Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526)
08/2004
08/26/2004CA2514611A1 Bi-stable micro-actuator and optical switch
08/25/2004EP1449810A2 Method for manufacturing micro-electro-mechanical system using solder balls
08/24/2004US6781279 Micro-actuator with interdigitated combs perpendicular to a base
08/24/2004US6781208 Functional device, method of manufacturing therefor and driver circuit
08/24/2004US6780767 Semiconductor component in a wafer assembly
08/24/2004US6780570 Method of fabricating a suspended micro-structure with a sloped support
08/24/2004US6780337 Method for trench etching
08/24/2004US6780336 Methods of fabricating MEMS and microfluidic devices using latent masking technique
08/24/2004US6779247 Selective removal of sacrificial thin film with adhesive side beneath electrical connecting elements to form windows; etching; depositing dielectric covering
08/19/2004WO2004070776A2 Methods for transferring supercritical fluids in microelectronic and other industrial processes
08/19/2004WO2004028960A3 Method for forming a microstructure from a monocrystalline substrate
08/19/2004WO2003076330A3 Silicon carbide microelectromechanical devices with electronic circuitry
08/19/2004WO2002082047A8 High throughput screening of crystallization of materials
08/19/2004US20040161949 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity
08/19/2004US20040161870 Integrated micro electromechanical system encapsulation component and fabrication process of the component
08/19/2004US20040160302 Actuator and switch
08/19/2004US20040159631 Fabrication of a reflective spatial light modulator
08/19/2004DE202004005982U1 Guides for negative structures on an embossing tool used on large area workpieces, comprises a raised ring-shaped edge structure and raised secondary structures around shorter primary structures
08/18/2004EP1274648B1 Micromechanical component and method for producing the same
08/18/2004EP1183566B1 Micromachined electrostatic actuator with air gap
08/17/2004US6777312 Wafer-level transfer of membranes in semiconductor processing
08/17/2004US6777259 Accelerometer protected by caps applied at the wafer scale
08/17/2004US6777258 Conductive etch stop for etching a sacrificial layer
08/17/2004US6776864 Plastic lab-on-a-chip system fabricated by coupling a plastic substrate having a metal pattern with another plastic substrate in a reversible or irreversible way.
08/12/2004WO2004068553A2 Method for forming nanoscale features
08/12/2004WO2004067445A1 Formation of silicon nanostructures
08/12/2004WO2004038916A3 Micro-electromechanical varactor with enhanced tuning range
08/12/2004WO2004021451A3 High-temperature stable metal emitter and method for the production thereof
08/12/2004US20040155306 MEMS device and fabrication method thereof
08/12/2004US20040155017 Method for forming nanoscale features
08/12/2004US20040155011 Method of forming sub-micron-size structures over a substrate
08/12/2004US20040155010 Method for producing optically transparent regions in a silicon substrate
08/12/2004US20040154925 Electrodeposition plating bath; smooth surfaces
08/11/2004EP1444543A1 Digital optical switch apparatus and process for manufacturing same
08/11/2004CN1519588A Substrate and its mfg. method, microlens, substrate, transmitting panel and rear projector
08/10/2004US6775066 Diffractive optical element
08/10/2004US6774533 Electrostatic impact driving microactuator
08/10/2004US6774337 Method for protecting the diaphragm and extending the life of SiC and/or Si MEMS microvalves
08/05/2004WO2004065291A1 Method for treating a structure to obtain an internal space and structure having an internal space
08/05/2004WO2003076331A3 Method for producing micro-mechanical components and components produced according to said method
08/05/2004US20040152580 Borsilicate glass compositions and uses thereof
08/05/2004US20040152228 Method for producing micromechanic sensors and sensors produced by said method
08/05/2004US20040148777 Valve integrally associated with microfluidic liquid transport assembly
08/05/2004DE19935819B4 Relais und Verfahren zu dessen Herstellung Relay and process for its preparation
08/05/2004DE19841964B4 Verfahren zur Einstellung der Ätzgeschwindigkeit beim anisotropen Plasmaätzen von lateralen Strukturen Method for adjusting the etching rate in the anisotropic plasma etching of lateral structures
08/05/2004DE10345962A1 Substrat und Verfahren zum Bilden eines Substrats für eine Fluidausstoßvorrichtung Substrate and method for forming a substrate for a fluid ejection device
08/05/2004DE10344571A1 Verfahren zum Registrieren eines aufgebrachten Materials mit Kanalplattenkanälen und ein Schalter, der unter Verwendung desselben erzeugt wird A method for registering a material applied with channel plate channels and a switch that is generated using the same
08/05/2004DE10315068B3 Sacrificial layer removal method for semiconductor technology using microchannels formed in structured layer for transporting removal medium to sacrificial layer
08/05/2004DE10302544A1 Production of a hard mask on a semiconductor substrate used in the production of integrated circuits comprises forming a hard mask layer on the substrate, forming a photolacquer structure on the hard mask layer, and further processing
08/05/2004DE10297163T5 Betätigungsglied und Schalter Actuator and switch
08/04/2004EP1443017A2 Multi-metal layer MEMS structure and process for making the same
08/04/2004EP1443016A2 Micro-Fabricated device and method of making same
08/04/2004EP1441976A2 Micromechanical component and method for producing same
08/04/2004EP1240529B1 Method for producing micromechanical structures
08/04/2004CN1517743A Optical modulator, display device and its manufacturing method
08/04/2004CN1517216A Substrate for fluid jet device and method for forming substrate
08/04/2004CN1160186C Nano-scale composition, compound structure, its manufacturing and application
08/03/2004US6770569 Low temperature plasma Si or SiGe for MEMS applications
08/03/2004US6770504 Methods and structure for improving wafer bow control
08/03/2004US6770337 Thermal transfer element is configured and arranged for transfer of at least a portion of microstructured layer to receptor while preserving microstructured features of that portion
08/03/2004US6770188 Part fabricating method
08/03/2004US6769444 First assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.
