Patents for C23F 4 - Processes for removing metallic material from surfaces, not provided for in group or (4,769)
05/2009
05/13/2009CN101431009A Shower plate and substrate processing apparatus
05/13/2009CN101431003A Exhaustion ring and plasma processing device
05/13/2009CN100487871C Etching method
05/13/2009CN100487858C Array type electron beam etching device and etching method
05/12/2009US7532322 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
05/12/2009US7531103 Mask forming method, mask forming functional layer, dry etching method, and method of manufacturing an information recording medium
05/07/2009US20090114851 Fib milling of copper over organic dielectrics
05/06/2009CN101425450A Gas supply device, substrate processing apparatus and substrate processing method
05/06/2009CN101423945A Method for preparing light metal super-hydrophobic surface
04/2009
04/29/2009CN101419907A High temperature cathode for plasma etching
04/29/2009CN101419904A Plasma confinement device and plasma treatment device
04/29/2009CN101419400A Dry method etching method by chrome metal mask
04/29/2009CN101417578A Surface decoration method for stainless steel
04/29/2009CN100483617C Base plate processing device and base plate processing method
04/23/2009US20090104781 Plasma processing apparatus, ring member and plasma processing method
04/22/2009CN101414537A Tunable multi-zone gas injection system
04/22/2009CN101413111A Film forming device and use method thereof
04/21/2009CA2430511C Method of removing ceramic coatings
04/16/2009WO2006011954A3 Diagnostic plasma measurement device having patterned sensors and features
04/15/2009CN201220964Y Auxiliary tooling for etching silicon chip
04/08/2009CN201217686Y Ionic beam emission source capable of emitting singular ion energy
04/08/2009CN100477104C Plasma treatment apparatus
04/08/2009CN100477103C Atmospheric transfer chamber and after-processing transfer method of processed object
04/08/2009CN100477078C Substrate processing apparatus and substrate processing method
04/07/2009US7513063 Substrate processing apparatus
04/01/2009CN201215800Y Upper electrode for semiconductor etching device
04/01/2009CN101399166A Etching substrates mounted with gas wall
04/01/2009CN100474506C Substrate processing apparatus and lid supporting apparatus for the same
03/2009
03/31/2009US7510667 Plasma processing method and apparatus
03/26/2009US20090081512 Micromachined electrolyte sheet, fuel cell devices utilizing such, and micromachining method for making fuel cell devices
03/26/2009DE102008040160A1 Treating optical elements by plasma, which is ignited to exist on surface of optical element to be treated and is present in cavity, for microlithography system, comprises forming a side from the cavity through the surface to be treated
03/24/2009US7506610 Plasma processing apparatus and method
03/12/2009WO2009032095A1 Method and apparatus for diagnosing status of parts in real time in plasma processing equipment
03/11/2009CN101383314A Substrate table substrate processing apparatus and temperature control method
03/11/2009CN101383272A Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection
03/11/2009CN101383266A Reaction cavity
03/11/2009CN100468619C Temperature control device of etching equipment and its method for controlling wafer temperature
03/11/2009CN100468615C Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
03/11/2009CN100468613C Method and apparatus for removing material from a substrate surface
03/04/2009CN101378031A Substrate carrier plateform and substrate processing device
03/04/2009CN101378003A Alternate gas delivery and evacuation system for plasma processing apparatuses
03/04/2009CN101376980A Process for improving strip steel wetting property
03/04/2009CN100466217C Stage, substrate processing apparatus and the control method thereof
02/2009
02/25/2009EP1187187B1 Plasma processing apparatus
02/25/2009CN101373731A Electrostatic chuck apparatus and temperature control method thereof
02/25/2009CN101373707A Processing device
02/25/2009CN101373703A Cap-opening mechanism and semiconductor processing device and cap-opening control method thereof
