Patents
Patents for H01J 37 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof (46,866)
10/2001
10/25/2001WO2001079810A1 Focused ion beam apparatus and piece sample pick-up method
10/25/2001WO2001079585A1 Dlc layer system and method for producing said layer system
10/25/2001WO2001040532A3 Gas cluster ion beam low mass ion filter
10/25/2001WO2001038597A3 Method for regulating sputtering processes
10/25/2001WO2001031683A8 Plasma doping system comprising a hollow cathode
10/25/2001WO2001026141A3 Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
10/25/2001US20010033683 Method of inspecting a pattern and an apparatus thereof and a method of processing a specimen
10/25/2001US20010033217 Method of cooling an induction coil
10/25/2001US20010033128 Gas cluster ion beam low mass ion filter
10/25/2001US20010032939 Multi-column FIB for nanofabrication applications
10/25/2001US20010032938 Through-the-lens-collection of secondary particles for a focused ion beam system
10/25/2001US20010032937 System and method for uniformity enhancement during ion implantation
10/25/2001US20010032936 Ion beam processing position correction method
10/25/2001US20010032931 Charged particle beam instrument
10/25/2001US20010032783 Vault shaped target and magnetron having both distributed and localized magnets
10/25/2001US20010032708 Electrode plate for plasma etching equipment for forming uniformly-etched surface
10/25/2001US20010032707 Dry etching system for patterning target layer at high reproducibility and method of dry etching used therein
10/25/2001US20010032705 Local etching apparatus and local etching method
10/25/2001US20010032591 Magnetic barrier for plasma in chamber exhaust
10/25/2001US20010032590 Magnetic barrier for plasma in chamber exhaust
10/25/2001DE10018858A1 Magnetron including open, sputtering target, transfers heat to cooling plate by thermal radiation
10/25/2001DE10018143A1 Layer system used for the wear protection, corrosion protection and for improving the sliding properties of machine parts consists of an adhesion layer, a transition layer and a covering layer arranged on a substrate
10/25/2001DE10018015A1 Arrangement for carrying out plasma-based process especially for ionised physical vapour deposition (IPVD) for metal deposition in microelectronics components manufacture
10/25/2001DE10010766A1 Verfahren und Vorrichtung zur Beschichtung von insbesondere gekrümmten Substraten Method and apparatus for coating in particular curved substrates
10/24/2001EP1148533A2 Method and apparatus for cleaning parts of a deposition system or etching wafers
10/24/2001EP1147544A2 Rf plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
10/24/2001EP1147242A1 Large area plasma source
10/24/2001EP1147241A1 Diffusion bonded sputter target assembly and method of making same
10/24/2001CN1319247A Low contaminatino, high density plasma etch chamber and method for making the same
10/24/2001CN1319144A Steel sheet for heat shrink band and method for producing the same
10/24/2001CN1318862A Large workpiece plasma processor
10/24/2001CN1318850A Method for cooling inductive coil
10/23/2001US6307312 Immersion lens and electron beam projection system using the same
10/23/2001US6307209 Pattern-transfer method and apparatus
10/23/2001US6307205 Omega energy filter
10/23/2001US6306779 Method for nano-structuring amorphous carbon layers
10/23/2001US6306267 Forming tunnel-shaped magnetic fluxes on target; forming electric field between target and belt-shaped substrate; conveying belt-shaped substrate while reciprocating tunnel-shaped magnetic fluxes in direction of conveying
10/23/2001US6306265 High-density plasma for ionized metal deposition capable of exciting a plasma wave
10/23/2001US6306247 Apparatus and method for preventing etch chamber contamination
10/23/2001US6306246 Dual window optical port for improved end point detection
10/23/2001US6306245 Plasma etching apparatus
10/23/2001US6306244 Apparatus for reducing polymer deposition on substrate support
10/23/2001US6305390 Stabilization; inert gas flow; varying pressure
10/23/2001US6305316 Integrated power oscillator RF source of plasma immersion ion implantation system
10/23/2001US6305315 ECR plasma apparatus
10/18/2001WO2001078105A1 Reaction chamber with at least one hf feedthrough
10/18/2001WO2001078104A1 Method and apparatus for real-time correction of resist heating in lithography
10/18/2001WO2001078103A2 Bi-directional electron beam scanning apparatus
10/18/2001WO2001078102A2 Plasma energy control by inducing plasma instability
10/18/2001WO2001078101A2 Method and apparatus for plasma processing
