Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
09/2004
09/29/2004EP1461828A1 Method of fabricating micro-electromechanical switches on cmos compatible substrates
09/29/2004EP1461287A2 Hybrid mems fabrication method and new optical mems device
09/29/2004EP1461286A1 Differential stress reduction in thin films
09/29/2004EP1255690B1 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
09/29/2004EP1169650B1 Different sacrificial layer thickness under fixed and movable electrodes (capacitive acceleration sensor)
09/29/2004CN1533359A Thin films and producton methods thereof
09/29/2004CN1532137A Method for producing cantilever beam type micro electromechanical system
09/28/2004US6798862 X-ray mask and method for providing same
09/28/2004US6797899 Acceleration switch
09/28/2004US6797631 High sensitive micro-cantilever sensor and fabricating method thereof
09/28/2004US6797589 Insulating micro-structure and method of manufacturing same
09/28/2004US6797211 Mechanical patterning of a device layer
09/23/2004WO2004081263A1 Electroplating pcb components
09/23/2004WO2004080886A1 Mems devices on a nanometer scale
09/23/2004WO2003101887A3 Three-dimentional components prepared by thick film technology and method of producing thereof
09/23/2004US20040186419 Microneedles for minimally invasive drug delivery
09/23/2004US20040184134 Optical modulator, display device and manufacturing method for same
09/23/2004US20040183214 Depositing a sacrificial layer over mechanical structure; depositing a first encapsulation layer over the sacrificial layer; forming vent through the encapsulation layer to expose portion of the sacrificial layer; removing sacrificial layer to form chamber; introducing gas into the chamber; depositing
09/23/2004US20040182716 Method for electrochemically forming structures including non-parallel mating of contact masks and substrates
09/23/2004US20040182713 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure
09/23/2004DE10325206B3 Process for preparation of a structural part in which the specific functional structures, i.e. etching troughs, are formed by anisotropic wet etching useful in production of single crystal semiconductors
09/22/2004EP1460038A2 Electromechanical system having a controlled atmosphere, and method of fabricating same
09/22/2004EP1460036A1 Mems element manufacturing method
09/22/2004EP1460035A1 Electrostatic drive mems element, manufacturing method thereof, optical mems element, optical modulation element, glv device, and laser display
09/22/2004EP0865664B1 Process for anisotropic plasma etching of different substrates
09/21/2004US6795225 Micromirror unit with torsion connector having nonconstant width
09/21/2004US6794737 Spring structure with stress-balancing layer
09/21/2004US6794271 Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
09/21/2004US6794196 Deposited thin films and their use in detection, attachment and bio-medical applications
09/21/2004US6794119 Method for fabricating a structure for a microelectromechanical systems (MEMS) device
09/21/2004US6793974 Selecting a material for use as the expansive element
09/21/2004US6793830 Method for forming a microstructure from a monocrystalline substrate
09/21/2004US6793753 Method of making a microfabricated elastomeric valve
09/21/2004US6792940 Device and method for creating aerosols for drug delivery
09/16/2004WO2004079450A1 Method for manufacturing a patterned structure
09/16/2004WO2004079373A1 Capacitive acceleration sensor
09/16/2004WO2004028952A3 Small scale wires with microelectromechanical devices
09/16/2004US20040180519 Method of making cavities in a semiconductor wafer
09/16/2004US20040180179 Method for making three-dimensional structures having nanometric and micrometric dimensions
09/16/2004US20040178537 Injection molding techniques for forming a microfluidic structure having at least one flash free aperture
09/16/2004US20040178523 Molded waveguides
09/16/2004US20040178171 Sloped trench etching process
09/16/2004DE10308860A1 Separating semiconducting wafers with exposed micromechanical structures into chips involves sawing from front by standard saw blade, cleaning, drying, heating to thermal film transition temperature
09/16/2004DE102004010907A1 Optische Vorrichtung mit Mikrolinsen-Anordnung, sowie Verfahren zu ihrer Herstellung An optical device with micro lens array, and to processes for their preparation
09/16/2004DE102004008334A1 Verfahren zum lokalen Ätzen eines Substrats und Vorrichtung zur Durchführung des Verfahrens A method for locally etching a substrate and apparatus for carrying out the method
09/15/2004EP1456870A2 Resistless lithography method for producing fine structures
