| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 07/24/2008 | DE102006053862B4 Verfahren zum Verpacken von Bauelementen A method of packaging components |
| 07/22/2008 | US7402910 Solder, microelectromechanical component and device, and a process for producing a component or device |
| 07/22/2008 | US7402897 Vertical system integration |
| 07/16/2008 | EP1944122A1 Holding apparatus, assembly system, sputtering apparatus, machining method and machining apparatus |
| 07/16/2008 | CN101221911A Packaging micro devices |
| 07/15/2008 | US7399652 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |
| 07/10/2008 | DE10222609B4 Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat A process for the production of structured layers on substrates and methods according coated substrate |
| 07/09/2008 | CN101217124A A low temperature flip chip method of macromolecule electric conducting material of template printing |
| 07/09/2008 | CN101214918A Packaging structure used for micro-electromechanical capping process |
| 07/08/2008 | US7396741 Method for connecting substrate and composite element |
| 07/03/2008 | WO2008078994A1 Multilayer device and apparatus and method for manufacturing such a device |
| 07/03/2008 | WO2008078986A1 Device built by joining a plurality of layers |
| 07/03/2008 | DE10309677B4 Mikroelektromechanisches Bauteil und Verfahren zur Herstellung eines mikroelektromechanischen Bauteils The micro-electro-mechanical component and process for producing a micro-electromechanical component |
| 07/02/2008 | EP1389307B1 Sensor arrangement, in particular micro-mechanical sensor arrangement |
| 07/01/2008 | US7393712 Fluidic MEMS device |
| 06/26/2008 | DE10053307B4 Kapsel für Mikrosensoren, Verfahren zur Verkapselung von Mikrosensoren und Kapselelement Capsule for micro sensors, processes for the encapsulation of micro-sensors and capsule element |
| 06/25/2008 | EP1935843A1 Device built by joining a plurality of layers |
| 06/25/2008 | EP1935842A1 Multilayer device and apparatus and method for manufacturing such a device |
| 06/25/2008 | EP1230689B1 Piezoelectric macro-fiber composite actuator and manufacturing method |
| 06/25/2008 | CN100397593C Method for the production of structured layers on substrates |
| 06/19/2008 | DE102005029407B4 Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat Method and apparatus for permanently joining integrated circuits to a substrate |
| 06/18/2008 | EP1569865B8 Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers |
| 06/18/2008 | CN101202272A Sealing structure for MEMS devices and method of the same |
| 06/05/2008 | WO2008066796A1 Method for making microfluidic devices and devices resulting |
| 06/05/2008 | WO2008066087A1 Fine structure device, method for manufacturing the fine structure device and substrate for sealing |
| 06/05/2008 | WO2008065880A1 Method for joining microchip substrate and microchip |
| 06/05/2008 | DE102006056837A1 Two-part component at least partially of polymer, e.g. sensor, is obtained by contacting heated parts together while keeping polymer below glass transition temperature with supercritical gas |
| 05/29/2008 | WO2007135682B1 Apparatus for generating pressure and methods of manufacture thereof |
| 05/29/2008 | US20080123167 Method And Device For Scanning Light |
| 05/28/2008 | CN101188203A Hermetic sealing of micro devices |
| 05/21/2008 | CN101183675A Hermetically sealed wafer level packaging for optical mems devices |
| 05/20/2008 | US7375404 Fabrication and integration of polymeric bioMEMS |
| 05/20/2008 | US7374962 Method of fabricating reflective spatial light modulator having high contrast ratio |
| 05/15/2008 | WO2007131037A3 Forcing gas trapped between two components into cavities |
| 05/15/2008 | DE19826317B4 Verfahren zum Herstellen eines Halbleitersubstrats, Halbleiterdrucksensor und sein Herstellungsverfahren A method of manufacturing a semiconductor substrate, a semiconductor pressure sensor and its manufacturing method |
| 05/15/2008 | DE102007051823A1 Sensor für eine physikalische Grösse und Verfahren zur Fertigung des Sensors A physical quantity sensor and method for manufacturing the sensor |
| 05/15/2008 | DE102006053862A1 Method for manufacturing packaged components, involves mounting plate-like top substrate on support substrate, where trenches are added on exposed side of plate-like top substrate |
| 05/14/2008 | EP1919821A1 Micro electro-mechanical system packaging and interconnect |
| 05/14/2008 | CN101177235A Packaging construction of micro electromechanical systems and manufacturing method thereof |
| 05/14/2008 | CN100387749C Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 05/08/2008 | US20080108169 Ultrathin module for semiconductor device and method of fabricating the same |
| 05/08/2008 | DE102006051198A1 Housing for accommodating micro component i.e. micro-mechanical component, has housing body made from plastic, and permanent magnets provided for operating micro component and arranged in housing in partially injected manner |
| 05/07/2008 | EP1363737B1 Micro-arrayer with mechanical incremental movements |
| 05/07/2008 | CN101172185A Process for producing implantation type two-sided flexible tiny array electrode |
| 05/07/2008 | CN101172184A Three-dimensional flexible nervus and preparation method |
| 04/30/2008 | EP1495154B1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 04/30/2008 | CN101168437A Functional element |
| 04/30/2008 | CN100385657C Electronic device and method of manufacturing the same |
| 04/24/2008 | US20080096313 Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates |
