Patents
Patents for H01J 37 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof (46,866)
01/2007
01/24/2007EP1746181A2 Improved magnetron sputtering system for large-area substrates
01/24/2007EP1746178A2 Device for improving plasma activity in PVD-reactors
01/24/2007EP1745492A1 Multi-column charged particle optics assembly
01/24/2007EP1665324B1 Electron cyclotron resonance (ecr) plasma source having a linear plasma discharge opening
01/24/2007EP1222679B1 Method and apparatus for controlling wafer uniformity using spatially resolved sensors
01/24/2007CN1902737A Substrate processing apparatus
01/24/2007CN1902732A Edge flow faceplate for improvement of cvd film properties
01/24/2007CN1902728A 离子源控制系统 Ion source control system
01/24/2007CN1901136A Multiple cathode pulse arc plasma source device
01/24/2007CN1900364A Method for removal of copper oxide film from substrate processing surface
01/24/2007CN1296975C Processing apparatus for plasma
01/24/2007CN1296925C Displacement detecting method, displacement detecting device and recording device of information recording medium original disk
01/23/2007US7166965 Waveguide and microwave ion source equipped with the waveguide
01/23/2007US7166854 Uniformity control multiple tilt axes, rotating wafer and variable scan velocity
01/23/2007US7166840 Method for determining depression/protrusion of sample and charged particle beam apparatus therefor
01/23/2007US7166836 Ion beam focusing device
01/23/2007US7166535 Plasma etching of silicon carbide
01/23/2007US7166524 Method for ion implanting insulator material to reduce dielectric constant
01/23/2007US7166480 Particle control device and particle control method for vacuum processing apparatus
01/23/2007US7166233 Introducing process gas into reactor chamber, creating plasma within chamber by establishing an RF electromagnetic field within chamber and allowing the field to interact with the process gas
01/23/2007US7166200 Method and apparatus for an improved upper electrode plate in a plasma processing system
01/23/2007US7166199 Magnetron sputtering systems including anodic gas distribution systems
01/23/2007US7166170 Cylinder-based plasma processing system
01/23/2007US7166167 Laser CVD device and laser CVD method
01/23/2007US7166166 Method and apparatus for an improved baffle plate in a plasma processing system
01/23/2007US7165506 Method and device for plasma-treating the surface of substrates by ion bombardment
01/18/2007WO2006097804A3 System and process for high-density,low-energy plasma enhanced vapor phase epitaxy
01/18/2007WO2006014862A3 Plasma nozzle array for providing uniform scalable microwave plasma generation
01/18/2007US20070012659 High aspect ratio etch using modulation of RF powers of various frequencies
01/18/2007US20070012657 Plasma spraying liquid crystalline polymer on surface of component by feeding liquid crystalline polymer powder into plasma flame to form molten or heat-softened particles, where liquid crystalline polymer particles form plasma sprayed coating on outermost surface of component; minimizes contamination
01/18/2007DE102006030837A1 Method and apparatus for writing a pattern on a work piece for large scale ICs uses a variable shaped electron beam and has selector unit to adjust beam according to input data and a beam writing unit
01/18/2007DE102006030555A1 Electron beam drift correction method for semiconductor microlithography, by periodically correcting drift, and correcting whenever value of interference factor exceeds predetermined level
01/17/2007EP1744348A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
01/17/2007EP1744347A1 Enhanced magnetron sputtering target
01/17/2007EP1744346A1 Magnetron sputtering system for large-area substrates having removable anodes
01/17/2007EP1744345A1 Multi chamber plasma process system
01/17/2007EP1744344A1 Electric-magnetic field generating element and assembling method for same
01/17/2007EP1235945A4 Rotating magnet array and sputter source
01/17/2007CN1898783A Plasma processing apparatus
01/17/2007CN1898774A Small volume process chamber with hot inner surfaces
01/17/2007CN1898767A Dual frequency RF match
01/17/2007CN1896315A Ion beam etching method and ion beam etching apparatus
01/17/2007CN1896301A Sputtering source, device comprising the sputtering source and method of producing flat panels
01/17/2007CN1295754C Method and system for single ion implantation
01/16/2007US7164236 Method and apparatus for improved plasma processing uniformity
01/16/2007US7164142 Electrical feed-through structure and method
01/16/2007US7164141 Charged particle beam photolithography machine, standard substrate for correcting misalignment factor of charged particle beam photolithography machine, correcting method for charged particle beam photolithography machine, and method of manufacturing electronic device
01/16/2007US7164129 Method and device for observing a specimen in a field of view of an electron microscope
