| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
|---|
| 05/05/2005 | US20050091843 Vibrating beam accelerometer two-wafer fabrication process |
| 05/03/2005 | US6887342 Field-assisted fusion bonding |
| 04/28/2005 | US20050087756 Light transmissive cover, device provided with same and methods for manufacturing them |
| 04/27/2005 | EP1525085A2 Method and device for forming a body having a three-dimensional structure |
| 04/27/2005 | CN1610644A Fabrication of a reflective spatial light modulator |
| 04/20/2005 | CN1607682A Wafer-level packaging of optoelectronic devices |
| 04/14/2005 | US20050077584 Hermetically sealed microchip reservoir devices |
| 04/07/2005 | US20050074919 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 04/07/2005 | US20050072189 Anodic Bonding of silicon carbide to glass |
| 04/07/2005 | DE10338967A1 Mikrosystembauelement und Verfahren zum Kleben von Mikrobauteilen auf ein Substrat Microsystem device and method for bonding of micro components on a substrate |
| 04/06/2005 | EP1520838A1 Method and apparatus for coupling hollow fibers to a microfluidical network. |
| 04/05/2005 | US6876048 Micromechanical component as well as a method for producing a micromechanical component |
| 04/05/2005 | US6875936 Micromachine switch and its production method |
| 03/31/2005 | WO2005028359A1 Process for fabricating a micro-electro-mechanical system with movable components |
| 03/31/2005 | US20050067695 Micro-sensor |
| 03/24/2005 | WO2004043850A3 An integrated structure and method for fabricating the same |
| 03/24/2005 | US20050062122 Wafer-level packaging of optoelectronic devices |
| 03/24/2005 | US20050062067 Method for manufacturing electronic device including package |
| 03/22/2005 | US6868733 Sensor having membrane and method for manufacturing the same |
| 03/16/2005 | EP1513764A1 Fabrication of a reflective spatial light modulator |
| 03/16/2005 | EP1108203B1 Micromechanical component protected against environmental influences |
| 03/10/2005 | WO2005021669A1 Microsystem component and method for gluing microcomponents to a substrate |
| 03/10/2005 | US20050053504 Micropump check valve device and method of manufacturing the same |
| 03/02/2005 | EP1509802A2 Bulk silicon mirrors with hinges underneath |
| 03/02/2005 | CN1588099A Direct heating terminal type micro electronic mechanical system microwave power sensor and its producing method |
| 03/02/2005 | CN1191743C Flexible microsystem and building techniques and micro photoelectric motor |
| 02/24/2005 | WO2005017972A2 Method for microfabricating structures using silicon-on-insulator material |
| 02/24/2005 | DE10335492A1 Process for selectively connecting components in a microstructure or membrane technology stamps one surface with hardenable medium and uses adhesive to attach a second part |
| 02/23/2005 | CN1585103A Locak bonding and sealing method |
| 02/17/2005 | US20050035671 Method of forming a micro-rotating device, and a micro-rotating device produced by the method |
| 02/10/2005 | WO2004099066A8 Wafer bonding compatible with bulk micro-machining |
| 02/10/2005 | DE202004016256U1 LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point |
| 02/09/2005 | CN1578911A 微型传感器 Miniature Sensor |
| 02/09/2005 | CN1576229A Fluidic mems device |
| 02/03/2005 | WO2005010377A1 Microfluidics chips and methods of using same |
| 02/03/2005 | US20050023656 Vertical system integration |
| 02/03/2005 | US20050022888 Composed of a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface; barrier films allow the wafers to be reused without cleaning. |
| 02/02/2005 | EP1502293A2 Method for the production of structured layers on substrates |
| 02/02/2005 | EP1501756A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/02/2005 | CN1572718A Semiconductor device and manufacturing method of the same |
| 02/01/2005 | US6850354 Monolithic MEMS device for optical switches |
| 02/01/2005 | US6848175 Method of forming an out-of-plane structure |
| 01/27/2005 | DE102004006197A1 Micromechanical pressure sensor, has component bordering on another component, where cavity of latter component is arranged or structured so that medium to be measured gains access to diaphragm through cavity |
| 01/25/2005 | US6846690 Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process |
| 01/20/2005 | US20050012197 Fluidic MEMS device |
| 01/20/2005 | US20050012169 Semiconductor device and manufacturing method of the same |
| 01/20/2005 | DE10133014B4 Verfahren zur Erzeugung von dreidimensionalen, mikrostrukturierten Komponenten A process for production of three-dimensional micro-structured components |
| 01/19/2005 | EP1498385A2 Fluidic MEMS device |
| 01/19/2005 | CN2672029Y Self assembling structure of micro electronic mechanical system |
| 01/12/2005 | EP1495501A2 Hermetic encapsulation of organic electro-optical elements |