| 04/23/2008 | EP1913998A1 A support unit for a microfluidic system |
| 04/23/2008 | EP1913997A2 A support unit for a microfluidic system |
| 04/23/2008 | EP1444543B1 Digital optical switch apparatus and process for manufacturing same |
| 04/23/2008 | EP1407278B1 Acceleration sensor |
| 04/17/2008 | DE102006042764B3 Base or cover wafer for producing cavity for multiplicate component, has getter test array arranged such that getter test array comes to lie in cavity, where array exhibits small getter material surface than gas absorption array surface |
| 04/16/2008 | EP1910219A1 Microcomponent with nanostructured silicon surface, method for producing it, and connection arrangement comprising such microcomponents |
| 04/09/2008 | EP1166352B1 Micro-relay |
| 04/09/2008 | CN101160257A Micromachine structure system and method for manufacturing same |
| 04/08/2008 | US7353593 Method for assembling micro structures |
| 04/08/2008 | CA2544246C Methods and apparatus for transporting and positioning micro-mechanical parts |
| 04/03/2008 | WO2007135682A3 Apparatus for generating pressure and methods of manufacture thereof |
| 04/02/2008 | CN101152954A Packaging structure for electric component of microcomputer |
| 04/01/2008 | US7351380 Improved connections between microfluidic device and external components and increased range of functional components that can be connected |
| 04/01/2008 | US7351377 Used in manufacture of microfabricated devices, such as integrated circuits, microprocessors, microfluidic components |
| 03/27/2008 | US20080073019 Microfluidics Chips and Methods of Using Same |
| 03/27/2008 | DE102007038169A1 Verfahren zum Verpacken auf Waferebene unter Verwendung von Waferdurchgangslöchern mit geringem Aspektverhältnis A method of packaging at the wafer level using wafer through holes with a low aspect ratio |
| 03/26/2008 | EP1902782A2 A support unit for a microfluidic system |
| 03/26/2008 | EP1902781A2 A support unit for a microfluidic system |
| 03/26/2008 | EP1902780A2 A support unit for a microfluidic system |
| 03/26/2008 | EP1902779A2 A support unit for a microfluidic system |
| 03/26/2008 | CN101150889A Encapsulation structure and its method for computer electric microphone |
| 03/26/2008 | CN101150888A Encapsulation structure and its encapsulation method for computer electric microphone |
| 03/26/2008 | CN101150117A Semiconductor encapsulation structure and its making process |
| 03/26/2008 | CN101148244A Wafer-class tool for sealing microcomputer electric system device and method |
| 03/25/2008 | US7347095 Integral resonator gyroscope |
| 03/19/2008 | CN101143702A Method for preparing spherical glass micro-cavity used for MEMS disc type packaging |
| 03/13/2008 | DE102006040658A1 Micromechanical sensor arrangement, has substrate with thickness of less than hundred pico meters and connected with another substrate in elongation firm manner by hard connecting layer in particular sealing glass or metal solder layers |
| 03/12/2008 | CN101139079A Plastic packaging method of microcomputer sensing and measuring element and structure thereof |
| 03/11/2008 | US7342349 Piezoelectric actuator array and manufacturing method |
| 03/05/2008 | EP1894903A1 Anodic bonding apparatus |
| 03/05/2008 | CN101134557A Partial vacuum packaging method for resonant mode pressure sensor chip |
| 02/28/2008 | WO2008023465A1 Microelectronic machine mechanism device, and its manufacturing method |
| 02/27/2008 | EP1890959A1 Compounds for placing objects by self assembling and the use thereof |
| 02/26/2008 | US7335984 Microfluidics chips and methods of using same |
| 02/26/2008 | US7335527 Method for microfabricating structures using silicon-on-insulator material |
| 02/26/2008 | US7334491 Sensor arrangement, in particular a micro-mechanical sensor arrangement |
| 02/21/2008 | WO2008019786A1 Method for bonding work pieces made of stainless steel, nickel or nickel alloys using a bonding layer consisting of ni ckel- phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method |
| 02/20/2008 | EP1890181A1 Digital optical switch apparatus and process for manufacturing same |
| 02/20/2008 | EP1889681A1 Process of joining workpieces made of stainless, Nickel or Nickel alloys using a joining layer made from a Nickel-Phosphor alloy ; Process of manufacturing a micro workpiece using such a process ; micro workpiece with a joining layer achieved through such a process |
| 02/13/2008 | EP1569865B1 Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers |
| 02/13/2008 | CN101123231A Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method |
| 02/05/2008 | US7326446 Method for coating metal surfaces and substrate having a coated metal surface |
| 01/29/2008 | US7323354 Method of manufacturing MEMS device |
| 01/23/2008 | CN101108722A Wafer level vacuum encapsulation of microelectron mechanical system and upside-down mounting soldering method thereof |
| 01/22/2008 | US7320940 Method for manufacturing electronic device including package |
| 01/17/2008 | US20080011814 Method and System for Self-Aligning Parts in Mems |
| 01/02/2008 | CN101096009A Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system |
| 01/02/2008 | CN101096008A Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system |
| 01/02/2008 | CN101096007A Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system |
| 01/02/2008 | CN100359653C Method for connecting substrates and composite element |
| 12/26/2007 | CN101094804A Packaging for micro electro-mechanical systems and methods of fabricating thereof |