Patents
Patents for H01J 37 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof (46,866)
02/2004
02/19/2004WO2004015157A2 Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission
02/19/2004WO2003096747A3 Plasma heating apparatus and methods
02/19/2004WO2003081286A3 Swinging objectif retarding immersion lens electron optics focusing, deflection and signal collection system and method
02/19/2004WO2003055287A3 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression
02/19/2004WO2003038858A8 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
02/19/2004WO2002071631A3 Apparatus and method of improving impedance matching between an rf signal and a multi-segmented electrode
02/19/2004US20040033425 Irradiating with at least one beam of molecules, at least one beam of photons and at least one beam of electrons
02/19/2004US20040033385 Erosion-resistant components for plasma process chambers
02/19/2004US20040032574 Lithographic projection apparatus, device manufacturing method, and device manufacturing thereby
02/19/2004US20040032212 Power supply apparatus for generating plasma
02/19/2004US20040032211 Radio frequency ion source
02/19/2004US20040031936 Fine stencil structure correction device
02/19/2004US20040031935 Thermoelectron generating source and ion beam radiating apparatus with the same
02/19/2004US20040031934 System and method for monitoring ion implantation processing
02/19/2004US20040031933 Electron filter for current implanter
02/19/2004US20040031921 Electron microscope
02/19/2004US20040031699 Monitoring and analyzing signals generated by high energy current density in semiconductor substrates using computer programs, to prevent damage
02/19/2004US20040031680 One or more shields for use in a sputter reactor
02/19/2004US20040031677 Vapor deposition of nitride layers on substrates, by feeding gases into vacuum chambers containing sputtering targets and coils, then applying power; nitriding
02/19/2004US20040031566 Plasma processing apparatus and method
02/19/2004US20040031565 Gas distribution plate for processing chamber
02/19/2004US20040031564 Alumina, zirconium silicate, feldspar, pottery stone, siliceous limestone, kaolin, gairome clay (Japan), and black soil; compressed into blocks, dehydrated; storing thermal energy after being roasted for a short time, releasing the energy to produce progressive temperature rise; skin rehabilitation
02/19/2004DE10234861A1 Process and device for alternate deposition of two different materials by cathodic atomization for electronic multilayers and micromechanics uses two part target and alternate excitation
02/18/2004EP1389797A2 Particle-optical apparatus, electron microscopy system and electron lithography system
02/18/2004EP1389796A2 Particle optical device and method for its operation
02/18/2004EP1389795A2 Electron microscopy system and electron microscopy method
02/18/2004EP1389794A2 Beam guiding system, imaging method, and system for electron microscopy
02/18/2004EP1389793A2 Electron microscopy system
02/18/2004CN1476627A Method of measuring performance of scanning electron microscope
02/18/2004CN1476057A Plasma processor and variable impedance apparatus correcting method
02/18/2004CN1475786A Manufacturing method of electronic microscope fixed point test piece
02/18/2004CN1475599A Laser CVD apparatus and laser CVD method
02/18/2004CN1139108C Ion dosing device and method for ion-beam injector
02/18/2004CN1138977C Equipment and method for directly observing water-contained biologic sample in ambient scanning electronic microscope
02/18/2004CN1138863C Steel sheet for heat shrink band and method for producing the same
02/18/2004CN1138648C Diamond marking
02/17/2004US6693289 Operationally positionable source magnet field
02/17/2004US6693288 Charged particle beam irradiation apparatus and irradiation method using the apparatus
02/17/2004US6693282 Particle-optical apparatus including a particle source that can be switched between high brightness and large beam current
02/17/2004US6693278 Particle-optical inspection device especially for semiconductor wafers
02/17/2004US6693023 Ion implantation method and ion implantation equipment
02/17/2004US6692877 Mask for beam exposure having membrane structure and stencil structure and method for manufacturing the same
02/17/2004US6692649 Inductively coupled plasma downstream strip module
02/17/2004US6692624 Vacuum coating apparatus
02/17/2004US6692623 Vacuum arc vapor deposition apparatus and vacuum arc vapor deposition method
02/17/2004US6692622 Plasma processing apparatus with an electrically conductive wall
02/17/2004US6692619 High-saturation magnetization; magnetron co-sputtering of two or more kinds of materials; uniform thickness; magnetic recording media
02/17/2004US6692617 Sustained self-sputtering reactor having an increased density plasma
02/17/2004US6692568 Sputtering a group iii metal in a nitrogen or ammonia environment and depositing it on a growth surface
02/12/2004WO2004013889A1 Process for electron sterilization of a container
02/12/2004WO2004013696A1 Pattern size correcting device and pattern size correcting method
