Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
01/2004
01/21/2004EP1381523A1 Freestanding polymer mems structures with anti stiction
01/21/2004CN1469154A Method for centralized producing device chip with shared substrate
01/21/2004CN1468798A Making process of micro suspension structure
01/20/2004US6679995 Method of micromechanical manufacturing of a semiconductor element, in particular an acceleration sensor
01/15/2004WO2004006278A2 Nanostructure field emission cathode
01/15/2004WO2004006003A1 A device having a light-absorbing mask a method for fabricating same
01/15/2004WO2003057618A3 Method for producing a protective covering for a component
01/15/2004WO2002091439A9 Fabrication of a microelectromechanical system (mems) device
01/15/2004US20040009673 Method and system for imprint lithography using an electric field
01/15/2004US20040009624 Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer
01/15/2004US20040009614 Micromachined apparatus for collection, separation and analysis of polynucleotides, proteins, peptides, receptors, chelators and/or antibodies; high throughput assays; microfluidics
01/14/2004EP1380422A1 Method of manufacturing microstructure, method of manufacturing liquid discharge head, and liquid discharge head
01/14/2004EP1379463A2 Method for producing a semiconductor component and a semiconductor component produced according to this method
01/14/2004CN1467521A Micro mirror unit and method of making the same
01/14/2004CN1134888C Method of forming groove in surface of mother substrate
01/14/2004CA2490975A1 A device having a light-absorbing mask and a method for fabricating same
01/08/2004WO2004003981A1 Conductive etch stop for etching a sacrificial layer
01/08/2004WO2004003965A2 Mems capping method and apparatus
01/08/2004WO2004003620A1 Reduced formation of asperities in contact micro-structures
01/08/2004WO2004003256A1 Anisotropic dry etching of cu-containing layers
01/08/2004WO2003090281A3 Single crystal silicon membranes for microelectromechanical applications
01/08/2004US20040005735 Dicing method for micro electro mechanical system chip
01/08/2004US20040005734 Dicing method for micro electro mechanical system chip
01/08/2004US20040004282 Thermally enhanced semiconductor chip having integrated bonds over active circuits
01/08/2004US20040004058 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
01/08/2004US20040004002 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
01/08/2004DE10206832B4 Verfahren zur Herstellung mikromechanischer Bauelemente mittels anodischem Bonden und mikromechanisches Bauelement A process for preparing micromechanical components by means of anodic bonding and micromechanical component
01/07/2004EP1378487A1 Nanostructure, Electron Emitting Device, Carbon Nanotube Device, and Method of Producing the Same
01/07/2004EP1378486A1 Nanostructure, electron emitting device, carbon nanotube device, and method of producing the same
01/07/2004EP1377338A2 Method of manufacturing microneedle structures using soft lithography and photolithography
01/06/2004US6674350 Electromagnetic actuator, optical scanner and method of preparing electromagnetic actuator
01/06/2004US6674141 Single crystal, tunneling and capacitive, three-axes sensor using eutectic bonding and a method of making same
01/06/2004US6674140 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
01/06/2004US6673694 Method for microfabricating structures using silicon-on-insulator material
01/06/2004US6673253 Method of fabricating integrated LC/ESI device using smile, latent masking, and delayed locos techniques.
