Patents for C23F 4 - Processes for removing metallic material from surfaces, not provided for in group or (4,769)
02/2007
02/07/2007CN1909186A Processing chamber, flat display device production device, plasma treatment method using same
02/01/2007US20070023392 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
02/01/2007DE19844882B4 Vorrichtung zur Plasma-Prozessierung mit In-Situ-Überwachung und In-Situ-Überwachungsverfahren für eine solche Vorrichtung An apparatus for plasma processing with in-situ monitoring and in-situ monitoring method for such a device
01/2007
01/31/2007CN1905243A Method for manufacturing a mask and an organic EL element and an organic EL printer
01/31/2007CN1905135A Plasma etching apparatus
01/30/2007US7168436 Gas for removing deposit and removal method using same
01/24/2007CN1901152A Etching method and apparatus
01/24/2007CN1296975C Processing apparatus for plasma
01/23/2007US7166488 Metal MEMS devices and methods of making same
01/23/2007US7166480 Particle control device and particle control method for vacuum processing apparatus
01/18/2007US20070012401 Plasma processing apparatus
01/17/2007EP1742758A1 A method of laser etching a structure by first radiating areas of the structure for altering the crystallinity
01/17/2007EP1565592B1 Method for cleaning a process chamber
01/17/2007CN1896315A Ion beam etching method and ion beam etching apparatus
01/11/2007DE19501387B4 Verfahren zum Bilden einer im wesentlichen gleichmäßigen Anordnung scharfer Emitterspitzen A method for forming a substantially uniform array of sharp emitter tips
01/11/2007DE102005032737A1 Dry-etching silicon-containing substrates, especially wafers for semiconductor elements, contains silicon component, e.g. silane, to form side-wall passivation layer
01/11/2007DE102005032320A1 Decontaminating optical element surface, especially in projection illumination plant for microlithography, using cleaning device applying activated reducing gas to the surface under atmospheric pressure
01/11/2007DE102005031602A1 Reaktor zur Durchführung eines Ätzverfahrens für einen Stapel von maskierten Wafern und Ätzverfahren Reactor for performing an etching process for a stack of wafers and etching unmasked
01/10/2007CN1892980A Chamber isolation valve RF grounding
01/10/2007CN1891864A Dry treatment method for superconductor cavity
01/10/2007CN1891863A Rare earth metal member and making method
01/10/2007CN1891861A Process kit design particle generation
01/10/2007CN1891856A Free radical initiator in remote plasma chamber clean
01/09/2007US7159537 Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
01/04/2007US20070000296 Rolled product, method and device for the production thereof, and use of the same
01/04/2007DE202006017024U1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
01/03/2007EP1737998A2 Remote chamber methods for removing surface deposits
01/03/2007EP1079423B1 Apparatus for gas processing
01/03/2007CN1293596C Chamber components having textured surfaces and method of manufacture
12/2006
12/27/2006CN1885491A Vacuum processing apparatus and method operation thereof
12/27/2006CN1885488A Top electrode, plasma processing device and method
12/20/2006EP1733072A2 Remote chamber methods for removing surface deposits
12/20/2006EP1733071A2 Remote chamber methods for removing surface deposits
12/20/2006CN1882217A 等离子体处理装置 Plasma processing apparatus
12/20/2006CN1881555A Substrate-placing platform, substrate processing device and production method of substrate-placing platform
12/20/2006CN1881537A Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
12/20/2006CN1881529A Substrate processing device
12/20/2006CN1291460C Plasma processing method and apparatus
12/14/2006US20060278611 Method and device for flattening surface of solid
12/14/2006DE102005026334A1 Method for processing of medium- and long-wave surface shape of work piece e.g., for optical elements, involves eroding modified layers to give work piece modified surface
12/13/2006CN1877254A Etching volume measuring device and method, etching device
12/13/2006CN1876894A 离子源 Ion source
12/13/2006CN1876888A Method (variant) for cleaning shade in display production and apparatus for implementing the method
12/06/2006EP1729551A1 Plasma generating equipment
12/06/2006CN1875129A Surface treatment method and device
12/06/2006CN1873911A Plasma processing chamber, potential controlling apparatus, method, program and storage medium