09/15/2004EP1456116A1 Method and device for producing a component with a mobile structure
09/15/2004EP1456115A2 Method of dividing a substrate into a plurality of individual chip parts
09/15/2004EP1294635A4 Improved thermal bend actuator
09/14/2004US6791660 Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
09/14/2004US6790787 Structure having narrow pores
09/14/2004US6790779 Anisotropic dry etching technique for deep bulk silicon etching
09/14/2004US6790747 Method and device for controlled cleaving process
09/14/2004US6790377 Method for electrochemical fabrication
09/14/2004US6790372 Microneedle array module and method of fabricating the same
09/14/2004US6789423 Micro inertia sensor and method of manufacturing the same
09/10/2004WO2004077536A1 Production method for antenna and production device for antenna
09/10/2004WO2004076342A1 Separating semiconductor wafers having exposed micromechanical structures into individual chips
09/10/2004WO2004076339A2 Method for manufacturing microstructures having multiple microelements with through-holes
09/10/2004WO2004064090A3 Methods and structure for improving wafer bow control
09/10/2004WO2003101888A3 Fluorochemical treatment for silicon articles
09/10/2004CA2517988A1 Method for manufacturing microstructures having multiple microelements with through-holes
09/09/2004US20040173862 Optical device having micro lens array and method for manufacturing the same
09/09/2004US20040173575 Method of releasing devices from a substrate
09/09/2004DE10308048A1 Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit
09/08/2004EP1453758A2 Adhesiveless microfluidic device fabrication
09/08/2004CN1527793A Method for forming microelectronic spring structures on a substrate
09/08/2004CN1527134A Manufacture of ture 3D microelectronic mechanical system based on composite imprinting photoetched material
09/08/2004CN1526636A Microstructure mold core making technology
09/07/2004US6788840 Bi-stable micro-actuator and optical switch
09/07/2004US6787968 To prevent a polymer cantilever from sticking to the substrate
09/07/2004US6787929 Semiconductor device having a flat protective adhesive sheet
09/07/2004US6787866 Semiconductor device having a moveable member therein and a protective member disposed thereon
09/07/2004US6787384 Functional device, method of manufacturing therefor and driver circuit
09/07/2004US6787187 Micromechanical device fabrication
09/02/2004WO2004016546A3 Layer system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof
09/02/2004US20040171186 Method of protecting microfabricated devices with protective caps
09/02/2004US20040169284 Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer
09/02/2004US20040169003 On substrate; hardness; wear resistance
09/02/2004US20040168613 Composition and method to form a release layer
09/01/2004EP1076826B1 Method for producing micromechanical components
09/01/2004CN1164793C Chemical preparation method of controllable metal nano conductor
08/2004
08/31/2004US6784539 Thermally enhanced semiconductor chip having integrated bonds over active circuits
08/31/2004US6783643 Exposure surface to flux; controlling concentration
08/31/2004US6782900 Methods and apparatus for cleaning and/or treating a substrate using CO2
08/26/2004WO2004072705A1 Bi-stable micro-actuator and optical switch
08/26/2004WO2004071944A1 Method for the production of a component comprising a semiconductor carrier and component
08/26/2004WO2004071943A2 Electronic device and its manufacturing method device
08/26/2004WO2004071942A1 Mems element and method of producing the same, and diffraction type mems element
08/26/2004WO2004071153A2 Method of forming sub-micron-size structures over a substrate
08/26/2004WO2004037712A3 Method for producing a packaged integrated circuit with a microcavity
08/26/2004WO2004033365A3 Method of forming a sensor for detecting motion
08/26/2004US20040166664 Thin film-structure and a method for producing the same
08/26/2004US20040166649 Layer transfer method
08/26/2004US20040166330 Thin film-structure and a method for producing the same
08/26/2004US20040164454 Method for manufacturing microstructures having multiple microelements with through-holes
08/26/2004US20040164368 High reflector tunable stress coating, such as for a MEMS mirror
08/26/2004US20040163226 Method for manufacturing a micro-actuator
08/26/2004DE10306129A1 Production of a component with a semiconductor support used in micro-electronics comprises etching recesses in a porous material to form a thermally coupled region defined by the recesses, and forming a structure over one region
08/26/2004DE10130916B4 Verfahren zum anisotropen Strukturieren von Materialien A method for anisotropic structuring of materials