| 01/12/2005 | EP1495493A2 Method for producing a copy protection for an electronic circuit |
| 01/12/2005 | EP1495491A2 Method for connecting substrates and composite element |
| 01/12/2005 | EP1495154A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 01/12/2005 | EP1495153A1 Method for coating metal surfaces and substrate having a coated metal surface |
| 01/12/2005 | EP1494965A2 Method for producing a product having a structured surface |
| 01/12/2005 | EP0871545B1 Silicon-based sleeve devices for chemical reactions |
| 01/12/2005 | CN1562728A Corm micromanipulator based on inertia-friction principle |
| 01/11/2005 | US6841453 Process for manufacturing integrated devices having connections on a separate wafer, and integrated device thus obtained |
| 01/06/2005 | US20050002596 Bonding method |
| 01/04/2005 | US6838302 Method for adjusting a micro-mechanical device |
| 12/29/2004 | EP1399135B1 Methods for hermetically sealing microchip reservoir devices |
| 12/28/2004 | US6835589 Three-dimensional integrated CMOS-MEMS device and process for making the same |
| 12/28/2004 | US6835587 Single crystal, tunneling and capacitive, three-axes sensor using eutectic bonding and a method of making same |
| 12/23/2004 | US20040260418 Customized microfluidic device design, ordering, and manufacturing |
| 12/23/2004 | US20040256686 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |
| 12/22/2004 | EP1488448A2 Field-assisted fusion bonding |
| 12/21/2004 | US6834154 Tooling fixture for packaged optical micro-mechanical devices |
| 12/21/2004 | US6832716 Bonded products and methods of fabrication therefor |
| 12/16/2004 | WO2004108588A1 Optical microelectromechanical structure |
| 12/16/2004 | CA2529935A1 Optical microelectromechanical structure |
| 12/15/2004 | EP1486455A1 Micro fluid system support unit and manufacturing method thereof |
| 12/08/2004 | EP1484796A2 Semiconductor device and manufacturing method of the same |
| 12/07/2004 | US6827250 Methods for hermetically sealing microchip reservoir devices |
| 12/02/2004 | US20040238966 Solder, microelectromechanical component and device, and a process for producing a component or device |
| 12/02/2004 | DE10321568A1 Component module for microtechnology especially for manufacturing analysis devices, has two components connected by a stretchable connector |
| 11/25/2004 | US20040232500 Sensor arrangement,in particular a micro-mechanical sensor arrangement |
| 11/24/2004 | CN1548360A Method of utilizing pre-etched glass base material to reduce post-release time |
| 11/23/2004 | US6820988 Bulk silicon mirrors with hinges underneath |
| 11/23/2004 | US6820797 System and method for seal formation |
| 11/18/2004 | WO2004099066A1 Wafer bonding compatible with bulk micro-machining |
| 11/11/2004 | DE10314875A1 Temperature-resistant electronic sensor/actuator has element fixed in housing on stack of layers with different thermal expansion coefficient to stepwise adapt element coefficient to that of housing |
| 11/10/2004 | EP1474237A1 Methods of making devices by stacking sheets and processes of conducting unit operations using such devices |
| 11/04/2004 | WO2004015764A3 Vertical system integration |
| 11/04/2004 | US20040219072 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection |
| 11/04/2004 | US20040216989 MEMS switch having hexsil beam and method of integrating MEMS switch with a chip |
| 11/03/2004 | CN1173827C Method for attaching micromechanical device to manifold, and fluid control system produced thereby |
| 10/27/2004 | CN1173398C Micro-relay |
| 10/21/2004 | US20040209393 Functional device, method of manufacturing therefor and driver circuit |
| 10/20/2004 | EP1467949A1 A microfluidic device and its manufacture |
| 10/20/2004 | EP1467947A1 Method and zone for sealing between two microstructure substrates |
| 10/20/2004 | EP1467945A2 Covered microchamber structures |
| 10/19/2004 | US6806543 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection |
| 10/07/2004 | WO2004000719A1 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same |
| 10/07/2004 | US20040195638 Micromechanical component as well as a method for producing a micromechanical component |
| 09/30/2004 | US20040189143 Electrostatic driving device and manufacturing method of the same |
| 09/30/2004 | US20040188618 Infrared sensor |
| 09/30/2004 | DE10309677A1 Thin-film solder for connecting micro-electromechanical components, comprises mixture of gold and bismuth, e.g. in eutectic mixture |
| 09/28/2004 | US6796179 Split-resonator integrated-post MEMS gyroscope |
| 09/23/2004 | DE10330739A1 A micromechanical module with a sensor, a control-and-evaluation switch and a semiconductor chip useful for computer microprocessors and other electronic equipment involving semiconductor chips |
| 09/22/2004 | EP1169891B1 Flexible microsystem and building techniques |