12/06/2006CN1288711C Diffuser and rapid cycle chamber
11/2006
11/30/2006WO2006126520A1 Dry etching method, method for forming fine structure, mold and method for producing same
11/28/2006US7141178 Plasma etching method
11/22/2006CN1865496A Substrate processing apparatus and substrate processing method
11/21/2006US7138065 Method for removing at least one area of a layer of a component consisting of metal or a metal compound
11/16/2006WO2005090638A8 Remote chamber methods for removing surface deposits
11/16/2006US20060255447 Plasma etching method
11/16/2006DE112005000153T5 Erweiterte Multidruck-Werkstückprozessierung Advanced multi-pressure Werkstückprozessierung
11/09/2006US20060249254 Plasma processing apparatus and plasma processing method
11/09/2006DE102004049825B4 Verfahren zum Entschichten von beschichteten Bauteilen A method for stripping of coated components
11/08/2006CN1860593A Method and device for flattening surface of solid
11/08/2006CN1284209C Plasma processing method and apparatus
11/07/2006US7132996 Plasma production device and method and RF driver circuit
11/02/2006WO2006115242A1 Surface-treated fine particle, surface-treating apparatus, and method for surface-treating fine particle
11/01/2006CN1855385A Dry-etching method
11/01/2006CN1855384A Semiconductor machinery and method for decreasing exhaust pollution
10/2006
10/26/2006DE102005019212A1 Process to descale galvanized steel tube by high-frequency electricity for application of end-cap
10/25/2006CN1851898A Thimble device
10/25/2006CN1851882A Grating etching technology avoiding micro-channel phenomenon
10/25/2006CN1851881A Semiconductor etching apparatus
10/25/2006CN1851875A Gate etching process
10/25/2006CN1851872A Polycrystalline silicon pulse etching process for improving anisotropy
10/25/2006CN1851864A Silicon chip unloading process
10/25/2006CN1851860A Bottom electrode assembly for semiconductor device
10/25/2006CN1851858A Gas injection and diffusion system
10/25/2006CN1851857A Silicon-chip separating process
10/25/2006CN1851856A Reaction chamber for semiconductor treatment
10/25/2006CN1851855A Plasma etching device exhaustring
10/25/2006CN1851854A Lower-extraction type etching device
10/25/2006CN1851853A Device and method for reducing thin-film type capacitance vacuum gauge zero-point drift
10/25/2006CN1851852A Plasma etching device
10/25/2006CN1851848A Plasma reaction chamber temperature control system on-line fault detecting device and method
10/25/2006CN1851053A Shielding plate for enhancing flow field uniformity
10/25/2006CN1851052A Control method for removing residual gas for etching process
10/25/2006CN1851051A Method for controlling chip temperature in reaction chamber for semiconductor etching process
10/25/2006CN1851050A Granule control method for polycrystalline silicon etching process
10/25/2006CN1850349A Air-intake nozzle
10/25/2006CN1850348A Gas nozzle with function of increasing air-flow distribution evenness
10/25/2006CN1850347A Air-intaking nozzle with adjustable air-supplying evenness
10/19/2006DE102005017632A1 Method of controlling local etching or deposition in modification of surfaces with pulsed determination of a removal or deposition profile ion streams useful in the high accuracy forming of optical component surfaces involving
10/18/2006CN1848389A Etching technology for reducing plasma damage
10/18/2006CN1848388A Method for controlling key size deviation in chip etching technology
10/18/2006CN1848386A Grate etching method
10/18/2006CN1848385A Inductive coupling plasma device
10/18/2006CN1848383A Method for removing residual polymer in polysilicon etching technology
10/18/2006CN1848377A Gate valve apparatus and processing system
10/18/2006CN1848376A Semiconductor processing system reaction chamber
10/18/2006CN1848375A Method for releasing chip static electricity thoroughly in chip etching equipment
10/18/2006CN1848373A Fault detection method in chip etching technology
10/18/2006CN1848372A Plasma reaction device
10/18/2006CN1848371A Plasma etching apparatus
10/18/2006CN1848369A Silicon chip unloading technology capable of raising production volume and reducing silicon chip surface roughness
10/18/2006CN1848367A Plasma reaction chamber
10/18/2006CN1847458A Dry cleaning process in polycrystal silicon etching
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