| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 05/06/2004 | US20040085606 Method for making an optical micromirror and micromirror or array of micromirrors obtained by said method |
| 05/06/2004 | US20040084509 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | EP1416064A2 Method of coating micro-electromechanical devices |
| 05/06/2004 | EP1415810A1 Drop generator die processing |
| 05/06/2004 | EP1415748A2 Method of connecting micro structured component layers suitable for making micro structered components and micro structured component |
| 05/06/2004 | EP1414738A2 Micro-machined ultrasonic transducer (mut) substrate that limits the lateral propagation of acoustic energy |
| 05/06/2004 | EP1414632A1 Injection molding a flash free microfluidic structure |
| 05/06/2004 | EP1414609A2 Etching process for micromachining crystalline materials and devices fabricated thereby |
| 05/06/2004 | CA2503577A1 Method for producing a packaged integrated circuit with a microcavity |
| 05/06/2004 | CA2496777A1 Resonant sensor and sensing system |
| 05/04/2004 | US6730978 Single crystal, dual wafer, tunneling sensor and a method of making same |
| 05/04/2004 | US6730615 High reflector tunable stress coating, such as for a MEMS mirror |
| 05/04/2004 | US6730535 Silicon device manufacturing method, silicon device, and optical component |
| 05/04/2004 | US6730534 Method of manufacturing three-dimensional structure and method of manufacturing oscillator |
| 04/29/2004 | WO2004036623A2 Nanoscopic tunnel and method of making same |
| 04/29/2004 | WO2004036264A2 Polymers, methods of use thereof, and methods of decomposition thereof |
| 04/29/2004 | WO2004003965A3 Mems capping method and apparatus |
| 04/29/2004 | WO2003102966A3 Method of forming atomic force microscope tips |
| 04/29/2004 | WO2003101886A3 A method and apparatus for fabricating encapsulated micro-channels in a substrate |
| 04/29/2004 | WO2003096123A8 Reversal imprint technique |
| 04/29/2004 | US20040082145 Method for joining a silicon plate to a second plate |
| 04/29/2004 | US20040082088 Method for fabricating ESI device using smile and delayed LOCOS techniques |
| 04/29/2004 | US20040081809 Microstructured component and method for its manufacture |
| 04/29/2004 | US20040081802 Component and method of manufacturing same |
| 04/29/2004 | US20040081800 Micro-casted silicon carbide nano-imprinting stamp |
| 04/29/2004 | US20040081798 Hardened nano-imprinting stamp |
| 04/29/2004 | US20040080004 Micromechanical component and corresponding production method |
| 04/29/2004 | US20040079723 Method for fabricating integrated LC/ESI device using SMILE,latent masking, and delayed LOCOS techniques |
| 04/29/2004 | US20040079625 Multi-seal fluid conductor electrical switch device and method of manufacture therefor |
| 04/29/2004 | US20040079277 Method for forming suspended microstructures |
| 04/28/2004 | EP1413923A2 Nano-imprinting stamp |
| 04/28/2004 | EP1412550A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 04/28/2004 | EP0741910B1 Cavity-containing structure and method for making same |
| 04/28/2004 | CN1492508A Semiconductor device with micro electromechanical system |
| 04/27/2004 | US6727181 Etching method and manufacturing method of a structure |
| 04/22/2004 | WO2004033365A2 Method of forming a sensor for detecting motion |
| 04/22/2004 | WO2004033364A2 Methods for forming coatings on mems devices |
| 04/22/2004 | WO2003090985A8 Device and method for transferring a pattern to a substrate |
| 04/22/2004 | WO2003078301A3 Micro-electromechanical systems |
| 04/22/2004 | US20040077178 Method for laterally etching a semiconductor structure |
| 04/22/2004 | US20040077164 Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry |
| 04/22/2004 | US20040077153 Semiconductor substrate, SOI substrate and manufacturing method therefor |
| 04/22/2004 | US20040077119 Mems element manufacturing method |
| 04/22/2004 | US20040076008 Electrostatic drive type mems element, manufacturing method thereof, optical mems element, optical modulation element, glv device, and laser display |
| 04/22/2004 | US20040075522 Microstructure and its fabrication method |
| 04/22/2004 | US20040075514 Microswitch and method of manufacturing the same |
| 04/22/2004 | US20040075073 Method for protecting the diaphragm and extending the life of SiC and/or Si MEMS microvalves |
| 04/22/2004 | US20040074301 Sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched opening at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring |
| 04/22/2004 | DE10247746A1 Production of conducting fine, very fine and micro-structures and other flat constructions on a support used in electronic devices, involves applying conducting particles on the support body and forming a non-conducting layer on its surface |
