Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
06/2006
06/08/2006DE102005025667A1 Sensoranordnung mit einem umgossenen Signalausgabeabschnitt Sensor assembly having a overmolded signal output section
06/08/2006DE102004058815A1 Chipmodul und Verfahren zu dessen Herstellung Chip module and method of producing the
06/07/2006EP1663850A1 Process for fabricating a micro-electro-mechanical system with movable components
06/01/2006US20060113649 Light transmissive cover, device provided with same and methods for manufacturing them
06/01/2006DE102005056361A1 Halbleitersensor für eine dynamische Grösse Semiconductor sensor for dynamic size
05/2006
05/24/2006EP1658344A1 Microsystem component and method for gluing microcomponents to a substrate
05/24/2006EP1181716A4 Microwave bonding of mems component
05/18/2006US20060102862 Electrostatic sealing device and method of use thereof
05/17/2006CN1256271C Bulb micromanipulator based on inertia-friction principle
05/11/2006DE10060433B4 Verfahren zur Herstellung eines Fluidbauelements, Fluidbauelement und Analysevorrichtung A method for producing a fluid device, the fluid device and analysis device
05/10/2006CN1771575A Micro relay
05/09/2006US7041208 Separation proteins
05/04/2006DE102004052688A1 Luminescence diode chip, e.g. LED or laser diode (LD), containing, at chip flank, element suitable for mechanical connectoin between luminescence diode chip and another body, for LED, LD, etc. low-cost manufacture and operation
05/04/2006DE102004011035B4 Verfahren zur Prüfung der Dichtigkeit von Scheibenbondverbindungen und Anordnung zur Durchführung des Verfahrens Method for testing the tightness of bonding connections and disc arrangement for performing the method
04/2006
04/27/2006DE102004051468A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
04/20/2006DE19616014B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices
04/20/2006DE19615329B4 Verfahren zur Herstellung einer verformbaren Spiegelvorrichtung A method of manufacturing a deformable mirror device
04/20/2006DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module
04/18/2006US7029986 Bonded products and methods of fabrication therefor
04/12/2006CN1250445C Microcomputer electric component chips level packaging apparatus
04/11/2006US7026698 Functional device, method of manufacturing therefor and driver circuit
04/11/2006US7025619 Sockets for microassembly
04/11/2006US7024934 Vibrating beam accelerometer
04/06/2006DE102004045854A1 Semiconductor sensor, has hollow housing made up of plastic, and semiconductor sensor chip arranged on chip carrier in housing, where thermal characteristics of chip carrier correspond to semiconductor material of sensor chip
04/05/2006CN1755497A Method and system for packaging a display
04/05/2006CN1249760C Static relay and communication device using static relay
04/04/2006US7022245 Fabrication of a reflective spatial light modulator
03/2006
03/30/2006WO2006032895A1 Gyroscopes and accelerometers
03/27/2006CA2519741A1 System and method of transmitting video data
03/23/2006DE102004011667B4 Vorrichtung mit einem Halbleiterchip und einem mikrofluidischen System und Verfahren zur Herstellung Device having a semiconductor chip and a microfluidic system and method for producing
03/22/2006EP1638153A2 Piezoelectric/electrostrictive device and method of manufacturing same
03/22/2006EP1636131A1 Optical microelectromechanical structure
03/15/2006CN1747165A Electronic device and method of manufacturing the same
03/09/2006US20060051584 Process for producing a product having a structured surface
03/09/2006DE20321146U1 Gluing microcomponents to substrate for assembling electronic or mechanical microsystems involves initial fusing of precise pattern of hot-melt adhesive
03/09/2006DE102004043120A1 Mikromechanisches Bauelement mit Hohlraum und Herstellungsverfahren für ein solches Bauelement Micromechanical component with cavity and manufacturing method for such a device
03/02/2006DE102004041309A1 Manufacture of heat transmission block for a fuel cell with micro-structured panels soldered under pressure
03/01/2006CN1740788A Method for bonding two solid surfaces through surface assemblying active functional group
02/2006
02/28/2006US7005643 Infrared sensor
02/28/2006US7005078 Micromachined fluidic device and method for making same
02/22/2006CN1737570A Method for bonding two solid plane by surface atom transition free radical aggregation
02/16/2006WO2005069797A3 Microfluidic structures and methods for integrating a functional component into a microfluidic device
02/09/2006US20060030074 Method for connecting substrate and composite element
02/09/2006US20060027523 Micromachined fluidic device and method for making same
02/08/2006EP1623761A1 Microchannel devices made by stacking sheets
02/07/2006US6995495 2-D actuator and manufacturing method thereof
02/07/2006US6995440 MEMS switch having hexsil beam and method of integrating MEMS switch with a chip
02/02/2006US20060022784 Microtechnological device comprising magnetically assembled structures and assembly process
