Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
07/2004
07/22/2004US20040139987 Method for releasing and drying moveable elements of micro-electronic mechanical structures with organic thin film sacrificial layers
07/21/2004EP1438256A2 Stiffened surface micromachined structures and process for fabricating the same
07/20/2004US6765300 Micro-relay
07/20/2004US6765162 Multi-seal fluid conductor electrical switch device and method of manufacture therefor
07/20/2004US6764924 Process for producing a tool insert for injection molding a part with single-stage microstructures
07/15/2004WO2004059725A1 Method of the production of cavities in a silicon sheet
07/15/2004WO2004059704A1 Method of manufacturing an oxide beam
07/15/2004WO2004059177A1 Method for maskless fabrication of self-aligned structures comprising a metal oxide
07/15/2004WO2004017361A3 Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material
07/15/2004WO2004000718A3 Bridges for microelectromechanical structures
07/15/2004WO2003068672A3 Fabrication of ultra-shallow channels for microfluidic devices and systems
07/15/2004US20040136049 Micro-mechanical device having anti-stiction layer and method of manufacturing the device
07/15/2004US20040136044 Coating for optical MEMS devices
07/15/2004US20040135219 Fabrication of silicon micro mechanical structures
07/15/2004US20040135099 Lithographic apparatus and device manufacturing method
07/15/2004US20040134788 electrochemistry; etching; electroplating; photoresists
07/15/2004DE10260860A1 Silicon germanium micro-mechanical layer comprises upper and lower surfaces and doping material whose concentration varies through layer
07/15/2004DE10260859A1 Structured silicon body with directed thermal conductivity properties for sensor insulation, is made porous with selected crystal orientation
07/14/2004EP1436830A1 Method for joining a silicon plate to another plate
07/14/2004EP1436237A1 Bonding method and product
07/14/2004CN1513205A High frequency integrated circuit (HFIC) microsystem assembly and method for fabricatnig the same
07/14/2004CN1511625A Inorganic nano porous film and its forming method
07/13/2004US6762667 Micro electromechanical switch having self-aligned spacers
07/13/2004US6761829 Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
07/08/2004WO2004056698A2 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
07/08/2004WO2004056547A2 Micro-mechanical thermo structure and method for manufacturing such micro-mechanical structure
07/08/2004WO2004043849A3 Method for production of a component with a micro-joint and component produced by said method
07/08/2004WO2004038354A3 Resonant sensor and sensing system
07/08/2004US20040132855 Polymers, methods of use thereof, and methods of decomposition thereof
07/08/2004US20040132227 Methods and structure for improving wafer bow control
07/08/2004US20040131829 Microstructures and methods of fabrication thereof
07/08/2004DE10222964B4 Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile A method for encasing for electronic components and so hermetically encapsulated electronic components
07/07/2004EP1435336A2 Gap tuning for surface micromachined structures in an epitaxial reactor
07/07/2004EP1435335A2 Method for release of surface micromachined structures in an epitaxial reactor
07/07/2004CN1511259A Method for manufacturing silicon sensor and silicon sensor
07/07/2004CN1511253A Armor coated MEMS devices
07/07/2004CN1156897C Method for producing microelectronic structure
07/06/2004US6759734 Miniature device with increased insulative spacing and method for making same
07/06/2004US6759273 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
07/06/2004US6759261 Thin film-structure and a method for producing the same
07/06/2004US6759173 Single mask process for patterning microchip having grayscale and micromachined features
07/06/2004US6758992 Applying to molding surface continuous lines of a flowable, curable resin; contacting resin with a substrate; curing resin; and transferring resin to substrate
07/06/2004US6758983 Staggered torsional electrostatic combdrive and method of forming same
07/06/2004US6758900 Micro three-dimensional structure, production method therefor and production device therefor
07/01/2004WO2003054925A3 Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein
07/01/2004US20040127008 Method for producing integrated microsystems
07/01/2004US20040126953 Processes for hermetically packaging wafer level microscopic structures
07/01/2004US20040126920 Micro inertia sensor and method of manufacturing the same
07/01/2004US20040126707 Performing photolithography on photoresist by using gray-tone mask to form patterned layer; high-selectivity etching by using inductively coupled plasma etching; demolding
