstructure component and process for its preparation |
| 01/22/2004 | DE10230252A1 Verfahren zur Herstellung integrierter Mikrosysteme A method for manufacturing integrated microsystems |
| 01/21/2004 | EP1382565A1 Production device and production method for silicon-based structure |