Patents
Patents for G03F 7 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (127,176)
01/2004
01/28/2004CN1470396A 可再使用的印刷版 Printable version of the re-use of
01/28/2004CN1136479C Combined ammonia fumigating box for diazo copy machine
01/27/2004USRE38403 Projection optical system and projection exposure apparatus
01/27/2004US6684164 True defect monitoring through repeating defect deletion
01/27/2004US6684132 Active anti-vibration apparatus and exposure apparatus
01/27/2004US6684124 Method for controlling a processing device for a sequential processing of semiconductor wafers
01/27/2004US6683936 EUV-transparent interface structure
01/27/2004US6683729 Objective with crystal lenses and projection exposure equipment for microlithography
01/27/2004US6683728 Illumination system with reduced energy loading
01/27/2004US6683714 Calcium fluoride crystal structures used as projectors or lenses for vacuum ultraviolet (vuv) optical lithography; integrated circuits
01/27/2004US6683710 Correction of birefringence in cubic crystalline optical systems
01/27/2004US6683684 Device for measuring relative position error
01/27/2004US6683674 Image recording device
01/27/2004US6683673 Alignment system and projection exposure apparatus
01/27/2004US6683433 Exposure apparatus and method utilizing isolated reaction frame
01/27/2004US6683421 Addressable semiconductor array light source for localized radiation delivery
01/27/2004US6683306 Array foreshortening measurement using a critical dimension scanning electron microscope
01/27/2004US6683034 Stripper composition for negative chemically amplified resist
01/27/2004US6683008 Process of removing ion-implanted photoresist from a workpiece
01/27/2004US6683006 Film forming method and film forming apparatus
01/27/2004US6682988 Growth of photoresist layer in photolithographic process
01/27/2004US6682981 Stress controlled dielectric integrated circuit fabrication
01/27/2004US6682877 Diisopropylbenzene containing solvent and method of developing flexographic printing plates
01/27/2004US6682876 Thinner composition and method of stripping a photoresist using the same
01/27/2004US6682875 Forming nesting contour on a fiber optic array; nesting a surface of non-planar article against contour; exposing photoresist optically connected to proximal optical fiber surface within contours; developing; etching
01/27/2004US6682873 Forming a masking layer over a surface of a substrate; screen printing plural masking particles over masking layer, removing a portion of masking layr using masking particle as a mask
01/27/2004US6682872 Comprises acrylic acid-acrylonitrile-butadiene terpolymer binder; for protective/passivative coatings, defect repair in ceramic and thin film products within printed circuits; solvent-free
01/27/2004US6682870 Enhanced adhesion for LIGA microfabrication by using a buffer layer
01/27/2004US6682869 In polymer
01/27/2004US6682861 Forming patterns or images on semiconductor wafers using masks comprising substrates having photoresists, etch selective and antireflective multilayers; photolithography
01/27/2004US6682859 Monolithic glass; exposure to radiation; patterning
01/27/2004US6682858 Patterning layer of negative photoresist; miniaturization
01/27/2004US6682657 Three dimensional etching process
01/27/2004US6682607 Reconditioning of semiconductor substrates to remove photoresist during semiconductor device fabrication
01/27/2004US6681693 Image recording apparatus with drum balancing
01/27/2004CA2330862C Broadband diffractive diffuser and associated methods
01/22/2004WO2004008611A1 Motor, robot, substrate loader and exposure system
01/22/2004WO2004008508A1 Exposure transfer mask and exposure transfer mask pattern exchange method
01/22/2004WO2004008507A1 Optical integrator, illumination optical device, exposure apparatus, and exposure method
01/22/2004WO2004008452A1 Spin-coating device and method of producing disk-like recording medium
01/22/2004WO2004008254A1 Projection optical system, exposure apparatus and device fabrication method
01/22/2004WO2004008253A1 Composition for antireflection film formation
01/22/2004WO2004008252A1 Highly heat-resistant, negative-type photosensitive resin composition
01/22/2004WO2004008251A1 Heat stable photocurable resin composition for dry film resist
01/22/2004WO2004008250A1 Patterned substrates
01/22/2004WO2004008249A2 Compositions and method for removing photoresist and/or resist residue
01/22/2004WO2004008246A2 Method and system for context-specific mask writing
01/22/2004WO2004008244A2 Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables
01/22/2004WO2004007192A1 Antireflective silicon-containing compositions as hardmask layer
01/22/2004WO2004006840A2 Three dimensional cell patterned bioploymer scaffolds and method of making the same
01/22/2004WO2003096492A3 Automatic gas control system for a gas discharge laser
01/22/2004WO2003075092A3 Protecting group-containing polymers for lithographic resist compositions
01/22/2004WO2003062926A3 Method for constructing an optical beam guide system