08/03/2004US6769303 Multi-functional micro electromechanical silicon carbide accelerometer
07/2004
07/29/2004WO2004064244A2 Method for releasing and drying moveable elements of micro-electronic mechanical structures with organic thin film sacrificial layers
07/29/2004WO2004064090A2 Methods and structure for improving wafer bow control
07/29/2004WO2004063089A2 Recessed microstructure device and fabrication method thereof
07/29/2004WO2004062899A2 Method for manufacturing of polymer micro needle array with liga process
07/29/2004WO2004027460A3 Replication and transfer of microstructures and nanostructures
07/29/2004US20040147124 Non-conformable masks and methods and apparatus for forming three-dimensional structures
07/29/2004US20040147057 Method for producing a semiconductor component and a semiconductor component produced according to this method
07/29/2004US20040147056 Micro-fabricated device and method of making
07/29/2004US20040146810 Process for forming and acoustically connecting structures on a substrate
07/29/2004US20040146803 sacrificial polymer that undergoes acid-catalyzed decomposition and a catalytic amount of a photoacid generator
07/29/2004US20040146705 Fluid control device and method of manufacturing the same
07/29/2004US20040146611 Mold structure of photoresist or polydimethylsiloxane; high speed ; easily separated from substrate; forming electrodes
07/29/2004US20040145811 Optical-interference type reflective panel and method for making the same
07/29/2004US20040145056 Multi-metal layer MEMS structure and process for making the same
07/29/2004CA2512699A1 Methods and structure for improving wafer bow control
07/28/2004EP1441561A2 Process for forming and acoustically connecting structures on a substrate
07/28/2004EP1440931A1 Method for manufacturing metal microstructure
07/28/2004EP1440465A1 Contact planarization materials that generate no volatile byproducts or residue during curing
07/28/2004EP1440322A1 Micro-sensor
07/28/2004EP1440308A1 A microfluidic device and manufacture thereof
07/28/2004EP1440034A2 Method for producing cavities having an optically transparent wall
07/28/2004EP1392484A4 High throughput screening of crystalization of materials
07/28/2004CN1516257A CMOS circuit and body silicon micromechanical system integraled method
07/28/2004CN1159208C Manufacture of integrated minuature movable silicon mechanical-structure on galss substrate
07/27/2004US6768628 Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
07/27/2004US6768181 Micro-machined electromechanical sensors (MEMS) devices
07/27/2004US6767614 Multiple-level actuators and clamping devices
07/27/2004US6767341 Microneedles for minimally invasive drug delivery
07/22/2004WO2004060793A1 Multilayer structure and method for manufacturing same, functional structure and method for manufacturing same, and mask for electron beam exposure and method for manufacturing same
07/22/2004WO2004060792A2 Method of forming semiconductor devices through epitaxy
07/22/2004WO2004037711A3 Processes for hermetically packaging wafer level microscopic structures
07/22/2004WO2004006278A3 Nanostructure field emission cathode
07/22/2004WO2003083952A3 Device and sensor for receiving light signals and method for the production thereof
07/22/2004US20040141894 Micromirror unit fabrication method and micromirror unit made by the same
07/22/2004US20040141027 Substrate and method of forming substrate for fluid ejection device
07/22/2004US20040140532 Dicing tape and die ejection method
07/22/2004US20040140187 Method for registering a deposited material with channel plate channels, and switch produced using same