Patents for C23F 4 - Processes for removing metallic material from surfaces, not provided for in group or (4,769)
06/2005
06/14/2005US6905624 Interferometric endpoint detection in a substrate etching process
06/02/2005DE10353591A1 Verfahren zum lokal begrenzten Ätzen einer Chromschicht A method for localized etching a chromium layer
05/2005
05/31/2005US6900137 Dry etch process to edit copper lines
05/25/2005CN1619008A Apparatus for surface modification of polymer, metal and ceramic materials using ion beam
05/19/2005US20050106331 Introducing reactive gas containing a carbon compound into reaction chamber wherein reactive gas is converted into plasma by resonance using microwaves and the magnetic field, placing substrate in reaction chamber, and depositing film having amorphous structure on the substrate
05/19/2005US20050103747 Process for the locally restricted etching of a chromium layer
05/19/2005US20050103442 Chamber configuration for confining a plasma
05/19/2005US20050103439 Stabilization of electronegative plasmas with feedback control of RF generator systems
05/19/2005US20050103275 Plasma processing apparatus, ring member and plasma processing method
05/19/2005US20050103267 Flat panel display manufacturing apparatus
05/18/2005CN1617309A Flat panel display manufacturing apparatus
05/17/2005US6893970 Plasma processing method
05/12/2005US20050098899 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
05/05/2005US20050095867 Method of manufacturing semiconductor device
05/05/2005US20050092252 Plasma processing method and apparatus
05/04/2005CN1611639A Mask forming method, mask forming functional layer, dry etching method, and method of manufacturing an information recording medium
05/03/2005US6887337 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
04/2005
04/28/2005US20050088491 Substrate and method of forming substrate for fluid ejection device
04/27/2005CN1610067A Method and device for cutting wire formed on semiconductor substrate
04/26/2005US6884730 Method of etching a film of magnetic material and method of manufacturing a thin-film magnetic head
04/26/2005US6884691 Method of forming a substrate having a surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms
04/21/2005US20050085088 Method and device for cutting wire formed on semiconductor substrate
04/21/2005US20050084617 Method for coating internal surface of plasma processing chamber
04/21/2005US20050082255 Plasma etching method
04/20/2005EP1523754A2 Heating jacket for plasma etching reactor, and etching method using same
04/19/2005US6881664 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
04/14/2005WO2004086143A3 Multi-step process for etching photomasks
04/14/2005US20050079647 Method and system for patterning of magnetic thin films using gaseous transformation
04/13/2005CN1606107A Method and system for patterning of magnetic thin films using gaseous transformation
04/13/2005CN1197131C Plasma etching device using plasma confining device
04/12/2005US6878635 Dry etching
04/12/2005US6878248 Method of manufacturing an object in a vacuum recipient
04/07/2005WO2005031838A1 Method and device for flattening surface of solid
04/07/2005US20050072756 FIB milling of copper over organic dielectrics
04/06/2005CN1604284A Static etching method and apparatus therefor
04/06/2005CN1603468A Dry etching method for magnetic material
04/05/2005US6875698 Dry etching method
04/05/2005US6875477 Method for coating internal surface of plasma processing chamber
04/05/2005US6875326 Plasma processing apparatus with real-time particle filter
04/05/2005US6874443 Layer-by-layer etching apparatus using neutral beam and etching method using the same
03/2005
03/31/2005US20050068608 Selective isotropic etch for titanium-based materials
03/31/2005US20050067371 Mask forming method, mask forming functional layer, dry etching method, and method of manufacturing an information recording medium
03/30/2005CN1602563A Plasma production device and method and RF driver circuit
03/30/2005CN1602542A 等离子体蚀刻方法 The plasma etching method
03/29/2005US6872668 Multi-step tungsten etchback process to preserve barrier integrity in an integrated circuit structure
03/29/2005US6872281 Chamber configuration for confining a plasma
03/24/2005US20050064717 Plasma processing apparatus
03/24/2005DE10338422A1 Selektiver Plasmaätzprozess zur Aluminiumoxid-Strukturierung Selective plasma etching of alumina-structuring
03/24/2005DE10338019A1 Verfahren zum hochaufgelösten Bearbeiten dünner Schichten mit Elektronenstrahlen A method for high-resolution processing of thin films with electron
03/17/2005US20050056934 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