01/22/2004WO2003058345A3 Negative-working photoimageable bottom antireflective coating
01/22/2004WO2003030252A3 Process for producing interconnects
01/22/2004WO2003017003A3 Diaphragm for an integrator unit
01/22/2004WO2002065545A3 Overlay alignment metrology using diffraction gratings
01/22/2004US20040015256 Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings
01/22/2004US20040014890 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality
01/22/2004US20040014833 Photopolymer technology, as well as photoinitiated colour forming reactions are achievable by applying a reactive substrate selected from a polymerisable and/or crosslinkable composition and a colour changing substance to a support,
01/22/2004US20040014831 Resin composition comprising: an alkali-soluble resin (A); an infrared absorbing agent (B); and a thiol compound (C), wherein a solubility thereof in an alkaline aqueous solution is changed by exposure with a infrared laser ray, and a
01/22/2004US20040014628 Using mixture of water alkanolamine and sugar alcohols
01/22/2004US20040014326 Bi-layer resist process
01/22/2004US20040014322 Method for forming patterns of a semiconductor device
01/22/2004US20040013982 Elastomer stamps; patterning using low pressure; curing cycles
01/22/2004US20040013980 Silicon-containing polymer, resist composition and patterning process
01/22/2004US20040013978 Semiconductors; photopolymerization; development of photosensitive pattern
01/22/2004US20040013977 Stereolithographic resins with high temperature and high impact resistance
01/22/2004US20040013975 Polymer and photosensitive acid generators
01/22/2004US20040013974 Activation by light; forming images; holography
01/22/2004US20040013973 Ether, polymer, resist composition and patterning process
01/22/2004US20040013972 Non-decomposable compound with a > refractive index than a decomposable compound, a radiation sensitive decomposer and a stabilizer
01/22/2004US20040013971 Fluorine-containing copolymer, branched polymers, fluoropolymers, amorphous vinyl homopolymers and nitrile/ fluoroalcohol-containing polymers; photoimaging
01/22/2004US20040013970 Fluoropolymer with monomers formed by cyclopolymerization of a fluorinated diene and polymerization of an acrylic monomer and an acid-generating compound
01/22/2004US20040013968 Non-alkaline aqueous development of thermosensitive lithographic printing plates
01/22/2004US20040013957 Resist is exposed to light by deviating a focus of the light by a given distance in relation to a semiconductor wafer, and after development of the resist, resist patterns for measurement are formed
01/22/2004US20040013956 System for correcting aberrations and distortions in EUV lithography
01/22/2004US20040013955 Best focus determining method
01/22/2004US20040013954 Alignment sensor having an electron beam source for impinging an alignment marker on a substrate and a back-scattered electron detector
01/22/2004US20040013953 100 parts of a polyamic acid from a tetracarboxylic acid dianhydride and a diamine, .01-5 parts of a 1,4-dihydro-pyridine derivative and 5-50 parts of a glycol ether
01/22/2004US20040013952 Method for structuring a lithography mask
01/22/2004US20040013950 Photolithographic process used in semiconductor manufacturing
01/22/2004US20040013949 Electron beam exposure-use mask and electron beam exposure method
01/22/2004US20040013858 Contacting silica dielectric film with plasma comprising at least one surface modification agent, at a concentration, and for a time period, effective to render the silica dielectric film hydrophobic
01/22/2004US20040013816 Process of producing polymer optical waveguide
01/22/2004US20040013793 High aspect ratio; photoresists
01/22/2004US20040013226 Lithographic apparatus and device manufacturing method
01/22/2004US20040013141 Method of forming glossy image
01/22/2004US20040012872 Multiphoton absorption method using patterned light
01/22/2004US20040012866 8-Mirror microlithography projection objective
01/22/2004US20040012844 Light source unit and wavelength stabilizing control method, exposure apparatus and exposure method, method of making exposure apparatus, and device manufacturing method and device
01/22/2004US20040012768 System and method for resetting a reaction mass assembly of a stage assembly
01/22/2004US20040012767 Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method
01/22/2004US20040012766 Illumination optical apparatus and exposure apparatus
01/22/2004US20040012765 Electron beam exposure apparatus and semiconductor device manufacturing method
01/22/2004US20040012764 Kit of parts for assembling an optical element, method of assembling an optical element, optical element, lithographic apparatus, and device manufacturing method
01/22/2004US20040011966 Energy beam exposure method and exposure apparatus
01/22/2004US20040011463 Resist stripping equipment
01/22/2004US20040011386 Composition and method for removing photoresist and/or resist residue using supercritical fluids
01/22/2004US20040011381 Method for removing carbon contamination from optic surfaces