01/06/2004US6673252 Method of fabricating a refractive silicon microlens
01/06/2004US6671939 Method for producing a piezoelectric/electrostrictive device
01/02/2004EP1376663A2 Method and system for forming a semiconductor device
01/02/2004EP1375417A2 Bridges for microelectromechanical structures
01/02/2004EP1375416A1 Micro-electro-mechanical device, in particular micro-actuator for hard-disk drive, and manufacturing process thereof
01/02/2004EP1374304A1 High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same
01/02/2004EP1374288A2 Method of plasma etching organic antireflective coating
01/02/2004EP1373129A2 Method for producing micromechanic sensors and sensors produced by said method
01/01/2004US20040002216 Method and system for forming a semiconductor device
01/01/2004US20040002215 Whole wafer MEMS release process
12/2003
12/31/2003WO2004000722A1 Patterning nanofeatures over large areas
12/31/2003WO2004000720A1 Fabrication of a reflective spatial light modulator
12/31/2003WO2004000718A2 Bridges for microelectromechanical structures
12/31/2003WO2004000569A1 Complex microstructure film
12/31/2003WO2004000567A1 Mold tool method of manufacturing a mold tool and storage medium formed by use of the mold tool
12/31/2003WO2003088347A3 Method for connecting substrates and composite element
12/31/2003WO2003062137A3 Method of making a thick microstructural oxide layer and device utilizing same
12/31/2003CA2490265A1 Complex microstructure film
12/30/2003US6669644 Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
12/30/2003US6669537 Resin diamond blade and optical waveguide manufacturing method using the blade
12/25/2003US20030235991 Substrate etch method and device
12/25/2003US20030235930 Multi-impression nanofeature production
12/25/2003US20030235678 Complex microstructure film
12/25/2003US20030234703 Bridges for microelectromechanical structures
12/25/2003US20030234179 Methods of and apparatus for molding structures using sacrificial metal patterns
12/25/2003US20030234075 Method for cutting a block of material and forming a thin film
12/24/2003WO2003106955A1 Sensor and method for producing a sensor
12/24/2003WO2003106329A2 Microelectromechanical device with integrated conductive shield
12/24/2003WO2003106327A1 Component and method for producing the same
12/24/2003WO2003066515A3 Microengineered electrical connectors
12/24/2003WO2003056611A3 Resistless lithography method for producing fine structures
12/24/2003WO2003024865A8 Method for producing micro-electromechanical components
12/24/2003WO2003011748A3 Micro-machined ultrasonic transducer (mut) substrate that limits the lateral propagation of acoustic energy
12/24/2003WO2002090243A3 Thick sandwich wafer for mems fabrication
12/24/2003CA2490393A1 Microelectromechanical device with integrated conductive shield
12/23/2003US6667837 Method and apparatus for configuring an aperture edge
12/23/2003US6667245 CMOS-compatible MEM switches and method of making
12/23/2003US6667237 Method and apparatus for patterning fine dimensions
12/23/2003CA2340059C Micromechanical sensor and method for producing same
12/18/2003WO2003105198A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
12/18/2003WO2003073164A3 Novel planarization method for multi-layer lithography processing
12/18/2003US20030230793 Support for microelectronic, microoptoelectronic or micromechanical devices
12/18/2003US20030230472 Multi-seal fluid conductor electrical switch device and method of manufacture therefor
12/18/2003US20030230147 Microelectromechanical device with integrated conductive shield
12/17/2003EP1371605A2 Optical micro systems
12/16/2003US6664126 Process for fabrication of 3-dimensional micromechanisms
12/16/2003US6664123 Method for etching metal layer on a scale of nanometers
12/16/2003US6664027 Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging
12/16/2003US6663820 Method of manufacturing microneedle structures using soft lithography and photolithography
12/16/2003US6663789 Bonded substrate structures and method for fabricating bonded substrate structures
12/16/2003US6663784 Method for producing three-dimensional structures by means of an etching process
12/16/2003US6663231 Monolithic nozzle assembly formed with mono-crystalline silicon wafer and method for manufacturing the same
12/16/2003US6662427 Method of forming a cavity structure with a thin bottom base plate
12/11/2003WO2003102966A2 Method of forming atomic force microscope tips
12/11/2003WO2003102549A1 Three-dimensional structural body composed of silicon fine wire, its manufacturing method, and device using same
12/11/2003WO2003101889A1 Mthod of producing micro component
12/11/2003WO2003101888A2 Fluorochemical treatment for silicon articles
12/11/2003WO2003101887A2 Three-dimentional components prepared by thick film technology and method of producing thereof
12/11/2003WO2003101886A2 A method and apparatus for fabricating encapsulated micro-channels in a substrate
12/11/2003US20030228759 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part
12/11/2003US20030228418 Replication of nanoperiodic surface structures
12/11/2003US20030227700 Micro mirror unit and method of making the same
12/11/2003US20030227094 Wafer level packaging of micro electromechanical device
12/11/2003US20030226818 Reaction product of silicon and fluorinated olefin
12/11/2003US20030226604 Method of fabrication of a microfluidic device