07/01/2004US20040125455 Optical interference type panel and the manufacturing method thereof
07/01/2004US20040124566 Dispensing liquid onto substrate; patterning; photopolymerization;curing
07/01/2004US20040124483 Adjust accuracy of gap width; multilayer, substrates, dielectric; etching holes; cleaning residues
07/01/2004US20040124481 Releasing undercoatings; etching; cleaning residues from surface; vaporization of silica; flushing using hydrogen
07/01/2004US20040124092 Inorganic nanoporous membranes and methods to form same
06/2004
06/30/2004EP1434031A2 Mems gyroscope and fabrication method thereof
06/30/2004EP1433199A1 Method for forming a cavity structure on soi substrate and cavity structure formed on soi substrate
06/30/2004EP1433198A2 Methods and apparatus for cleaning and/or treating a substrate using co2
06/29/2004US6757455 Micromachine and manufacturing method therefor
06/29/2004US6756310 Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques
06/29/2004US6756285 Multilayer structure with controlled internal stresses and making same
06/29/2004US6755984 Micro-casted silicon carbide nano-imprinting stamp
06/29/2004US6755982 Self-aligned micro hinges
06/29/2004US6755211 Microfluidic systems with inter-channel impedances
06/24/2004US20040121564 Method of forming semiconductor devices through epitaxy
06/24/2004US20040121066 Stamping a non-linear fluid flow path
06/24/2004DE10257098A1 Creating hermetically sealed, dielectrically isolating trenches for mechanical-electrical sensor structures involves sealing hollows formed when filling by low-pressure deposition from widened regions
06/24/2004DE10257097A1 Verfahren zur Herstellung von mikroelektromechanischen Systemen (Microelectromechanical Systems: MEMS) mittels Silizium-Hochtemperatur-Fusionsbonden A process for the manufacture of micro electromechanical systems (Micro Electro Mechanical Systems: MEMS) using high temperature silicon fusion bonding
06/23/2004EP1431243A1 Device for the encapsulation of integrated microelectromechanical systems and method for its manufacture
06/23/2004EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same
06/23/2004EP1431018A1 Method of producing resin molded product
06/23/2004EP1430498A1 A micromechanical switch and method of manufacturing the same
06/23/2004EP1429992A1 Flexible structure with integrated sensor/actuator
06/23/2004EP1429991A2 A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems
06/23/2004CN1507023A Side welding method for flip-chip semiconductor device
06/23/2004CN1506760A Method for producing micro structure
06/23/2004CN1506297A Manufacture of microstructure with great depth/width ratio
06/22/2004US6753488 Microswitch and method of manufacturing the same
06/22/2004US6753037 Re-coating MEMS devices using dissolved resins
06/22/2004US6752942 Method of forming articles including waveguides via capillary micromolding and microtransfer molding
06/22/2004US6752931 Method for using DRIE with reduced lateral etching
06/17/2004WO2004051744A2 Mems control chip integration
06/17/2004WO2004051739A1 Creation of hermetically sealed, dielectrically isolating trenches
06/17/2004WO2004051230A1 Fine particle handling unit, chip and sensor mounted with same, and methods for separating, capturing and sensing protein
06/17/2004WO2004050575A1 Borosilicate glass compositions and uses thereof
06/17/2004WO2004050546A2 System for sensorless control in a permanent magnet machine
06/17/2004WO2004050545A1 Micromachine and method of producing the same
06/17/2004WO2004021084A3 Decal transfer microfabrication
06/17/2004WO2003088370A3 Hermetic encapsulation of organic electro-optical elements
06/17/2004WO2003083906A3 An integrated circuit-integrated flexible shear-stress sensor skin
06/17/2004US20040115960 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography
06/17/2004US20040115861 Method for integration of microelectronic components with microfluidic devices
06/17/2004US20040115838 Multicompartment microfluidic device comprising elastomeric materials for monitoring receptor/ligand interactions; cell sorting; rational drug design and discovery
06/17/2004US20040115731 Microfluidic protein crystallography
06/17/2004US20040114259 Mirror device, optical switch, thin film elastic structure, and thin elastic structure producing method
06/17/2004US20040113751 Method for producing thin film sensors, especially hot film anemometters and humidity sensors
06/17/2004US20040113732 Bistable magnetic actuator
06/17/2004US20040112878 Method and apparatus for making a minute product using uv laser beam
06/16/2004EP1428255A1 Microelectronic mechanical system and methods
06/16/2004EP1428245A1 Monolithic three-dimensional structures
06/16/2004CN1504832A Lithographic apparatus and device manufacturing method