Patents
Sitemap › G03 - Photography; Cinematography; Analogous techniques using waves other than optical waves; Electrography; Holography › G03F - Photomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; Materials therefor; Originals therefor; Apparatus specially adapted therefor › G03F 7 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
Patents for G03F 7 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (127,176)
10/2003
10/02/2003US20030183787 EUV radiation source
10/02/2003US20030183778 Electron beam exposure apparatus and electron beam deflection apparatus
10/02/2003US20030183773 Electron beam exposure system and electron lens
10/02/2003US20030183251 Process for drying an object having microstructure and the object obtained by the same
10/02/2003US20030183167 Substrate processing apparatus and slit nozzle
10/02/2003US20030183107 Image recorder and image recording method
10/02/2003US20030183106 Positive heat-sensitive lithographic printing plate
10/01/2003EP1349201A1 Observation device and its manufacturing method, exposure device, and method for manufacturing micro device
10/01/2003EP1349011A2 Exposure apparatus
10/01/2003EP1349010A1 Lithographic apparatus and device manufacturing method
10/01/2003EP1349009A2 Lithographic apparatus and device manufacturing method
10/01/2003EP1349008A1 Lithographic apparatus and device manufacturing method
10/01/2003EP1349007A1 Photosensitive Paste
10/01/2003EP1349006A1 Photopolymerizable composition sensitized for the wavelength range from 300 to 450 nm.
10/01/2003EP1349005A1 Photosensitive compound, resin and composition
10/01/2003EP1349004A1 Preparation of a flexographic printing plate
10/01/2003EP1349003A2 Method and apparatus for performing rule-based gate shrink utilizing dipole illumination
10/01/2003EP1349002A2 Method and apparatus for decomposing semiconductor device patterns into phase and chrome regions for chromeless phase lithography
10/01/2003EP1348659A2 Device for processing of a strip-shaped workpiece
10/01/2003EP1348543A2 Sheet material fixing device
10/01/2003EP1348150A1 Method of measuring overlay
10/01/2003EP1348149A1 Method of measuring alignment of a substrate with respect to a reference alignment mark
10/01/2003EP0965885B1 Inorganic-containing photosensitive resin composition and method for forming inorganic pattern
10/01/2003EP0961953B1 Chemical microreactors and method for producing same
10/01/2003CN1445820A Film forming method and device manufactured by the method and manufacturing method of device
10/01/2003CN1445819A Folded vernier pattern and measurement method for measuring alignment accuracy rating between overlapped multiple layers
10/01/2003CN1445818A Multiple-layer type dielectric antireflection layer and its forming method
10/01/2003CN1445613A Method for manufacturing photoetching apparatus and device
10/01/2003CN1445612A Method for manufacturing photoetching equipment and device
10/01/2003CN1445611A 曝光方法及装置 Exposure method and apparatus
10/01/2003CN1445610A Improved lighting system for micro-offset printing
10/01/2003CN1445609A Method for manufacturing offset printing apparatus and device
10/01/2003CN1445607A 1,2-naphthoaguinone-2-diazidosulfonate photosenisitizer, method for preparing the photosensitizer and photoresist composition
10/01/2003CN1445606A Photosensitive microcapsule containing synthetic viscosity improver in continuous phase
10/01/2003CN1445605A Method for manufacturing device, manufactured device and affset printing device
10/01/2003CN1445604A Low cost photo etching technique
10/01/2003CN1445586A Mould for forming optical panel and its production process and using
10/01/2003CN1445315A Ray sensitive compasition for preparing insulation film and display
10/01/2003CN1445248A Functional polymer
09/2003
09/30/2003US6628746 Image-based inspection system including positioning compensation for non-planar targets
09/30/2003US6628503 Gas cooled electrostatic pin chuck for vacuum applications
09/30/2003US6628456 Ultraviolet and vacuum ultraviolet antireflection substrate
09/30/2003US6628409 Method for determining the distance between periodic structures on an integrated circuit or a photomask
09/30/2003US6628406 Self referencing mark independent alignment sensor
09/30/2003US6628391 Method for aligning two objects
09/30/2003US6628372 Use of multiple reticles in lithographic printing tools
09/30/2003US6628371 Controlling times and light intensity when transferring patterns onto photosensitive substrates such as wafers during photolithography
09/30/2003US6628370 Illumination system with spatially controllable partial coherence compensating for line width variances in a photolithographic system
09/30/2003US6627906 Controller calculates the beam-current density on the wafer stage
09/30/2003US6627905 Charged-particle-beam mask-based exposure apparatus employing a variable mask-illumination field and alignment and calibration methods therefor
09/30/2003US6627900 Methods, based on a genetic algorithm, for configuring parameters of an array of multiple components for cooperative operation to achieve a desired performance result