02/12/2004WO2004013692A2 System and method for maskless lithography using an array of sources and an array of focusing elements
02/12/2004WO2004013661A2 Methods and apparatus for preparing specimens for microscopy
02/12/2004WO2004013374A2 Device and method for coating substrates
02/12/2004WO2004013373A2 Apparatus and method to control bias during sputtering
02/12/2004WO2004013371A2 Method and apparatus for plasma implantation without deposition of a layer of byproduct
02/12/2004US20040029384 Method and apparatus for production of metal film or the like
02/12/2004US20040029379 Thin film forming method and thin film forming device
02/12/2004US20040029339 Plasma processing apparatus and plasma processing method
02/12/2004US20040029046 Process control; forming semiconductor; generating backscattering electrons; scanning; controlling deflection
02/12/2004US20040029022 Compact design; rotating adjustment of optics; forming image; calibration
02/12/2004US20040028837 Supplying gases; vacuum enclosure; adjustable magnets
02/12/2004US20040028272 Pattern inspection method and apparatus using electron beam
02/12/2004US20040028168 Method and device for checking and examining the inside surface of nuclear and thermonuclear assemblies
02/12/2004US20040027781 Low loss RF bias electrode for a plasma reactor with enhanced wafer edge RF coupling and highly efficient wafer cooling
02/12/2004US20040027302 Radial antenna and plasma processing apparatus comprising the same
02/12/2004US20040027293 Plasma generator
02/12/2004US20040027209 Fixed matching network with increased match range capabilities
02/12/2004US20040026634 Electron beam proximity exposure apparatus
02/12/2004US20040026633 Inspection method and inspection apparatus using electron beam
02/12/2004US20040026629 Emission source having carbon nanotube, electron microscope using this emission source, and electron beam drawing device
02/12/2004US20040026628 Device and method for moving an ion source
02/12/2004US20040026627 Electron beam monitoring sensor and electron beam monitoring method
02/12/2004US20040026621 Particle detectors
02/12/2004US20040026619 Method and apparatus for extracting three-dimensional spacial data of object using electron microscope
02/12/2004US20040026412 Method and device for plasma treatment of moving metal substrates
02/12/2004US20040026386 Method for improving ash rate uniformity in photoresist ashing process equipment
02/12/2004US20040026372 Plasma treatment method and apparatus
02/12/2004US20040026368 Monitoring substrate processing by detecting reflectively diffracted light
02/12/2004US20040026242 Such as attachment of octadecyl thiol to titanium
02/12/2004US20040026241 Device for amplifying the current of an abnormal electrical discharge and system for using an abnormal electrical discharge comprising one such device
02/12/2004US20040026240 Sputtering apparatus and sputter film deposition method
02/12/2004US20040026235 System and apparatus for control of sputter deposition process
02/12/2004US20040026234 Method and device for continuous cold plasma deposition of metal coatings
02/12/2004US20040026233 Active magnetic shielding
02/12/2004US20040026231 Connecting circuits; radio frequency for generating a plasma; low impedance capacitance coupling
02/12/2004US20040026040 Plasma processing apparatus
02/12/2004US20040026039 Microwave plasma processing apparatus, microwave processing method and microwave feeding apparatus
02/12/2004US20040026038 Plasma treatment apparatus
02/12/2004US20040026035 Method and apparatus for 2-d spatially resolved optical emission and absorption spectroscopy
02/12/2004US20040026028 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles
02/12/2004US20040025791 Etch chamber with dual frequency biasing sources and a single frequency plasma generating source
02/12/2004US20040025790 Apparatus for supplying cooling gas in semiconductor device manufacturing equipment
02/12/2004US20040025788 Plasma processing device and exhaust ring
02/12/2004US20040025786 Substrate processing apparatus and reaction container
02/12/2004DE10235455A1 Magnetic field particle optical device for using a magnetic field to deflect charged particles in a beam has a magnetic-flux-conducting body, a current conductor and a temperature moderator
02/12/2004DE10234862A1 Process for magnetron sputtering for depositing thin layers for coating glass, plastic films, metals, electrical components and other substrates comprises initially impinging a magnetron source and/or partial target with a magnetic field
02/12/2004DE10234859A1 Einrichtung und Verfahren zum Beschichten von Substraten Apparatus and method for coating substrates
02/12/2004DE10234858A1 Device for producing a magnetron discharge, especially for magnetron sputtering, in the coating of substrates has a unit producing a magnetic field having a fixed position relative to the outer target limit in the region of the outer pole
02/12/2004DE10234856A1 Coating device for depositing layers of alloys, mixtures or reaction products of different materials by magnetron sputtering has a target made from concentrically arranged partial targets each made from the material to be deposited