03/17/2005US20050056615 Selective plasma etching process for aluminum oxide patterning
03/17/2005DE19715194B4 Verfahren zum Herstellen von Halbleitervorrichtungen unter Verwendung von Trockenätzen A method of manufacturing semiconductor devices using dry etching
03/15/2005US6867143 Method for etching a semiconductor substrate using germanium hard mask
03/10/2005WO2004044954A3 Gcib processing of integrated circuit interconnect structures
03/10/2005US20050051268 Vacuum enclosure; adjustment confining rings; etching gas
03/09/2005EP1432847B1 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
03/09/2005CN1592798A Cleaning gas for semiconductor production equipment and cleaning method using the gas
03/09/2005CN1192418C Structuring method for material layer
03/08/2005US6864640 Plasma processing method and apparatus thereof
03/08/2005US6863787 Dummy copper deprocessing
03/03/2005US20050045275 Plasma treatment apparatus and surface treatment apparatus of substrate
02/2005
02/24/2005WO2005017949A2 Method for high-resolution processing of thin layers with electron beams
02/24/2005US20050039683 Plasma processing method
02/23/2005EP1507882A2 Method for removing at least one partial area of a component made of metal or a metallic compound
02/16/2005EP1506562A1 Stabilization of electronegative plasmas with feedback control of rf generator systems
02/16/2005CN1581445A Plasma etching method and plasma treatment apparatus
02/16/2005CN1581442A Method for making semiconductor device
02/16/2005CN1581433A 真空容器 Vacuum vessel
02/15/2005US6855638 Process to pattern thick TiW metal layers using uniform and selective etching
02/10/2005US20050032374 Process for defining a chalcogenide material layer, in particular in a process for manufacturing phase change memory cells
02/10/2005US20050029954 Plasma processing apparatus and method
02/10/2005US20050028935 Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
02/10/2005DE19610012B4 Verfahren zur Stabilisierung eines Arbeitspunkts beim reaktiven Zerstäuben in einer Sauerstoff enthaltenden Atmosphäre A method of stabilizing an operating point during reactive sputtering in an atmosphere containing oxygen
02/09/2005CN1577845A Magnetic memory device and method of manufacturing the same
02/09/2005CN1577786A Interferometric endpoint detection in a substrate etching process
02/09/2005CN1577732A Method of surface texturizing
02/08/2005US6852946 Laser-induced plasma micromachining
02/02/2005EP1502970A1 Znse diffraction type optical component and method for fabricating the same
02/02/2005CN1572721A Method for fabricating a nanoarray using the self-assembly of supramolecules and staining of metals
02/01/2005US6849191 Method and apparatus for treating surface of semiconductor
01/2005
01/27/2005US20050020078 Method of planarizing a surface
01/27/2005US20050020011 Magnetic memory device and method of manufacturing the same
01/27/2005US20050016957 Dry etching method for magnetic material
01/26/2005EP1500720A1 Dry etching method for magnetic material
01/26/2005CN1570581A Buffer of manometer inductor for dry etch reaction chamber
01/26/2005CN1186804C Post-treatment process of dry etched metal film and integral etching and photoresist-eliminating system
01/25/2005US6846569 Carbon-doped hard mask and method of passivating structures during semiconductor device fabrication
01/20/2005US20050011862 Method and apparatus for dry-etching half-tone phase-shift films, half-tone phase-shift photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof
01/19/2005EP0801606B1 Method for treating a surface
01/19/2005CN1567528A Wiring and its making method including the described wired semiconductor device and dry etching process
01/19/2005CN1567078A Wiring and its making method including the described wired semiconductor device and dry etching process
01/19/2005CN1185716C Wiring and its making method including the described wired semiconductor device and dry etching process
01/18/2005US6844264 Dry etching method
01/18/2005US6843893 Metal dry etch using electronic field
01/13/2005US20050009347 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
01/13/2005US20050008945 plasma/dry etching; photolithographic reticle; oxygen-free gas etches anti-reflective coating and patterned photoresistive material; integrated circuits
01/13/2005US20050006341 Interferometric endpoint detection in a substrate etching process
01/11/2005US6841789 Apparatus for surface modification of polymer, metal and ceramic materials using ion beam
01/11/2005US6841484 Method of fabricating a magneto-resistive random access memory (MRAM) device
01/06/2005WO2005001919A1 Dry etching method and information recording medium
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