| 04/21/2004 | EP1411144A1 METHOD FOR FORMING ULTRA−HIGH STRENGTH ELASTIC DIAMOND LIKE CARBON STRUCTURE |
| 04/21/2004 | EP1411025A2 Metal wiring method for an undercut |
| 04/21/2004 | EP1410433A2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 04/20/2004 | US6724208 Probe pin for testing electrical characteristics of apparatus, probe card using probe pins |
| 04/20/2004 | US6723659 Micromirror unit fabrication method and micromirror unit made by the same |
| 04/20/2004 | US6723579 Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer |
| 04/20/2004 | US6723250 Method of producing structured wafers |
| 04/15/2004 | WO2003045837A3 Stress control of semiconductor microstructures for thin film growth |
| 04/15/2004 | WO2003023840A3 Methods and apparatus for cleaning and/or treating a substrate using co¿2? |
| 04/15/2004 | WO2003012491A3 Mems mirror |
| 04/15/2004 | US20040072386 Micromachine manufacturing method |
| 04/15/2004 | US20040071863 Contacting the surface of the MEMS device with one or more precursor compounds of the formula SiXR3, wherein each R is independently an organic group, and X is selected from group of Cl and OR', wherein R' is independently an alkyl group |
| 04/15/2004 | US20040071607 Microsize driving device and method for preparation thereof |
| 04/15/2004 | US20040070888 Micro-actuator for hard-disk drive, and manufacturing process thereof |
| 04/15/2004 | US20040070816 Optical deflector and method of producing same |
| 04/15/2004 | US20040070643 Method of manufacturing microstructure, method of manufacturing liquid discharge head, and liquid discharge head |
| 04/15/2004 | US20040069994 Nanostructure field emission cathode material within a device |
| 04/15/2004 | US20040069742 Fabrication of a reflective spatial light modulator |
| 04/15/2004 | DE10246053A1 Substrate wafer scribing and cutting method, involves deep/depth structuring procedure for separating substrate chips from one another |
| 04/14/2004 | EP1408336A2 Accelerometer with mass support springs having predetermined vibration modes |
| 04/14/2004 | CN1489180A Absolute-dry-method deep-etching micro-mechanical processing method based on silocon-silicon linkage |
| 04/14/2004 | CN1488779A Multipurpose laser electrochemical micromanufacturing apparatus |
| 04/14/2004 | CN1488569A Dry-process deep-etching silicon miero mechanical working method an glass substrate |
| 04/13/2004 | US6720507 Multi-seal fluid conductor electrical switch device |
| 04/13/2004 | US6720268 Method for anisotropic plasma etching of semiconductors |
| 04/13/2004 | US6720267 Method for forming a cantilever beam model micro-electromechanical system |
| 04/13/2004 | US6720201 MEMS device and fabrication method thereof |
| 04/13/2004 | US6719915 Step and flash imprint lithography |
| 04/08/2004 | WO2004030057A1 Glass-type planar substrate, use thereof, and method for the production thereof |
| 04/08/2004 | WO2004028960A2 Method for forming a microstructure from a monocrystalline substrate |
| 04/08/2004 | WO2004028952A2 Small scale wires with microelectromechanical devices |
| 04/08/2004 | WO2004008522A3 Method for producing a component having submerged connecting areas |
| 04/08/2004 | WO2003099707A3 Method of altering the properties of a thin film and substrate implementing said method |
| 04/08/2004 | WO2003079414A3 Optical polymer nanocomposite substrates with surface relief structures |
| 04/08/2004 | WO2003014009A3 A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems |
| 04/08/2004 | WO2003006396B1 Bonding method and product |
| 04/08/2004 | US20040067604 Wafer level packaging technique for microdevices |
| 04/08/2004 | US20040067346 Multiple-level actuators and clamping devices |
| 04/08/2004 | US20040066258 MEMS device with integral packaging |
| 04/08/2004 | US20040065932 Sensor with at least one micromechanical structure and method for production thereof |
| 04/08/2004 | US20040065931 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method |
| 04/08/2004 | US20040065638 Method of forming a sensor for detecting motion |
| 04/08/2004 | US20040065637 Surfactant-enhanced protection of micromechanical components from galvanic degradation |
| 04/08/2004 | US20040065554 Multilayer three-dimensional structure; barrier layer prevent damage due to copper diffusion |
| 04/08/2004 | US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues |
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | US20040065322 Device and method for creating aerosols for drug delivery |
| 04/08/2004 | CA2500359A1 Method for forming a microstructure from a monocrystalline substrate |
| 04/07/2004 | EP1405821A2 Wafer level packaging technique for microdevices |
| 04/06/2004 | US6716767 Contact planarization materials that generate no volatile byproducts or residue during curing |