09/30/2003US6627588 Liquid cleaning composition and method for removal of photoresist including an aliphatic alcohol. Preferably, the alcohol is isopropyl alcohol. Additionally, an alcohol/base mixture can be used to remove photoresist, rather than alcohol
09/30/2003US6627524 Methods of forming transistor gates; and methods of forming programmable read-only memory constructions
09/30/2003US6627468 Method for manufacturing optical element, optical element, optical system using optical element, optical apparatus and exposure apparatus using optical system, and method for manufacturing device
09/30/2003US6627392 Method of transferring a pattern of high structure density by multiple exposure of less dense partial patterns
09/30/2003US6627391 Resist compositions containing lactone additives
09/30/2003US6627389 Formation of a metal silicon nitride antireflective coating layer that resist "foot poisoning" of a masking layer and its detrimental effects
09/30/2003US6627388 Crosslinking photoresist; exposure; baking aftertreatment;filling defects
09/30/2003US6627387 Multilayer antireflective layer on electroconductive substrate
09/30/2003US6627386 Image forming method
09/30/2003US6627384 Photoresist composition for resist flow process and process for forming a contact hole using the same
09/30/2003US6627383 Photoresist monomer comprising bisphenol derivatives and polymers thereof
09/30/2003US6627382 Includes perfluoro-2,2-dimethy-1,3-dioxole derivatives and vinyl derivatives; for F2 excimer laser
09/30/2003US6627381 Chemical amplification type positive resist composition
09/30/2003US6627380 Photosensitive composition, original plate using the same for lithographic printing, and method for producing images on original plate
09/30/2003US6627379 Photoresist is mixture of polymers
09/30/2003US6627378 Exposed region is selectively silylated with a silylating agent. The silylated region serves as a mask, and the non-silylated region is dry-etched by O2 plasma
09/30/2003US6627377 Soluble in organic solvents, which excels in adhesiveness, heat resistance, mechanical properties and flexibility, which shows properties of alkali-soluble highly sensitive positive-type photoresist
09/30/2003US6627366 Electron beam exposure method having good linearity with respect to producing fine patterns
09/30/2003US6627365 Photomask and projection exposure apparatus
09/30/2003US6627361 An illuminated annulus including an inner edge for producing intermediate level of illumination in a pattern area, an outer edge for producing intermediate level of illumination to generate assist feature separated from pattern area
09/30/2003US6627360 Carbonization process for an etch mask
09/30/2003US6627358 Mask repair in resist image
09/30/2003US6627356 Radiation transparent substrate; forming pattern
09/30/2003US6627354 Matrix and photoimageable system which are phase separated, yet still exhibit low light scattering
09/30/2003US6627269 Photo-alignment material and liquid crystal display device
09/30/2003US6627263 Film forming apparatus and film forming method
09/30/2003US6627097 Shadow mask, a method of forming the shadow mask, and a method of manufacturing a semiconductor device with using the shadow mask
09/25/2003WO2003079419A1 Mask storage device, exposure device, and device manufacturing method
09/25/2003WO2003079418A1 Aligner and device manufacuring method
09/25/2003WO2003079416A1 Laser assisted direct imprint lithography
09/25/2003WO2003079401A2 Directed assembly of functional heterostructures
09/25/2003WO2003079117A1 Full phase shifting mask in damascene process
09/25/2003WO2003079116A1 Direct write lithography system
09/25/2003WO2003079115A2 Device for exposing substrate materials
09/25/2003WO2003079114A1 Photosensitive element for use as flexographic printing plate
09/25/2003WO2003079112A1 Method of producing an etch-resistant polymer structure using electron beam lithography
09/25/2003WO2003079111A1 A method and system of lithography using masks having gray-tone features
09/25/2003WO2003078976A2 Excimer laser inspection system
09/25/2003WO2002093257A3 Microlithographic projection illumination system
09/25/2003WO2002054115A3 A self-cleaning optic for extreme ultraviolet lithography
09/25/2003US20030181629 Chemically amplified resist and a resist composition
09/25/2003US20030181423 Latent reactive polymers with biologically active moieties
09/25/2003US20030181344 The photoresist stripping composition of the present invention contains at least one oxymethylamine compound represented by the following formula 1: wherein R1 to R3 are as defined in the specification. Of the oxymethylamine
09/25/2003US20030181343 Composition and method for removing photoresist materials from electronic components
09/25/2003US20030181342 A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic
09/25/2003US20030181058 Photoresist removal from alignment marks through wafer edge exposure
09/25/2003US20030181055 Method of removing photo-resist and polymer residue
09/25/2003US20030181052 Method of forming integrated circuit structures in silicone ladder polymer
09/25/2003US20030180999 Edge bead removal for spin-on materials containing low volatility solvents using carbon dioxide cleaning
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