10/18/2001WO2001077405A1 Magnetron sputtering source with improved target utilization and deposition rate
10/18/2001WO2001077402A2 Method and apparatus for magnetron sputtering
10/18/2001WO2001026133A3 High transmission, low energy beamline apparatus for ion implanter
10/18/2001US20010031557 Electrode for plasma processes and method for manufacture and use thereof
10/18/2001US20010031542 Thin film forming method, thin film forming apparatus and solar cell
10/18/2001US20010031407 Charged-particle-beam microlithography methods including chip-exposure sequences for reducing thermally induced lateral shift of exposure position on the substrate
10/18/2001US20010031310 Plasma treatment apparatus
10/18/2001US20010030294 Method and an apparatus of an inspection system using an electron beam
10/18/2001US20010030289 Methods, based on a genetic algorithm, for configuring parameters of an array of multiple components for cooperative operation to achieve a desired performance result
10/18/2001US20010030287 Method of observing image and scanning electron microscope
10/18/2001US20010030123 Sputtering method utilizing an extended plasma region
10/18/2001US20010030026 Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
10/18/2001US20010030025 Plasma treatment method and apparatus
10/18/2001US20010030024 Plasma-enhanced processing apparatus
10/18/2001US20010029893 Deposited film forming apparatus and deposited film forming method
10/18/2001US20010029891 Apparatus and method for forming ultra-thin film of semiconductor device
10/18/2001DE10115937A1 Verdampfer zum Erzeugen von Speisegas für eine Lichtbogenkammer Evaporator for generating feed gas for an arc chamber
10/18/2001DE10014587A1 Sealing of pores in structural components, especially of plasma reactors for the manufacture and processing of semiconductor wafers, with a polyimide
10/17/2001EP1146569A2 Thin film forming method, thin film forming apparatus and solar cell
10/17/2001EP1146549A1 Method and device for ion implanting
10/17/2001EP1146546A2 Electrostatic chuck for ion injector
10/17/2001EP1146543A2 High-density plasma source for ionized metal deposition
10/17/2001EP1146139A1 Sputtering apparatus
10/17/2001EP1145759A1 Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
10/17/2001EP1145411A2 Power supplies having protection circuits
10/17/2001EP1145278A1 Cathode having variable magnet configuration
10/17/2001EP1145277A1 Gas injection system for plasma processing
10/17/2001EP1145276A1 Method and apparatus for etch rate stabilization
10/17/2001EP1145275A1 Apparatus and method for monitoring and tuning an ion beam in ion implantation apparatus
10/17/2001EP1145274A1 Particle optical apparatus
10/17/2001EP1145273A2 Low contamination high density plasma etch chambers and methods for making the same
10/17/2001EP1145272A2 Improved alignment of a thermal field emission electron source and application in a microcolumn
10/17/2001EP1145269A2 Method for generating a pulsed electron beam and a trigger plasma source for carrying out said method
10/17/2001EP1144989A1 Nanotomography
10/17/2001EP1144987A1 Method of determining the charge carrier concentration in materials, notably semiconductors
10/17/2001EP1144735A1 Method and apparatus for low energy electron enhanced etching and cleaning of substrates
10/17/2001EP1144722A1 Improved corrosion resistant coating
10/17/2001EP1144717A1 Enhanced plasma mode, method, and system for plasma immersion ion implantation
10/17/2001EP1144714A1 Method and device for coating substrates by means of bipolar pulse magnetron sputtering and the use thereof
10/17/2001EP1144713A1 High target utilization magnetic arrangement for a truncated conical sputtering target
10/17/2001EP0880795B1 Process for control of the energy distribution in bipolar low-pressure glow processes
10/17/2001EP0826221B1 Electron bombardment installation
10/17/2001EP0700578B1 Intraoperative electron beam therapy system and facility
10/16/2001US6304036 System and method for initiating plasma production
10/16/2001US6303932 Method and its apparatus for detecting a secondary electron beam image and a method and its apparatus for processing by using focused charged particle beam
10/16/2001US6303930 Coordinating optical type observing apparatus and laser marking method
10/16/2001US6303044 Method of and apparatus for detecting and controlling in situ cleaning time of vacuum processing chambers
10/16/2001US6302995 Local etching apparatus
10/16/2001US6302966 Temperature control system for plasma processing apparatus
10/16/2001US6302057 Apparatus and method for electrically isolating an electrode in a PECVD process chamber