| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 03/04/2009 | EP2029475A1 Microstructure, micromachine, and manufacturing method of microstructure and micromachine |
| 03/03/2009 | US7497846 Hermetically sealed microchip reservoir devices |
| 02/25/2009 | EP1486455B1 Support unit for microfluidic system and manufacturing method |
| 02/24/2009 | US7495348 Process for producing copy protection for an electronic circuit |
| 02/24/2009 | CA2394136C Bonded products and methods of fabrication therefor |
| 02/11/2009 | EP2022594A1 Device by cold junction, process for manufacturing device, and cold junction apparatus |
| 02/11/2009 | EP2022104A1 A bonding tool and method |
| 02/11/2009 | CN101362586A MEMS encapsulation method |
| 02/10/2009 | US7489837 Optical microelectromechantical structure |
| 02/05/2009 | WO2009016862A1 Composite substrate, functional device utilizing the same, and process for producing them |
| 02/04/2009 | CN100459031C Silica micro-mechanical two-dimensional obliquity sensor silicon chip and production method |
| 01/29/2009 | DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed |
| 01/27/2009 | US7482900 Micro relay |
| 01/22/2009 | US20090019691 Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
| 01/21/2009 | EP2016024A2 Forcing gas trapped between two components into cavities |
| 01/21/2009 | CN101350320A Crystal round stage encapsulation object and method for forming the same |
| 01/08/2009 | DE102007029722A1 Micromechanical component has two elements, where integrated circuit and electrical contact are formed on upper side of former element, and lower side of latter element is fixed on upper side of former element |
| 01/07/2009 | CN101337652A Packaging of contact surface of sensor element and packaging method thereof |
| 01/06/2009 | CA2400025C Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby |
| 01/02/2009 | DE10291877B4 Mikroschalter und Verfahren zum Herstellen eines Mikroschalters Micro-switch and method of manufacturing a micro-switch |
| 12/31/2008 | CN101332974A Thermal linking device |
| 12/31/2008 | CN101332973A Anode linking device |
| 12/24/2008 | WO2008156058A1 Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device |
| 12/24/2008 | WO2008156056A1 Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device |
| 12/24/2008 | CN101327906A Graph silicon chip with microcavity vacuum bonding method |
| 12/24/2008 | CN100445195C Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
| 12/18/2008 | DE19957111B4 Halbleitervorrichtung mit flacher Schutzklebstofffolie und Herstellungsverfahren dafür A semiconductor device with a flat protection adhesive film and production method thereof |
| 12/17/2008 | CN201165468Y MEMS microphone encapsulation structure |
| 12/17/2008 | CN101323429A Method for encapsulating microstructure device by means of ultrasonic effect |
| 12/11/2008 | DE102008007682A1 Modul mit einem Mikro-Elektromechanischen Mikrofon Module with a micro-electro-mechanical microphone |
| 12/11/2008 | DE102007024903A1 Vorrichtung mit Sandwichstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung A device having a sandwich structure for the detection of thermal radiation, methods of making and using the apparatus |
| 11/27/2008 | WO2008141359A1 Method of removing mems devices from a handle substrate |
| 11/26/2008 | CN101312904A Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
| 11/26/2008 | CN100438334C Micromechanical electrostatic resonator |
| 11/26/2008 | CN100436306C Touch sensor and its manufacture method |
| 11/25/2008 | US7456497 Electronic devices and its production methods |
| 11/20/2008 | US20080284611 Vertical system integration |
| 11/19/2008 | CN100434354C Round piece class airtight packing technique having low depth-width ratio through hole |
| 11/13/2008 | WO2008136316A1 Laminated substrate structure and method for manufacturing the same |
| 11/12/2008 | CN101301993A MEMS device vacuum encapsulation method |
| 11/12/2008 | CN100433302C Semiconductor micro device |
| 11/12/2008 | CN100433292C An integrated structure and method for fabricating the same |
| 11/06/2008 | US20080272447 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |
| 11/06/2008 | DE102008015709A1 Elektrische Einrichtung mit Abdeckung An electrical device with cover |
| 11/05/2008 | EP1824779B1 Device and method for hermetically sealing a cavity in an electronic component |
| 10/30/2008 | US20080268669 Transferable Micro Spring Structure |
| 10/29/2008 | EP1985579A2 Connecting scheme for the orthogonal assembly of microstructures |
| 10/22/2008 | EP1983584A2 Piezoelectric macro-fiber composite actuator and manufacturing method |
| 10/22/2008 | CN201138866Y Silicon microphone with improved structure |
| 10/16/2008 | WO2008123165A1 Functional element package and fabrication method therefor |
| 10/16/2008 | US20080254572 Vertical system integration |
| 10/16/2008 | US20080251941 Vertical system integration |
