| Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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| 06/16/2004 | CN1154195C Film-type device and its manufacture |
| 06/15/2004 | US6750083 Method of masking microelectronic semiconductor chips with protective caps |
| 06/15/2004 | US6750078 MEMS switch having hexsil beam and method of integrating MEMS switch with a chip |
| 06/15/2004 | US6750077 Semiconductor device and method of fabricating the same |
| 06/10/2004 | WO2004011368A3 Low temperature anodic bonding method using focused energy for assembly of micromachined systems |
| 06/10/2004 | WO2003106329A3 Microelectromechanical device with integrated conductive shield |
| 06/10/2004 | US20040110318 Method of manufacturing an external force detection sensor |
| 06/09/2004 | EP1427011A1 Method for realizing microchannels in an integrated structure |
| 06/09/2004 | EP1427010A1 Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method |
| 06/09/2004 | EP1426345A1 Borosilicate glass compositions and uses therof |
| 06/09/2004 | EP1425764A2 Bistable magnetic actuator |
| 06/09/2004 | EP1425241A2 Method for the production of a membrane |
| 06/09/2004 | DE10005850B4 Verfahren zur Herstellung von Mikrostrukturen A process for the fabrication of microstructures |
| 06/09/2004 | CN1502545A MEMS encapsulated structure and method of making same |
| 06/08/2004 | US6747800 Optical interference type panel and the manufacturing method thereof |
| 06/08/2004 | US6746890 Three dimensional thin film devices and methods of fabrication |
| 06/08/2004 | US6746819 Article comprising photostructurable polyimide or polyimide mixture for adhesive layer with thickness of <1 mu m between photostructurable epoxy resin and metal or silicon |
| 06/03/2004 | WO2004046018A1 Micro fluid control device and process for producing the same |
| 06/03/2004 | US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 06/03/2004 | US20040106290 Process for forming a buried cavity in a semiconductor material wafer and a buried cavity |
| 06/03/2004 | US20040106069 Process for producing a tool insert for injection molding a part with two-stage microstructures |
| 06/03/2004 | US20040104507 Process for producing a tool insert for injection molding a part with single-stage microstructures |
| 06/03/2004 | DE10143968B4 Verfahren zum Herstellen eines Vakuumbehälters A method of manufacturing a vacuum vessel |
| 06/02/2004 | EP1424309A2 Hardened nano-imprinting stamp |
| 06/02/2004 | EP1423330A2 Method for producing a semiconductor component and associated semiconductor component, especially a membrane sensor |
| 06/02/2004 | CN1152267C Method for producing micro structure |
| 06/01/2004 | US6744334 Phase shifter capable of miniaturizing and method of manufacturing the same |
| 06/01/2004 | US6743653 Micromachine manufacturing method |
| 06/01/2004 | US6743368 Nano-size imprinting stamp using spacer technique |
| 05/27/2004 | WO2004043849A2 Method for production of a component with a micro-joint and component produced by said method |
| 05/27/2004 | WO2003088340A3 Method for the production of structured layers on substrates |
| 05/27/2004 | US20040102708 Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
| 05/27/2004 | US20040102050 Method of patterning the surface of an article using positive microcontact printing |
| 05/27/2004 | US20040102021 Method for microfabricating structures using silicon-on-insulator material |
| 05/27/2004 | US20040101657 Method of microfluidic construction using composite polymer films |
| 05/27/2004 | US20040100677 Spatial light modulators with light blocking/absorbing areas |
| 05/27/2004 | US20040099631 Deep reactive ion etching process and microelectromechanical devices formed thereby |
| 05/27/2004 | DE10253077A1 Producing a micro array, for use in biotechnology applications, comprises using a substrate that is of a material which swells around a deposited protective metal layer pattern to form the well recesses |
| 05/26/2004 | EP1422194A1 Process to fabricate a Tool Insert for Injection Moulding a microstructured Piece |
| 05/26/2004 | EP1422193A1 Process to fabricate a Tool Insert for Injection Moulding a Piece with one-level microstructures |
| 05/26/2004 | EP1422192A1 Process to fabricate a Tool Insert for Injection Moulding a two-level microstructured Piece |
| 05/26/2004 | CN1499289A Microcast carborundum nano embossing mould |
| 05/26/2004 | CN1498776A Rigidified nano stamp die plate |
| 05/25/2004 | US6741377 Reducing contribution of reflected ambient light from inactive areas of microoptical electromechanical apparatus |
| 05/25/2004 | US6740946 Micromechanical device and method of manufacture thereof |
| 05/25/2004 | US6740856 Preformed heating element and method of making |
| 05/25/2004 | US6740542 Method for producing micromachined devices and devices obtained thereof |
| 05/25/2004 | US6740537 Process for fabricating a microelectromechanical optical component |
| 05/25/2004 | US6740368 Beam shaped film pattern formation method |
| 05/25/2004 | US6739193 Micromechanical structure, in particular for an acceleration sensor or yaw rate sensor and a corresponding method for producing the same |