02/25/2009CN101373702A Cavity inner lining and reaction cavity
02/24/2009US7494596 Measurement of etching
02/19/2009DE102005019212B4 Verfahren zum Bearbeiten von kaltgewalzten verzinkten Profilen Method for processing cold rolled galvanized profiles
02/18/2009EP2025775A1 Photon induced cleaning of a reaction chamber
02/18/2009CN101369527A Vacuum processor
02/18/2009CN101369518A Plasma species and uniformity control through pulsed VHF operation
02/18/2009CN101369515A Reaction cavity
02/11/2009CN201194232Y Plasma body etching machine
02/10/2009US7488429 Method of dry etching, method of manufacturing magnetic recording medium, and magnetic recording medium
02/04/2009CN101359583A Plasma processing apparatus of batch type
02/04/2009CN101359580A Substrate processing apparatus having a sensing unit
02/04/2009CN100459059C Plasma processing method and apparatus
02/04/2009CN100458167C Method of coating fluorocarbon resin and sliding part and gas compressor using said method
01/2009
01/29/2009US20090025877 Flat panel display manufacturing apparatus
01/28/2009CN101356304A Optical metrological scale and laser-based manufacturing method therefor
01/28/2009CN101355009A Etching device
01/28/2009CN100456445C Etching method and apparatus
01/28/2009CN100456434C Semiconductor etching apparatus
01/28/2009CN100456433C Focus ring, plasma etching apparatus and plasma etching method
01/27/2009US7482279 Method for fabricating semiconductor device using ArF photolithography capable of protecting tapered profile of hard mask
01/27/2009US7482274 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
01/21/2009CN100453702C Plasma processing apparatus and components thereof, and method for detecting life span of the components
01/15/2009US20090017259 Dry etching method, fine structure formation method, mold and mold fabrication method
01/14/2009CN201181693Y Upper electrode of semiconductor etching equipment
01/14/2009CN101345194A Silicon groove forming method and device
01/14/2009CN100452290C Plasma processing apparatus
01/14/2009CN100451171C Surface treatment for improving metal welding performance and work pieces therefrom
01/13/2009US7476951 Selective isotropic etch for titanium-based materials
01/08/2009US20090008363 Plasma processing apparatus and a plasma processing method
01/07/2009CN101339895A Gas distribution device and plasma processing apparatus applying the same
01/07/2009CN101338413A Remote inductively coupled plasma source for cvd chamber cleaning
12/2008
12/31/2008WO2009001744A1 Etching method and etching apparatus
12/31/2008EP2007923A1 Etching process
12/31/2008CN101335193A Hybrid etch chamber with decoupled plasma controls
12/31/2008CN101335192A Substrate processing apparatus and shower head
12/31/2008CN101333642A Band steel filming method and system thereof
12/30/2008US7470627 Wafer area pressure control for plasma confinement
12/17/2008CN101325150A Flexible manifold for integrated gas system gas panels
12/17/2008CN100444311C Vacuum processor
12/17/2008CN100443637C Method for controlling chip temperature in reaction chamber for semiconductor etching process
12/10/2008CN101320680A Anti-arc protection device and its assembling method
12/10/2008CN101320679A Plasma processing system
12/10/2008CN101320676A Evacuation method and storage medium
12/10/2008CN101320675A Plasma processing device, electrode temperature adjusting device and method
12/09/2008US7462293 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
12/03/2008CN101315889A Silicon film dry etching method
12/03/2008CN101315880A Gas distribution device and plasma processing apparatus adopting the same
12/03/2008CN101315875A Plasma generator and workpiece processing apparatus using the same
12/03/2008CN100440453C Fabrication method of semiconductor device
12/03/2008CN100440450C Method and device for flattening surface of solid
12/03/2008CN100440427C Plasma processing chamber
12/03/2008CN100439562C Process chamber component having electroplated yttrium containing coating
11/2008
11/27/2008WO2008143170A1 Method for quantitative analysis of tin or tin alloy plating layer
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