| 10/15/2008 | EP1979927A1 Redeposition technique for membrane attachment |
| 10/15/2008 | EP1495153B1 Method for coating metal surfaces |
| 10/08/2008 | CN201128674Y Upper cover structure for encapsulation of microcomputer electric components |
| 10/08/2008 | CN101282594A Encapsulation structure for Micro-electromechanical microphone with two-sided mounting-pasted electrode |
| 10/08/2008 | CN101279711A Method of fabricating a micromechanical structure out of two-dimensional elements and micromechanical device |
| 10/07/2008 | US7432587 Integrated device including connections on a separate wafer |
| 10/02/2008 | US20080237591 Vertical system integration |
| 09/30/2008 | CA2225390C Silicon-based sleeve devices for chemical reactions |
| 09/25/2008 | DE10023034B4 Transportvorrichtung für einen sphärischen Körper Transport device for a spherical body |
| 09/23/2008 | US7427808 Micro-sensor |
| 09/18/2008 | WO2008091221A3 Micropackaging method and devices |
| 09/18/2008 | DE102007012464A1 Micromechanical or electronic component producing method, involves providing molding tool for relative positioning between substrate material and cover material during attachment of substrate material and cover material |
| 09/11/2008 | DE102007037788A1 Device for coupling of lines to micro-fluidic chip, has sleeve-shaped coupling element, which is connected with line, where sleeve-shaped coupling element is made of ferromagnetic material and is mounted on micro-fluidic chip |
| 09/10/2008 | CN101261964A Functional device package |
| 09/10/2008 | CN101261963A Miniature electronic part and its encapsulation part and making method |
| 09/10/2008 | CN101261941A Method for making encapsulation cover of optical part |
| 09/10/2008 | CN101259951A Method for manufacturing wafer-stage glass micro-cavity |
| 09/09/2008 | US7422929 Wafer-level packaging of optoelectronic devices |
| 09/09/2008 | US7422928 Process for fabricating a micro-electro-mechanical system with movable components |
| 09/04/2008 | WO2008105068A1 Bonded-glass structure, article having bonded-glass structure, and method of bonding glass |
| 09/03/2008 | CN101254894A Packaged minisize moveable device and method for manufacturing same |
| 09/03/2008 | CN101254892A Semiconductor device and manufacturing method thereof |
| 09/03/2008 | CN100415634C Electronic device with covering layer in cavity, and manufacture method thereof |
| 08/28/2008 | DE102007008518A1 Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips |
| 08/27/2008 | EP1509802B1 Bulk silicon mirrors with hinges underneath |
| 08/27/2008 | CN101249936A Packaging conformation for micro electromechanical systems and method for manufacturing same |
| 08/26/2008 | US7416910 Pyramid socket suspension |
| 08/20/2008 | CN101246811A Process for wafer bonding |
| 08/20/2008 | CN101244802A High depth-width ratio micro-machining based on silicon-silicon linking |
| 08/20/2008 | CN101244800A Power overlay structure and method for making the same |
| 08/14/2008 | DE19680763B4 Microelectromechanical device useful for data storage applications - has cantilevered beam free to move above substrate and carrying insulated conductors is able to position tip on beam in contact with one conductor and move parallel to and perpendicular to substrate plane |
| 08/13/2008 | CN101239699A Semiconductor device manufacturing method |
| 08/13/2008 | CN101239697A Vertical integration microelectron mechanical structure, implementing method and system thereof |
| 08/13/2008 | CN101239285A Passive microfluid mixer and packaging method thereof |
| 08/12/2008 | US7410816 Method for forming a chamber in an electronic device and device formed thereby |
| 08/12/2008 | US7410590 Transferable micro spring structure |
| 08/07/2008 | DE19911916B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit Schutzlage A process for producing a semiconductor device with protective layer |
| 08/06/2008 | CN101234747A Electromechanical system packaging construct and manufacturing method thereof |
| 08/06/2008 | CN101234746A Apparatus and method for housing micromechanical systems |
| 08/06/2008 | CN101234745A MEMS device airtightness packaging method |
| 07/31/2008 | WO2008091221A2 Micropackaging method and devices |
| 07/31/2008 | WO2008051781A3 Vertically integrated mems |
| 07/31/2008 | DE102007002725A1 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente Housing for mobile applications used in micro-mechanical and micro-optical components |
| 07/30/2008 | CN201094163Y Condenser microphone using ceramic packing |
| 07/30/2008 | CN101233073A Micro electro-mechanical system packaging and interconnect |
| 07/29/2008 | US7405466 Method of fabricating microelectromechanical system structures |
| 07/24/2008 | WO2008088069A1 Fine structure body integrating method, fine structure body and micro device |
| 07/24/2008 | WO2008088068A1 Fine structure body manufacturing method, fine structure body and micro device |