01/16/2007US7164128 Method and apparatus for observing a specimen
01/16/2007US7164127 Scanning electron microscope and a method for evaluating accuracy of repeated measurement using the same
01/16/2007US7164126 Method of forming a sample image and charged particle beam apparatus
01/16/2007US7164125 RF quadrupole systems with potential gradients
01/16/2007US7163607 Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system
01/16/2007US7163603 Plasma source assembly and method of manufacture
01/16/2007US7163602 Apparatus for generating planar plasma using concentric coils and ferromagnetic cores
01/16/2007US7163585 Method and apparatus for an improved optical window deposition shield in a plasma processing system
01/11/2007WO2007003488A1 A module for coating both sides of a substrate in a single pass
01/11/2007WO2007003473A1 Reactor for carrying out an etching method for a stack of masked wafers and an etching method
01/11/2007US20070010099 Method of pattern etching a silicon-containing hard mask
01/11/2007US20070010095 Surface treatment method using ion beam and surface treating device
01/11/2007US20070009670 Sputter method or device for the production of natural voltage optimized coatings
01/11/2007US20070007660 Mask etch processing apparatus
01/11/2007US20070007129 Universal vacuum coupling for cylindrical target
01/11/2007US20070007128 Silicon film forming apparatus
01/11/2007US20070007124 Back-biased face target sputtering based memory with low oxygen flow rate
01/11/2007US20070006971 Plasma generation and control using a dual frequency rf source
01/11/2007DE202006008098U1 Irradiation or illumination unit has radiators, especially infrared (IR), UV or other light sources for heating modules for heat treatment of plastics or metals
01/11/2007DE19734059B4 Anordnung für Schattenwurflithographie Arrangement of shadows lithography
01/10/2007EP1741128A2 Gas distribution system having fast gas switching capabilities
01/10/2007EP1741124A2 Segmented baffle plate assembly for a plasma processing system
01/10/2007EP1144735A4 Method and apparatus for low energy electron enhanced etching and cleaning of substrates
01/10/2007EP1040500A4 A plasma generating apparatus having an electrostatic shield
01/10/2007EP0976141B1 Apparatus and method for controlling ion energy and plasma density in a plasma processing system
01/10/2007CN1894767A Fault detection and control methodologies for ion implantation processes, and system for performing same
01/10/2007CN1894763A Method and apparatus for extracting ions from an ion source for use in ion implantation
01/10/2007CN1894590A Method for toolmatching and troubleshooting a plasma processing system
01/10/2007CN1894086A Unit for the continuous treatment of the surface of objects, and treatment method
01/10/2007CN1892987A Systems and methods for implant dosage control, and wafer implantation method by using ion beam
01/10/2007CN1892980A Chamber isolation valve RF grounding
01/10/2007CN1891854A Apparatus and method for partial implantation using wide beam
01/10/2007CN1294637C Apparatus equiped with clamping chuck and matching box
01/10/2007CN1294615C Method of fabricating coated process chamber component
01/10/2007CN1294614C Ion source, ion injection equipment, manufacturing method of semiconductor device
01/09/2007US7161788 Low voltage modular room ionization system
01/09/2007US7161352 Beam current measuring device and apparatus using the same
01/09/2007US7161162 Electron beam pattern generator with photocathode comprising low work function cesium halide
01/09/2007US7161161 Uniformity control using multiple fixed wafer orientations and variable scan velocity
01/09/2007US7161159 Dual beam system
01/09/2007US7161158 System and method for fast focal length alterations
01/09/2007US7161112 Toroidal low-field reactive gas source
01/09/2007US7160742 Methods for integrated implant monitoring
01/09/2007US7160655 In a middle portion of a wafer the mask is die-by-die aligned based on marks provided at the chips, while in the second region outside of the first the coordinates of the respective chip are decided by a global alignment method based on detection of alignment marks of the first step
01/09/2007US7160616 DLC layer system and method for producing said layer system
01/09/2007US7160475 Fabrication of three dimensional structures
01/09/2007US7159537 Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
01/09/2007US7159536 Device and method for generating a local by micro-structure electrode dis-charges with microwaves
01/04/2007WO2007002330A1 Sputtering target with slow-sputter layer under target material
01/04/2007WO2007001900A1 System and method for positioning an object
01/04/2007WO2007001321A1 Atom probe electrode treatments
01/04/2007WO2007001313A1 A method and apparatus for process control in time division multiplexed (tdm) etch processes