02/01/2006EP1621516A1 Microtechnological device with magnetically assembled structures and assembling method
02/01/2006EP1509802A4 Bulk silicon mirrors with hinges underneath
01/2006
01/26/2006US20060016055 Piezoelectric composite apparatus and a method for fabricating the same
01/26/2006DE19960949B4 Mikromotor zur Erzeugung einer schrittweisen Bewegung von Mikrobauteilen Micro motor for generating a gradual movement of micro-components
01/19/2006US20060014358 Method for microfabricating structures using silicon-on-insulator material
01/19/2006US20060012849 Method of producing a movable lens structure for a light shaping unit
01/19/2006DE102004051361A1 Verfahren und System zum hermetischen Abdichten von Packungen für optische Bauelemente Method and system for hermetic sealing of packings for optical components
01/19/2006DE102004031318A1 Premold housing for receiving a component, useful particularly for preparing microelectronic or sensor modules, comprises housing body and metal lead frame
01/12/2006US20060006511 Ultrathin module for semiconductor device and method of fabricating the same
01/12/2006DE102004030619A1 Verfahren zum Verbinden von Werkstücken aus Kunststoff A method for joining workpieces made from plastic
01/11/2006CN1719590A Ultrathin module for semiconductor device and method of fabricating the same
01/05/2006WO2006000273A1 Method for joining plastic workpieces
01/03/2006US6981522 multiple layers defining at least three functional features: mixers, separation channels, reaction chambers, analysis windows; multiple chemical and biological analyses in parallel on a single device;
12/2005
12/29/2005WO2005123628A1 Anodic bonding process for ceramics
12/21/2005EP1453606B1 Microfluidic devices with distributing inputs
12/21/2005CN1711210A An integrated structure and method for fabricating the same
12/15/2005US20050274183 Integral resonator gyroscope
12/15/2005DE102005011863A1 Halbleitermikrovorrichtung Semiconductor micro device
12/14/2005EP1605487A1 Micro relay
12/14/2005EP1444543A4 Digital optical switch apparatus and process for manufacturing same
12/07/2005EP1602896A2 Gyro-sensor comprising a plurality of component units, and fabricating method thereof
12/07/2005EP1602626A2 Method and system for manufacturing laminated microstructures
12/01/2005WO2005114721A1 Encapsulation method and device which is intended, for example, for micromechanical devices
12/01/2005US20050262941 Gyro-sensor comprising a plurality of component units, and fabricating method thereof
11/2005
11/29/2005US6970628 Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit
11/24/2005US20050260828 Bonding method, bonding apparatus and sealing means
11/24/2005US20050258516 Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same
11/23/2005EP1474237B1 Methods of making devices by stacking sheets and processes of conducting unit operations using such devices
11/23/2005CN1228236C Micro switch
11/17/2005US20050255666 Method and structure for aligning mechanical based device to integrated circuits
11/17/2005US20050253240 Micromechanical component and corresponsing production method
11/17/2005US20050253208 Semiconductor micro device
11/17/2005DE102004020173A1 Mikrostrukturiertes Bauelement und ein Verfahren zum Herstellen eines mikrostrukturierten Bauelements Microstructured component and a method for producing a microstructured component
11/16/2005CN1697160A Semiconductor micro device
11/15/2005US6964882 Fabricating complex micro-electromechanical systems using a flip bonding technique
11/10/2005US20050250237 Microstructured component and a method for producing a microstructured component
11/10/2005US20050249637 Micro fluid system support and manufacturing method thereof
11/09/2005EP1525085B1 Method and device for forming a body having a three-dimensional structure
11/08/2005US6962514 Method and apparatus used in fabrication of MEMS stacks
11/03/2005WO2005104257A1 Micro-electromechanical device
11/03/2005WO2005103780A1 Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit
10/2005
10/27/2005WO2005100236A1 Method of packaging mems device in vacuum state and mems device vacuum-packaged using the same
10/27/2005US20050236682 Method of manufacturing MEMS device
10/27/2005US20050236562 Assembly with self-alignment features to position a cover on a substrate that supports a micro component
10/26/2005EP1283957B1 Micromachined fluidic device and method for making same
10/25/2005US6958285 Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings
10/20/2005US20050233543 Method of fabricating microelectromechanical system structures
10/20/2005US20050233503 Method for the production of structured layers on substrates
10/20/2005US20050233064 Method of manufacturing microstructure and manufacturing system for the same
10/20/2005US20050232547 Active optical alignment and attachment thereto of an optical component with an optical element formed on a planar lightwave circuit
10/20/2005US20050232545 Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit
10/20/2005US20050230767 Fabrication and integration of polymeric bioMEMS
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