| 05/25/2004 | US6739189 Micro structure for vertical displacement detection and fabricating method thereof |
| 05/21/2004 | WO2004042797A2 Sacrificial compositions, methods of use thereof, and methods of decomposition thereof |
| 05/21/2004 | WO2004042442A1 Method of producing a movable lens structure for a light shaping unit |
| 05/21/2004 | WO2004041918A2 Microstructures and methods of fabrication thereof |
| 05/21/2004 | WO2004041711A1 Method of forming stepped recess |
| 05/20/2004 | US20040097090 Silicon etching method |
| 05/20/2004 | US20040097077 Method and apparatus for etching a deep trench |
| 05/20/2004 | US20040097003 MEMS encapsulated structure and method of making same |
| 05/20/2004 | US20040097001 Corner compensation method for fabricating MEMS and structure thereof |
| 05/20/2004 | US20040095659 Micromirror actuator and method of manufacturing the same |
| 05/20/2004 | US20040094086 Production device and production method for silicon-based structure |
| 05/19/2004 | EP1420438A2 Method and apparatus for etching a deep trench |
| 05/19/2004 | EP1419990A2 Method of forming a via hole through a glass wafer |
| 05/19/2004 | EP1419102A2 Method for producing micro-electromechanical components |
| 05/19/2004 | EP1418977A2 Microneedles for minimally invasive drug delivery |
| 05/19/2004 | DE10251658A1 Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil A method of joining for the production of microstructured components suitable micro-structured component layers, as well as micro-structural component |
| 05/19/2004 | CN1496951A Metal wiring method for undermining |
| 05/19/2004 | CN1150596C Method and device for forming polyparaxylene MEMS |
| 05/18/2004 | US6737729 Anisotropic etching of a semiconductor device using tilted etching holes |
| 05/18/2004 | US6737225 Method of undercutting micro-mechanical device with super-critical carbon dioxide |
| 05/18/2004 | US6736983 Method for producing microcomponents |
| 05/13/2004 | WO2004040318A1 Separator, method for manufacturing same, and analysis system |
| 05/13/2004 | WO2004016036A3 Micromachined ultrasonic transducers and method of fabrication |
| 05/13/2004 | WO2003057619A8 Apparatus and method for nanoscale and microscale mechanical machining and processing |
| 05/13/2004 | US20040092105 Method of forming a via hole through a glass wafer |
| 05/13/2004 | US20040091608 Piezoelectric/electrostrictive device and method of manufacturing same |
| 05/13/2004 | US20040089903 A method is described for producing surface micromechanical structures having a high aspect ratio, a sacrificial layer being provided between a substrate and a function layer, trenches being provided by a plasma etching |
| 05/13/2004 | DE10345368A1 Production of a column-like structure in a substrate surface used as a photonic crystal or semiconductor component, e.g. in optical communication systems, involves determining the final properties of the columns after a first etching step |
| 05/13/2004 | DE10064456B4 Verfahren zur maskenlosen Formation von Metall-Nanostrukturen in dünnen dielektrischen Schichten mittels Bestrahlung mit ultrakurzen Laserimpulsen Method for maskless formation of metal oxide nanostructures in thin dielectric films by irradiation with ultra-short laser pulses |
| 05/12/2004 | EP1417518A1 Stress tuned blazed grating light valve |
| 05/12/2004 | EP1417152A2 Mems and method of manufacturing mems |
| 05/12/2004 | EP1417151A1 Method for the fabrication of suspended porous silicon microstructures and application in gas sensors |
| 05/12/2004 | CN1496333A Fabrication of silicon micro mechanical structures |
| 05/12/2004 | CN1495853A Method and system for mfg. semiconductor device |
| 05/12/2004 | CN1495538A Alignment method of array optical probe scanning integrated circuit photoetching system and its equipment |
| 05/12/2004 | CN1495293A Surfactant enhanced protection method for preventing micromechanical component from electrically ageing |
| 05/11/2004 | US6735008 MEMS mirror and method of fabrication |
| 05/11/2004 | US6734550 In-situ cap and method of fabricating same for an integrated circuit device |
| 05/11/2004 | US6734512 Electrostatic actuator |
| 05/11/2004 | US6733681 Laterally supported handle wafer for through-wafer reactive-ion etch micromachining |
| 05/11/2004 | US6733616 Surface isolation device |
| 05/06/2004 | WO2004038916A2 Micro-electromechanical varactor with enhanced tuning range |
| 05/06/2004 | WO2004038354A2 Resonant sensor and sensing system |
| 05/06/2004 | WO2004037713A1 Method for manufacturing a micro-electromechanical device and micro-electromechanical device obtained therewith |
| 05/06/2004 | WO2004037712A2 Method for producing a packaged integrated circuit with a microcavity |
| 05/06/2004 | WO2004037711A2 Processes for hermetically packaging wafer level microscopic structures |
| 05/06/2004 | US20040087162 Metal sacrificial layer |
| 05/06/2004 | US20040087151 Drop generator die processing |
| 05/06/2004 | US20040087054 Disposable barrier technique for through wafer etching in MEMS |
| 05/06/2004 | US20040085858 Micromachined ultrasonic transducers and method of fabrication |